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A7670 Series Hardware Design - V1.00

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0% found this document useful (0 votes)
992 views61 pages

A7670 Series Hardware Design - V1.00

Uploaded by

Kino Gao
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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A7670 Series

Hardware Design
LTE Module

SIMCom Wireless Solutions Limited


Building B, SIM Technology Building, No.633, Jinzhong Road
Changning District, Shanghai P.R.China
Tel: 86-21-31575100
[email protected]
www.simcom.com
A7670 Series Hardware Design V1.00

Document Title: A7670 Series Hardware Design


Version: V1.00
Date: 2020-06-09
Status: Released

GENERAL NOTES

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT


APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.
THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO
SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH
FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE
CUSTOMER’S POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT
DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY
OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS
SUPPLIED HEREIN ARE SUBJECT TO CHANGE.

COPYRIGHT

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY


OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT,
ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE
PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY
TECHNICAL INFORMATION ,INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A
PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO
CHANGE WITHOUT NOTICE AT ANY TIME.

SIMCom Wireless Solutions Limited


Building B, SIM Technology Building, No.633 Jinzhong Road, Changning District, Shanghai P.R.China
Tel: +86 21 31575100
Email: [email protected]

For more information, please visit:


https://www.simcom.com/download/list-863-en.html

For technical support, or to report documentation errors, please visit:


https://www.simcom.com/ask/or email to: [email protected]

Copyright © 2020 SIMCom Wireless Solutions Limited All Rights Reserved.

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A7670 Series Hardware Design V1.00

Version History
Date Version Description of change Author
Zhongyi.liu
2020-06-09 1.00 Original
Peilin.yue

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A7670 Series Hardware Design V1.00

Contents
Contents ................................................................................................................................................4

Table Index ............................................................................................................................................6

Figure Index ..........................................................................................................................................8

1 Introduction ...................................................................................................................................9
1.1 Product Outline ........................................................................................................................... 9
1.2 Hardware Interface Overview ................................................................................................... 10
1.3 Hardware Block Diagram.......................................................................................................... 10
1.4 Functional Overview ................................................................................................................. 11

2 Package Information ...................................................................................................................13


2.1 Pin Assignment Overview ......................................................................................................... 13
2.2 Pin Description ......................................................................................................................... 15
2.3 Mechanical Information ............................................................................................................ 19
2.4 Footprint Recommendation ...................................................................................................... 20
2.5 Recommend Stencil Size ......................................................................................................... 21

3 Interface Application ...................................................................................................................22


3.1 Power Supply ........................................................................................................................... 22
3.1.1 Power Supply Design Guide ............................................................................................. 23
3.1.2 Recommended Power Supply Circuit ............................................................................... 24
3.1.3 Voltage Monitor ................................................................................................................. 25
3.2 Power On/ Off And Reset ......................................................................................................... 25
3.2.1 Power on ........................................................................................................................... 25
3.2.2 Power off ........................................................................................................................... 26
3.2.3 Reset Function .................................................................................................................. 28
3.3 UART Interface ......................................................................................................................... 28
3.4 USB Interface ........................................................................................................................... 30
3.4.1 USB Reference Design ..................................................................................................... 30
3.4.2 USB_BOOT Interface........................................................................................................ 31
3.5 SIM Interface ............................................................................................................................ 32
3.5.1 SIM Application Guide ....................................................................................................... 32
3.5.2 Recommend USIM Card Holder ....................................................................................... 33
3.6 PCM Interface .......................................................................................................................... 34
3.6.1 PCM Sequence ................................................................................................................. 34
3.6.2 PCM Reference Design(Software development) .............................................................. 34
3.7 GPIO Interface ......................................................................................................................... 35
3.8 I2C Bus..................................................................................................................................... 35
3.9 Network status .......................................................................................................................... 36
3.10 Other interface .......................................................................................................................... 37
3.10.1 ADC ................................................................................................................................ 37
3.10.2 LDO ................................................................................................................................ 38

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4 RF Specifications ........................................................................................................................39
4.1 GSM/LTE RF Specifications ..................................................................................................... 39
4.2 GSM/LTE Antenna Design Guide ............................................................................................. 41
4.3 Antenna Requirements ............................................................................................................. 42

5 Electrical Specifications .............................................................................................................43


5.1 Absolute maximum ratings ....................................................................................................... 43
5.2 Operating conditions................................................................................................................. 43
5.3 Operating Mode ........................................................................................................................ 44
5.3.1 Operating Mode Definition ................................................................................................ 44
5.3.2 Sleep mode ....................................................................................................................... 45
5.3.3 Minimum functionality mode and Flight mode ................................................................... 46
5.4 Current Consumption ............................................................................................................... 46
5.5 ESD Notes................................................................................................................................ 47

6 SMT Production Guide ................................................................................................................49


6.1 Top and Bottom View of A7670 ................................................................................................ 49
6.2 Label Information ...................................................................................................................... 50
6.3 Typical SMT Reflow Profile ....................................................................................................... 51
6.4 Moisture Sensitivity Level (MSL) .............................................................................................. 51

7 Packaging ....................................................................................................................................53
7.1 Tray packaging ......................................................................................................................... 53

8 Appendix ......................................................................................................................................56
8.1 Coding Schemes and Maximum Net Data Rates over Air Interface ......................................... 56
8.2 Related Documents .................................................................................................................. 57
8.3 Terms and Abbreviations .......................................................................................................... 59
8.4 Safety Caution .......................................................................................................................... 61

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Table Index

Table 1: Module frequency bands ................................................................................................................. 9


Table 2: General features............................................................................................................................ 11
Table 3: Pin Description .............................................................................................................................. 14
Table 4: Pin parameter abbreviation ........................................................................................................... 15
Table 5: IO parameters definition ................................................................................................................ 15
Table 6: Pin description ............................................................................................................................... 16
Table 7: VBAT pins electronic characteristic ............................................................................................... 22
Table 8: Recommended TVS diode list ....................................................................................................... 23
Table 9: Power on timing and electronic characteristic ............................................................................... 26
Table 10: Power off sequence parameters .................................................................................................. 27
Table 11: RESET pin electronic characteristic ............................................................................................ 28
Table 12: USB_BOOT description .............................................................................................................. 31
Table 13: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) ................................................ 32
Table 14: USIM electronic characteristic 3.0V mode (USIM_VDD=3V) ...................................................... 32
Table 15: Amphenol USIM socket pin description ....................................................................................... 33
Table 16: PCMformat .................................................................................................................................. 34
Table 17: Standard GPIO Resources .......................................................................................................... 35
Table 18: 2G/3G mode NETLIGHT pin status ............................................................................................. 37
Table 19: LTE mode NETLIGHT pin status ................................................................................................. 37
Table 20: ADC electronic characteristics ..................................................................................................... 37
Table 21: VDD_1V8 Electrical characteristics ............................................................................................. 38
Table 22: Conducted transmission power ................................................................................................... 39
Table 23: 2G/3G frequency band information ............................................................................................. 40
Table 24: E-UTRA operating bands ............................................................................................................ 40
Table 25: Conducted receive sensitivity ...................................................................................................... 40
Table 26: Reference sensitivity (QPSK) ...................................................................................................... 40
Table 27: Traceloss ..................................................................................................................................... 41
Table 28: Recommended TVS .................................................................................................................... 42
Table 29:GSM/LTE antennas ...................................................................................................................... 42
Table 30: Absolute maximum ratings .......................................................................................................... 43
Table 31: Recommended operating ratings ................................................................................................ 43
Table 32: 1.8V Digital I/O characteristics* ................................................................................................... 43
Table 33: Operating temperature ................................................................................................................ 44
Table 34: Operating mode Definition ........................................................................................................... 44
Table 35: Current consumption on VBAT Pins (VBAT=3.8V) ...................................................................... 46
Table 36: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.) ...................... 47
Table 37: The description of label information ............................................................................................. 50
Table 38: Moisture Sensitivity Level and Floor Life ..................................................................................... 51
Table 39: Tray size ...................................................................................................................................... 54
Table 40: Small Carton size ........................................................................................................................ 54
Table 41: Big Carton size ............................................................................................................................ 55

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Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface ............................................ 56
Table 43: Related Documents ..................................................................................................................... 57
Table 44: Terms and Abbreviations ............................................................................................................. 59
Table 45: Safety Caution ............................................................................................................................. 61

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A7670 Series Hardware Design V1.00

Figure Index

Figure 1: A7670 block diagram ................................................................................................................... 11


Figure 2: Pin assignment overview ............................................................................................................. 13
Figure 3: Dimensions (Unit: mm) ................................................................................................................ 19
Figure 4: Footprint recommendation (Unit: mm) ......................................................................................... 20
Figure 5: Recommend stencil dimension (Unit: mm) .................................................................................. 21
Figure 6: VBAT voltage drop during burst emission (EDGE/GPRS) ........................................................... 22
Figure 7: Power supply application circuit ................................................................................................... 23
Figure 8: Linear regulator reference circuit ................................................................................................. 24
Figure 9: power supply reference circuit ..................................................................................................... 24
Figure 10: Reference power on/off circuit ................................................................................................... 25
Figure 11: Power on timing sequence ........................................................................................................ 26
Figure 12: Power off timing sequence ........................................................................................................ 27
Figure 13: Reference reset circuit ............................................................................................................... 28
Figure 14: Serial port connection diagram (NULL mode) ............................................................................ 29
Figure 15: Triode level conversion circuit.................................................................................................... 29
Figure 16: USB circuit diagram ................................................................................................................... 30
Figure 17: Reference USB_BOOT circuit ................................................................................................... 31
Figure 18: Force-download port .................................................................................................................. 31
Figure 19: SIM interface reference circuit ................................................................................................... 32
Figure 20: Amphenol C707 10M006 512 USIM card socket ....................................................................... 33
Figure 21: PCMsequence ........................................................................................................................... 34
Figure 22: PCM reference circuit ................................................................................................................ 35
Figure 23: I2C reference circuit................................................................................................................... 36
Figure 24: NETLIGHT reference circuit ...................................................................................................... 36
Figure 25: Antenna matching circuit (MAIN_ANT) ...................................................................................... 41
Figure 26: Top and bottom view of A7670 .................................................................................................. 49
Figure 27: Label information ....................................................................................................................... 50
Figure 28: The ramp-soak-spike reflow profile of A7670............................................................................. 51
Figure 29: packaging diagram .................................................................................................................... 53
Figure 30: Tray drawing .............................................................................................................................. 53
Figure 31: Small carton drawing ................................................................................................................. 54
Figure 32: Big carton drawing ..................................................................................................................... 54

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1 Introduction
This document describes the hardware interface of the module, which can help users quickly understand
the interface definition, electrical performance and structure size of the module. Combined with this
document and other application documents, users can understand and use A7670 module to design and
develop applications quickly.SIMcom provides a set of evaluation boards to facilitate A7670 module
testing and use. The evaluation board tools include an EVB board, a USB cable, an antenna, and other
peripherals.

1.1 Product Outline

Aimed at the global market, the module support GSM, LTE-TDD and LTE-FDD. Users can choose the
module according to the wireless network configuration. The supported radio frequency bands are
described in the following table.

Table 1: Module frequency bands


Standard Frequency A7670C A7670E A7670SA
GSM850MHz 
EGSM900MHz   
GSM
DCS1800MHz   
PCS1900MHz 
LTE-FDD B1   
LTE-FDD B2 
LTE-FDD B3   
LTE-FDD B4 
LTE-FDD B5   
LTE-FDD
LTE-FDD B7  
LTE-FDD B8   
LTE-FDD B20 
LTE-FDD B28 
LTE-FDD B66 
LTE TDD B34 
LTE TDD B38 
LTE-TDD LTE TDD B39 
LTE TDD B40 
LTE TDD B41 
Category CAT1 CAT1 CAT1

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With a small physical dimension of 24*24*2.5 mm and with the functions integrated, the module can meet
almost any space requirement in users’ applications, such as smart phone, PDA, industrial handhold,
machine-to-machine and vehicle application, etc.
A7670 provides 88 pins, including 68 LGA pins in the outer ring and 20 LGA pins in the inner ring. This
document will introduce all the functional pins.

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:


● Power Supply
● USB 2.0 Interface
● ThreeUART Interface, one full function serial port, one ordinary serial port and one debug serial port
● USIM Interface
● ADC Interface
● LDO Power Output
● PCM Interface
● I2C Interface
● General input and output interfaces (GPIO)
● AntennaInterface
● USB_BOOT interface
● Network status indication interface
● Module operation status indication interface

1.3 Hardware Block Diagram

The block diagram of the A7670 module is shown in the figure below.

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Figure 1: A7670 block diagram

1.4 Functional Overview

Table 2: General features


Feature Implementation
Power supply VBAT: 3.4V ~4.2V,Recommended VBAT: 3.8V
Power saving Current in sleep mode : TBD
Radio frequency bands Please refer to the table 1
GSM/GPRS power class:
●EGSM900: 4 (33dBm±2dB)
●DCS1800: 1 (30dBm±2dB)
Transmitting power EDGE power class:
●EGSM900: E2 (27dBm±3dB)
●DCS1800 : E1 (26dBm+3dB/-4dB)
LTE power class: 3 (23dBm±2.7dB)
GPRS multi-slot class 12
EDGE multi-slot class 12
Data Transmission
LTE-FDD CAT1:10 Mbps (DL),5 Mbps (UL)
Throughput

LTE-TDD CAT1 :10 Mbps (DL),5 Mbps (UL)

Antenna GSM/LTE Main antenna interface


SMS MT,MO, CB, Text , PDU mode

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Short Message(SMS)storage device: USIM Card, CB does not


support saving in SIM Card
Support CS domain and PS domain SMS
USIM interface Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
USIM application toolkit
Support USAT
Phonebook management Support phonebook types : SM/FD/ON/AP/SDN
Audio feature PCM Digital Audio interface
●Full function serial port
Baud rate support from 300bps to 3686400bps
AT command and data can be sent through serial port
Support RTS/CTS Hardware flow control(Debugging,Currently not
supported)
UART interface Support serial port multiplexing function conforming to GSM 07.10
protocol
●Debug serial port
Support debug usage
●UART3 serial port
Ordinary serial port
USB 2.0 compliant, host mode not supported.
USB This interface can be used for AT command sending, data
transmission, software debugging and upgrading.
Firmware upgrade Firmware upgrade over USB interface
Size:24*24*2.5m
Physical characteristics
Weight:3.08g(Typical)
Normal operation temperature: -30°C to +80°C
Temperature range Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C

NOTE

Module is able to make and receive voice calls, data calls, SMS and make GPRS/LTE traffic in -40℃ ~
+85℃. The performance will be reduced slightly from the 3GPP specifications if the temperature is
outside the normal operating temperature range and still within the extreme operating temperature
range.

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2 Package Information
2.1 Pin Assignment Overview

All functions of the module will be provided through 88 pads that will be connected to the customers’
platform. The following Figure is a high-level view of the pin assignment of the module.

Figure 2: Pin assignment overview

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Table 3: Pin Description


Pin No. Pin name Pin No. Pin name
1 PWRKEY 2 GND
3 DTR 4 RI
5 DCD 6 USB_BOOT●
7 CTS 8 RTS
9 TXD 10 RXD
11 PCM_CLK 12 PCM_SYNC
13 PCM_DIN 14 PCM_OUT
15 VDD_1V8 16 RESET
17 GND 18 GND
19 GPIO1 20 GPIO2
21 GPIO3 22 UART_LOG_RX
23 UART_LOG_TX 24 VBUS
25 ADC 26 NC
27 USB_DP 28 USB_DM
29 GND 30 SIM_VDD
31 SIM_DATA 32 SIM_CLK
33 SIM_RST 34 SIM_DET
35 NC 36 NC
37 I2C_SDA 38 I2C_SCL
39 GND 40 NC
41 NC 42 NC
43 NC 44 NC
45 GND 46 GND
47 NC 48 GPIO9
49 GPIO4(UART3_RX) 50 GPIO5(UART3_TX)
51 NC 52 NETLIGHT
53 NC 54 GND
55 VBAT 56 VBAT
57 VBAT 58 GND
59 GND 60 RF_ANT
61 GND 62 GND
63 GND 64 GND
65 GND 66 STATUS
67 GPIO10 68 GPIO11
69 GND 70 GND
71 GND 72 GND
73 GND 74 GND
75 GND 76 GND

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77 GND 78 GND
79 GND 80 GND
81 GND 82 GND
83 GND 84 GND
85 GND 86 GND
87 GND 88 GND

NOTE

'USB_BOOT' cannot be pulled up before the module powered up, otherwise it will affect the normal
start-up of the module.

2.2 Pin Description

Table 4: Pin parameter abbreviation


Pintype Description
PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down

Table 5: IO parameters definition


Power
Parameter Description Min Typ. Max
domain
VCC=1.8V
VIH High level input VCC * 0.7 1.8V VCC + 0.4
1.8V VIL Low level input -0.4 0V VCC *0.25
Rpu Pull up resistor - 100 KΩ -
Rpd Pull down resistor - 100 KΩ -
VCC = 1.8
1.8V Input leakage
IIL - - 10uA
current

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Output DC Operating Conditions (VCC = 1.8 V Typical)


VOH Output level range VCC - 0.4 - VCC
VOL Output low range - - 0.2V
MFPR[DRIVE] IOH =
= (mA min)
Maximum current
00 1 mA
driving capacity at
01 2 mA
high level output
10 4 mA
11 5 mA

Table 6: Pin description


Pin parameter
Pin name Pin No. Power Description Note
Type
domain
Power supply
A7670 input voltage ranges
from 3.4V to 4.2V, and the
VBAT 55,56,57 - PI
peak current value can reach
2.8A.
1.8V power output, output
If unused, keep it
VDD_1V8 15 - PO current up to 50 mA. It is on
open.
by default.
2,17,18,2
9,39,45,4
6,54,58,5
9,61,62,6
3,64,65,6
9,70,71,7
GND - - Ground
2,73,74,7
5,76,77,7
8,79,80,8
1,82,83,8
4,85,86,8
7,88
System Control
PWRKEY has
Power ON/OFF input, active been internally
low. pulled-up to VBAT
PWRKEY 1 - DI,PU
VIH: 0.7*VBAT with 50KΩ
VIL: 0.5V resistor, default
high.
RESET has been
System reset control input,
pulled-up to VBAT
active low.
RESET 16 - DI,PU with 50KΩ
VIH: 0.7*VBAT
(typical) resistor,
VIL: 0.5V
default high.
USIM interface
USIMbus data, this pin has
USIM_DATA 31 1.8/3.0V I/O,PU been pull-up with 4.7KΩ
resistor to USIM_VDD.
USIM_RST 33 1.8/3.0V I/O,PU USIM bus reset output.

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USIM_CLK 32 1.8/3.0V I/O,PU USIM bus clock output.


USIM card power supply
output, Supports 1.8v/3.0v
USIM_VDD 30 1.8/3.0V PO output according to the card
type, Its output current is up
to 50mA.
USB interface
VBUS 24 - AI Valid USB detection input.
Negative line of the differential,
USB_DN 28 - I/O
bi-directional USB signal.
Positive line of the differential,
USB_DP 27 - I/O
bi-directional USB signal.
Full function UART interface
RTS 8 1.8V DI RTS input
CTS 7 1.8V DO CTS output
RXD 10 1.8V DI Data input
If unused, keep it
TXD 9 1.8V DOH Data output
open.
RI 4 1.8V DO Ringing indicator
DCD 5 1.8V DO Carrier detection
DTR 3 1.8V DI DTE Ready
Debug UART
UART_LOG_T
23 1.8V DOH Log output
XD Default used as
UART_LOG_R debug port.
22 1.8V DI Log input
XD
Serial Port UART3
UART3_TXD 50 1.8V DOH Log output Two-wire serial
UART3_RXD 49 1.8V DI Log input port
I2C interface
If unused, keep it
open. These pins
have been
I2C_SCL 38 1.8V DO I2C clock output
Internally pull-up
to
VDD_1.8.External
power supply
cannot be used to
pull up these pins,
I2C_SDA 37 1.8V I/O I2C data I/O
otherwise there
will be voltage
leakage.
PCM interface
PCM_OUT 14 1.8V DO,PD PCM data output If unused, keep it
PCM_IN 13 1.8V DI,PD PCM data input open.

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PCM_SYNC 12 1.8V I/O,PD PCM SYNC signal


PCM_CLK 11 1.8V DO,PU PCM clock output
GPIO
If unused, keep it
GPIO1 19 1.8V IO,PU General purple I/O
open.
If unused, keep it
GPIO2 20 1.8V IO,PU General purple I/O
open.
If unused, keep it
GPIO3 21 1.8V IO,PD General purple I/O
open.
If unused, keep it
GPIO4 49 1.8V IO,PD General purple I/O
open.
If unused, keep it
GPIO5 50 1.8V IO,PU General purple I/O
open.
If unused, keep it
GPIO9 48 1.8V IO,PU General purple I/O
open.
If unused, keep it
GPIO10 67 1.8V IO,PD General purple I/O
open.
If unused, keep it
GPIO11 68 1.8V IO,PU General purple I/O
open.
ANT interface
MAIN_ANT 60 - AIO Main ANT interface
Other pins
If unused, keep it
ADC1 25 - AI General Purpose ADC
open.
Network registration status
indicator (LED).
NETLIGHT 52 1.8V DO
For more detail, please refer
the chapter 3.12.
STATUS 66 1.8V DI Module status indicator (LED).
Do place 2 test
Firmware download guide points for debug.
control input. when pull-up to DO NOT PULL
USB_BOOT 6 1.8V DI 1.8V and press UP USB_BOOT
PWRKEY,A7670 will access in DURING
USB download mode. NORMAL
POWER UP!

NOTE

Please reserve a test point for USB_BOOT, VDD_EXT and UART_LOG_TX. If there is no USB
connector, please also reserve a test point for USB_VBUS, USB_DP, and USB_DM for Firmware
upgrade.

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2.3 Mechanical Information

The following figureshowsthe package outline drawing ofA7670.

Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

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2.5 Recommend Stencil Size

Recommend stencil thickness≥0.15mm and <0.18mm.

Figure 5: Recommend stencil dimension (Unit: mm)

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3 Interface Application
3.1 Power Supply

A7670 offers four power supply pins (55, 56, 57,) as VBAT power input pin.A7670 use these three pins
supply the internal RF and baseband circuit.
When the module is at the maximum power in GSM TX mode, the peak current can reach 2.8A (peak
current), which results in a large voltage drop on Vbat. In order to ensure that the voltage drop is less than
300mV, the power supply capacity of external power supply must be no less than 2.8A.

577us 4.615ms

IVBAT Burst:2.8A

VBAT
Max:300mV

Figure 6: VBAT voltage drop during burst emission (EDGE/GPRS)

NOTE

Test condition:Vbat power supply 3.8V, Cd = 100 μf tantalum capacitance (ESR equal to 0.7 Ω), CF =
100nF. (Refer to figure 7 for circuit)

Table 7: VBAT pins electronic characteristic


Parameter Description Min Typ. Max Unit
VBAT Module supply voltage 3.4 3.8 4.2 V
IVBAT(peak) Module consumption peak current - 2.8 - A
IVBAT(averag Module average consumption current (normal
e) mode)
Refer to figure 34
Module average consumption current (sleep
IVBAT(sleep)
mode)
IVBAT(power- Module average consumption current(off leakage
- - 20 uA
off) current)

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3.1.1 Power Supply Design Guide

In the user's design, special attention must be paid to the design of the power supply. If the voltage drops
below 3.4V, the RF performance of the module will be affected, The module will shut down if the voltage is
too low. It is recommended to select an LDO or DC-DC chip with an enable pin, and the enable pin is
controlled by the MCU.

NOTE

when the power supply can provide a peak current of 2.8A, the total capacity of the external power
supply capacitance is recommended to be no less than 300uf. If the peak current of 2.8A cannot be
provided, the total capacity of the external capacitance is recommended to be no less than 1000uf to
ensure that the voltage drop on the Vbat pin at any time is not more than 300mV.

It is recommended to place four33PF/10PF/0.1UF/1UF ceramic capacitors near Vbat to improve RF


performance and system stability. At the same time, it is recommended that the Vbat layout routing width
from the power supply on the PCB to the module be at least 2mm. Reference design recommendations are
as follows:

If the Vbat input contains high-frequency interference, it is recommended to add magnetic beads for filtering.
The recommended types of magnetic beads are BLM21PG300SN1D and MPZ2012S221A.

Figure 7: Power supply application circuit

In addition, in order to prevent the damage of A7670 caused by surge and overvoltage, it is recommended
to parallel one TVS on the Vbat pin of the module.

Table 8: Recommended TVS diode list

No. Manufacturer Part Number VRWM Package


1 JCET ESDBW5V0A1 5V DFN1006-2L

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2 WAYON WS05DPF-B 5V DFN1006-2L


3 WILL ESD5611N 5V DFN1006-2L
4 WILL ESD56151W05 5V SOD-323

3.1.2 Recommended Power Supply Circuit

The MCU must have the function to power off the module, but the module can not be shut down or restarted
normally. Only when the module is abnormal and cannot be shut down or restarted normally can the module
be powered off. If you use the module's OPEN LINUX secondary development function, because there is
no MCU, you can add a low-cost single-chip microcomputer to play the role of hardware watchdog to pull
POWERKEY to boot and can be powered off.
It is recommended that a switching mode power supply or a linear regulator power supply is used. The
following figure shows the linear regulator reference circuit:

DC IN U101 MIC29302 VBAT


2 4
Vin Vout
FUSE
+
GND

C101 C102 1
FB 5 R101
100uF 1uF
On/Off
100K R103
470R
+ C103 C104
PWR_CTRL 3
330uF 100nF
R102
47K

Figure 8: Linear regulator reference circuit

The following figure shows the DC-DC regulator reference circuit:

DC IN U 101 LM 2596- ADJ L101 FB 101 VBAT


1
Vin Vout 2
FUSE 100uH 270 ohm@100Mhz
R101
C101 + C102 5
+
GND

On/Off FB 4 D102 2.2K C103 C104


100uF
1uF
PWR_CTRL 3 330uF 100nF
MBR360

R102 1K

Figure 9: power supply reference circuit

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3.1.3 Voltage Monitor

AT command ‘AT+CBC’ can be used to monitor VBAT voltage.


AT command ‘AT+CVALARM’ can be used to set high/low voltage alarm, When the actual voltage
exceeds the preset range, a warning message will be reported through the AT port.
AT command ‘AT+CPMVT’ can be used to set high/low voltage power off, When the actual voltage
exceeds the preset range, the module will shut down automatically.

NOTE

overvoltage alarm and overvoltage shutdown are off by default. For details of at commands, please
refer to document [1].

3.2 Power On/ Off And Reset

3.2.1 Power on

Customer can power on the module by pulling down the PWRKEY pin. This pin has been pulled up inside
the module to Vbat.
It is recommended that when using the module, adding TVS diode at the module pin can effectively
enhance the ESD performance.
The recommended circuit is as follows:

Module
PWRKEY default high VBAT

50K
Turn on/off PWRKEY 1K
impulse Power on/off
logic
4.7K

47K

Figure 10: Reference power on/off circuit

NOTE

Do not parallel capacitors which the value is exceed 10 n F on PWRKEY or RESET pin. It will cause

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module power on automatically when VBAT powered.


It is forbidden to pull down both RESET key and PWRKEY to power on the module at the same time.

VBAT Ton

PWRKEY
(input)
Ton(status)
STATUS
(output)
Ton(uart)

UART Undefined Active

Ton(usb)

USB Undefined Active

VDD_AUX Ton(vdd_aux)

Figure 11: Power on timing sequence

Table 9: Power on timing and electronic characteristic


Symbol Parameter Min. Typ. Max. Unit
The time of active low level impulse of PWRKEY pin
Ton - 50 - ms
to power on module
The time from power-on issue to STATUS pin output
Ton(status) - 11.2 - s
high level(indicating power up ready )
Ton(uart) The time from power-on issue to UART port ready - 11.2 - s
Ton(usb) The time from power-on issue to USB port ready - 9 - s
VIH Input high level voltage on PWRKEY pin 2.94 - VBAT V
VIL Input low level voltage on PWRKEY pin 0 0 0.5 V

3.2.2 Power off

A7670 has the following shutdown methods:


● Power off by pulling the PWRKEY# pin down to a low level.
● Power off Module by AT command ‘AT+CPOF’.
● Over-voltage or under-voltage automatic power off.
● Over-temperature or under-temperature automatic power off.
It is strongly recommended that the customer use PWRKEY or ‘AT+CPOF’ to shut down, and then power off
Vbat (especially when the module does not need to work). In addition, the customer cannot shut down Vbat
by disconnecting it, which may cause damage to flash.

NOTE

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when the temperature exceeds the range of - 30 ~ + 80 ℃, A7670 will report warning information
through AT port. When the temperature exceeds the range of - 40 ~ + 85 ℃, A7670 will shut down
automatically. For a detailed description of ‘AT+ CPOF’ and ‘AT+ CPMVT’, please refer to document [1].

PWRKEY can be used to power off the module, power off sequence see the following figure:

Toff-on
Toff Ton
PWRKEY
(Input)

STATUS
(Output)
Toff(status)

VDD_AUX
(Output)
Toff(VDD_AUX)

Toff(uart)

UART Acticve Undefined

Toff(usb)

USB Acticve Undefined

Figure 12: Power off timing sequence

Table 10: Power off sequence parameters


Symbol Parameter Min. Typ. Max. Unit
Toff Power off low level pulse width 2.5 - - s
Power off time(according to status
Toff(status) - 1.9 - s
interface)
Power off time(according to UART
Toff(uart) - 1.9 - s
interface)
Power off time(according to USB
Toff(usb) - 1.9 - s
interface)
Toff-on Power off - power on buffer time 2 - - s

NOTE

The status pin can be used to judge whether the module is powered on or not. When the module is
powered on and initialization is completed, the status outputs a high level, otherwise the low level will
be maintained all the time.

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3.2.3 Reset Function

A7670 can restart the module by pulling down the reset pin of the module. Reset pin also has the function
of power onwhen PMU first time be given a valid supply voltage (active low, but this key has no shutdown
function). After first time power on, some register of this pin will be written then it willlose this function,so it
is recommended to use PWRKEY to power on the module and RESET key only used as reset function.

A 50K Ω resistor is used to pull-up to VBAT inside the module, so it is no need to add pull-up resistor
outside. The recommended circuit is showed as follows:

Module
VBAT

Treset 50K
Reset impulse RESET 0Ω
Reset logic
4.7K

47K

Figure 13: Reference reset circuit

Table 11: RESET pin electronic characteristic


Symbol Description Min. Typ. Max. Unit
The active low level time impulse on RESET pin to
Treset - 1.5 - s
reset module
VIH Input high level voltage 2.94 - VBAT V
VIL Input low level voltage 0 0 0.5 V

NOTE

it is recommended to use the reset pin only in case of emergency, such as the module is not responding.
The reset time is recommended to be 1.5s.

3.3 UART Interface

A7670 provides three serial ports, the main communication serial port is UART(RTS/CTS flow control
function debugging), one ordinary serial port, and the UART_LOG dedicate to printing log.

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When using 2-wire serial port, please refer to the following connection mode:

Module ( DCE) Host ( DTE)

TXD TXD
RXD RXD
RTS RTS
UART UART
CTS CTS

Figure 14: Serial port connection diagram (NULL mode)

The following figure shows the use of triode for level shifter circuits. The circuit with dotted line can refer to
the circuit with solid line TXD and RXD, and attention shall be paid to the direction of signal.
The recommended triode model is MMBT3904.

VDD_1V8

VIO_MCU
4.7K
1nF

1K~4.7K
470pF_NM

Module Host

TXD MCU_RXD

RXD MCU_TXD
1K~4.7K

4.7K

1nF

VDD_1V8
RTS CTS
CTS RTS
GPIO GPIO

GND GND

Figure 15: Triode level conversion circuit

NOTE

1. The RTS/CTS function debugging, the existing version does not support.
2. A7670 supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 921600, 1842000, 3686400. The default baud rate is 115200bps.
3. Supports adaptive baud rate, refer to AT+IPR and AT+IPREX instructions in the AT Command
Manual, automatic recognition baud rate support: 9600,19200,38400,57600,115200bps.
4. The parasitic capacitance of the transistor will affect the edge of the high-speed digital signal. It is not
recommended to use this circuit when the signal speed is higher than 115200bps.

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3.4 USB Interface

The A7670 contains a USB interface compliant with the USB2.0 specification as a peripheral, but does not
support USB charging function and does not support USB HOST mode.

USB is the main debugging port and software upgrade interface. It is recommended that customers reserve
USB test points during design. If a main control chip is connected, 0R resistors must be reserved for
switching external test points during design, as shown in the figure below.

3.4.1 USB Reference Design

A7670 can be used as a USB slave device. The recommended connection circuit diagram is as follows:

USB_VBUS
Module
0R_NM
Host
0R_NM Test point

USB_VBUS
USB_DN 0R D-

USB_DP 0R D+
GND GND
USB_ID

D3 D1 D2

Figure 16: USB circuit diagram

Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction
capacitance of the ESD component on USB data lines. On USB_VBUS line, customers should pay
attention to the selection of the D3 device when using it. It is recommended to choose an anti-static and
anti-surge two-in-one device.

NOTE

1. The USB data cable must be strictly routed in 90Ω +/- 10% differential. The TVS devices D1 and D2
on the data line must be selected with equivalent capacitance less than 1pF. The TVS device should be
placed near the USB connector or test point, recommended models ESD73011N and WS05DUCFM.
2. The detection of USB2.0 speed is determined automatically by the USB protocol. The customer does
not need to pull up the DP external, otherwise it may affect the device USB enumeration.

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3.4.2 USB_BOOT Interface

A7670 provides one forced download boot interface ‘USB_BOOT’.

Table 12: USB_BOOT description


Pin Power Default
Pin name I/O Description Remark
number domain state
Force download
6 USB_BOOT DI 1.8V B-PD
boot port

If the module upgrade fails to boot, you can force upgrade through the USB_BOOT port.
Before the module is powered on, pull the USB_BOOT pin to 1.8V, then apply VBAT power to the module,
and press RESET to enter the download mode. After entering the download mode, you need to release
USB_BOOT and remove the pull-up.

VDD_1V8

Module Disconnect when download


finished
10K

USB_BOOT

TVS

Figure 17: Reference USB_BOOT circuit

Customers will see the download port in the device manager port of the widows system.

Figure 18: Force-download port

NOTE

USB_BOOT only has the function of forcing download and booting before booting (it cannot be pulled
up).

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3.5 SIM Interface

A7670 supports both 1.8V and 3.0V USIM Cards. The interface power of the USIM card is provided by the
voltage regulator inside the module, and the normal voltage value is 3V or 1.8V.

Table 13: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)


Symbol Parameter Min. Typ. Max. Unit
USIM_VDD LDO power output voltage 1.62 1.8 1.98 V
VIH High-level input voltage 0.7*USIM_VDD - USIM_VDD +0.4 V
VIL Low-level input voltage -0.4 0 0.25*USIM_VDD V
VOH High-level output voltage USIM_VDD -0.4 - USIM_VDD V
VOL Low-level output voltage 0 0 0.2 V

Table 14: USIM electronic characteristic 3.0V mode (USIM_VDD=3V)


Symbol Parameter Min. Typ. Max. Unit
USIM_VDD LDO power output voltage 2.7 3 3.3 V
VIH High-level input voltage 0.7*USIM_VDD - USIM_VDD +0.4 V
VIL Low-level input voltage -0.4 0 0.25*USIM_VDD V
VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V
VOL Low-level output voltage 0 0 0.3 V

3.5.1 SIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST


(www.st.com) or SMF15C produced by ON SEMI (www.onsemi.com). Note that the USIM peripheral
circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder
reference circuit.
The following figure shows the 6-pin SIM card holder reference circuit.

Module
SIM Socket
USIM_VDD VCC GND
USIM_RST 22Ω RST VPP
USIM_CLK 22Ω CLK I/O

USIM_DATA 22Ω
22pF_NM
22pF_NM

22pF_NM

100nF 33pF
NM

Figure 19: SIM interface reference circuit

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NOTE

USIM_DATA has been pulled up with a 4.7KΩ resistor to USIM_VDD in module. A 100nF capacitor on
USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer
to document [1].USIM_CLK is very important signal, the rise time and fall time of USIM_CLK

3.5.2 Recommend USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User
can visit http://www.amphenol.com for more information about the holder.

Figure 20: Amphenol C707 10M006 512 USIM card socket

Table 15: Amphenol USIM socket pin description


Pin Signal Description
C1 USIM_VDD USIM Card Power supply.
C2 USIM_RST USIM Card Reset.
C3 USIM_CLK USIM Card Clock.
C5 GND Connect to GND.
C6 VPP NC
C7 USIM_DATA USIM Card data I/O.

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3.6 PCM Interface

A7670 provides a PCM interface for external codec, which can be used in master mode with short sync and
16 bits linear format. A7670 supports voice function, customers can add codec on PCM for voice call. For
specific parameters and matters, please refer to the relevant software manuals.

Table 16: PCMformat

Characteristics Specification
LineInterfaceFormat Linear(Fixed)
Datalength 16bits(Fixed)
PCMClock/SyncSource MasterMode(Fixed)
PCMClockRate 8KHz/16KHz/48KHz
PCMSyncFormat Shortsync(Fixed)
DataOrdering MSB

3.6.1 PCM Sequence

The related PCM timing is shown in the following figure:

Figure 21: PCMsequence

3.6.2 PCM Reference Design(Software development)

The following figure showsthe external codec reference design.

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3.3V 3.8V VDD_1V8


BLM21PG221SN1
PADGND
Module VSSA VDDA
VSSSPK
VDDSPK
VDDD
GND AGND
PCM_IN ADCOUT 1.3K
MICBIAS
PCM_OUT DACIN
PCM_SYNC FS 1uF
MIC+
MIC- 1uF
PCM_CLK BCLK
MIC
MCLK
1.3K
SCL SCLK 47uF
MOUT
SDA SDIO 47uF
VSSD SPKOUT+
SPKOUT-
VREF Receiver (32Ω)
100pF
NAU8810
4.7uF AGND

AGND AGND AGND

Figure 22: PCM reference circuit

3.7 GPIO Interface

A7670 module provides 8 GPIOs.

Table 17: Standard GPIO Resources


AT command Pad
Pin Pin Power Default
Pin No. operation GPIO Edge
name typ. domain function
number wakeup
19 GPIO1 GPIO1 IO 1.8V PU Yes
20 GPIO2 GPIO2 IO 1.8V PD Yes
21 GPIO3 GPIO3 IO 1.8V PU Yes
49 GPIO4 GPIO4 IO 1.8V PU Yes
50 GPIO5 GPIO5 IO 1.8V PU Yes
48 GPIO9 GPIO9 IO 1.8V PD Yes
67 GPIO10 GPIO10 IO 1.8V PU Yes
68 GPIO11 GPIO11 IO 1.8V PU Yes

3.8 I2C Bus

The module provides two sets of I2C interfaces, support standard speed clock frequency 100Kbps, support
high speed clockfrequency 400Kbps, its operation voltage is 1.8V.

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Module Equipment

SCL SCL
SDA SDA

GND GND

Figure 23: I2C reference circuit

NOTE

SCL and SDA have pull-up resistor inside, external resistor is not needed.

3.9 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following
figure.

VBAT

R
Module
4.7K
NETLIGHT

47K

Figure 24: NETLIGHT reference circuit

NOTE

The value of the resistor named “R” depends on the LED characteristic.

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The NETLIGHT signal is used to control the LED lights that indicate the status of the network. The working
status of this pin is shown in the table below.

Table 18: 2G/3G mode NETLIGHT pin status


NETLIGHT pin status Module status
Always On Searching Network
200ms ON, 200ms OFF Data Transmit
800ms ON, 800ms OFF Registered network
OFF Power off / Sleep

Table 19: LTE mode NETLIGHT pin status


NETLIGHT pin status Module status
Always On Searching Network
200ms ON, 200ms OFF Data Transmit/Registered
OFF Power off / Sleep

3.10 Other interface

3.10.1 ADC

A7670 has 1 dedicated ADC pins named ADC.They are available for digitizing analog signals such as
battery voltage and so on. These electronic specifications are shown in the following table.

Table 20: ADC electronic characteristics


Characteristics Min. Typ. Max. Unit
Resolution – 12 - Bits
Input Range 0 - 1.3 V
Input serial resistance 1 – – MΩ

NOTE

“AT+CADC” can be used to read the voltage of the ADC pin, for more details, please refer to
document [1].

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3.10.2 LDO

A7670 has 1 LDO output, VDD_1V8.


VDD_1V8 is the module's system IO power supply, which can only provide a current capacity of 50mA. It
cannot be used as a high current drive source.

Table 21: VDD_1V8 Electrical characteristics


Symbol Description Min. Typ. Max. Unit
VVDD_1V8 Output voltage - 1.8 - V
IO Output current - - 50 mA

NOTE

This power supply is the system power supply. If the damage will affect the system startup, it is
recommended that customers add TVS protection. The recommended model is ESD56051N.

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4 RF Specifications
4.1 GSM/LTE RF Specifications

Table 22: Conducted transmission power


Frequency Power Min.
GSM850 33dBm ±2dB 5dBm ± 5dB
EGSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
PCS1900 30dBm ±2dB 0dBm ± 5dB
GSM850 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
EGSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
PCS1900 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
LTE-FDD B1 23dBm +/-2.7dB <-40dBm
LTE-FDD B2 23dBm +/-2.7dB <-40dBm
LTE-FDD B3 23dBm +/-2.7dB <-40dBm
LTE-FDD B4 23dBm +/-2.7dB <-40dBm
LTE-FDD B5 23dBm +/-2.7dB <-40dBm
LTE-FDD B7 23dBm +/-2.7dB <-40dBm
LTE-FDD B8 23dBm +/-2.7dB <-40dBm
LTE-FDD B20 23dBm +/-2.7dB <-40dBm
LTE-FDD B28 23dBm +/-2.7dB <-40dBm
LTE-FDD B66 23dBm +/-2.7dB <-40dBm
LTE-TDD B34 23dBm +/-2.7dB <-40dBm
LTE-TDD B38 23dBm +/-2.7dB <-40dBm
LTE-TDD B39 23dBm +/-2.7dB <-40dBm
LTE-TDD B40 23dBm +/-2.7dB <-40dBm
LTE-TDD B41 23dBm +/-2.7dB <-40dBm

NOTE

he max power is tested result for 1RB in CAT-M1 and single-tone in CAT-NB1. MPR for CAT-M1 please
refer to 6.2.3EA.5 part for 3GPP. Multi-tone test results please refer to part 6.2.3F.3 for CAT-NB1.

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Table 23: 2G/3G frequency band information


Frequency DL UL
EGSM900 925~960MHz 880~915 MHz
DCS1800 1805~1880 MHz 1710~1785 MHz

Table 24: E-UTRA operating bands


E-UTRA UL Freq. DL Freq. Duplex Mode
1 1920 ~1980 MHz 2110 ~2170 MHz FDD
2 1850~1910MHz 1930~1990MHz FDD
3 1710 ~1785 MHz 1805 ~1880 MHz FDD
4 1710~1755MHz 2110~2155MHZ FDD
5 869~894 MHz 824~849MHz FDD
7 2500~2570MHz 2620~2690MHz FDD
8 880 ~915 MHz 925 ~960 MHz FDD
20 832~862MHz 791~821MHz FDD
28 703~748MHz 758~803MHz FDD
66 1710~1780MHz 2110~2180MHz FDD
34 2010~2025MHz 2010~2025 MHz TDD
38 2570 ~2620 MHz 2570 ~2620 MHz TDD
39 1880 ~1920 MHz 1880 ~1920 MHz TDD
40 2300 ~2400 MHz 2300 ~2400 MHz TDD
41 2496 ~2690 MHz 2496 ~2690 MHz TDD

Table 25: Conducted receive sensitivity


Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)
EGSM900 < -109dBm 3GPP
DCS1800 < -109dBm 3GPP
LTE FDD/TDD Refer to table 24 3GPP

Table 26: Reference sensitivity (QPSK)


E-UTRA 3GPP standard 实测值 Duplex
Band 1.4 MHz 3MHz 5MHz 10MHz 15 MHz 20 MHz 10 MHz Mode
1 - - -100 -97 -95.2 -94 -98.5 FDD
2 -102.7 -99.7 -98 -95 -93.2 -92 TBD FDD
3 -101.7 -98.7 -97 -94 -92.2 -91 -98.1 FDD
4 -104.7 -101.7 -100 -97 -95.2 -94 TBD FDD
5 -103.2 -100.2 -98 -95 - - -98.6 FDD
7 -98 -95 -93.2 -92 TBD FDD
8 -102.2 -99.2 -97 -94 - - -98.1 FDD
20 -97 -94 -91.2 -90 TBD FDD
28 -100.2 -98.5 -95.5 -93.7 -91 TBD FDD

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66 -104.7 -101.7 -100 -97 -95.2 -94 TBD FDD


34 - - -100 -97 -95.2 - -97.5 TDD
38 - - -100 -97 -95.2 -94 -98.6 TDD
39 - - -100 -97 -95.2 -94 -97.8 TDD
40 - - -100 -97 -95.2 -94 -98.2 TDD
41 - - -98 -95 -93.2 -92 -98.6 TDD

NOTE

The measured value is the main antenna under 10 MHz.

4.2 GSM/LTE Antenna Design Guide

Users should connect antennas to A7670’s antenna pads through micro-strip line or other types of RF trace
and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss
between the antenna pads and antennas should meet the following requirements:

Table 27: Traceloss


Frequency Loss
700MHz-960MHz <0.5dB
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit
should be added. The following figure is the recommended circuit.

RF connector
Matching circuit
MAIN_ANT 60
R1 R2
GND 61 D1
C1 C2
TVS
模块

Figure 25: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the values of

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components can only be achieved after the antenna tuning and usuallyprovided by antenna vendor. By
default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS
for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close as to
the module’s MAIN_ANT pin. The traces impedance between A7670 and antenna must be controlled in 50
Ω.
Two TVS are recommended in the table below.

Table 28: Recommended TVS


Package Part Number Vender
0201 CE0201S05G01R SOCAY
0402 PESD0402-03 PRISEMI

4.3 Antenna Requirements

The following table shows the requirements on GSM/LTE antennas.

Table 29:GSM/LTE antennas

Parameter Requirement
Operating Frequency See Table 23&24 for each antenna
Direction Omni Directional
Gain > -3dBi (Avg)
Impedance 50 Ω
Efficiency >50 %
Max. Input Power 50W
VSWR <2
Isolation 20dB is preferred
CableInsertion Loss<1GHz <1dB
Cable Insertion Loss 1GHz~2.2GHz <1.5dB
Cable Insertion Loss 2.3GHz~2.7GHz <2dB

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5 Electrical Specifications
5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of A7670 are listed in the following table, Exceeding
these limits may cause permanent damage to the module.

Table 30: Absolute maximum ratings


Parameter Min. Typ. Max. Unit
Voltage on VBAT -0.5 - 4.7 V
Voltage on USB_VBUS -0.5 - 5.4 V
Voltage at digital pins
-0.3 - 2.1 V
(GPIO,I2C,UART,PCM)
Voltage atlO pins -0.3 - 2.1 V
(USIM) -0.3 - 3.9 V
Voltage at PWRKEY, RESET -0.3 - 4.7 V

5.2 Operating conditions

Table 31: Recommended operating ratings


Parameter Min. Typ. Max. Unit
Voltage at VBAT 3.4 3.8 4.2 V
Voltage at USB_VBUS 3.5 5.0 5.4 V

Table 32: 1.8V Digital I/O characteristics*


Parameter Description Min. Typ. Max. Unit
VIH High-level input voltage 1.35 1.8 2.1 V
VIL Low-level input voltage -0.3 - 0.45 V
VOH High-level output voltage 1.35 - 1.8 V
VOL Low-level output voltage 0 - 0.4 V
High-level output current(no pull
IOH 1 - 5 mA
down resistor)
Low-level output current(no pull
IOL -1 - -5 mA
up resistor)
Input high leakage current (no
IIH - - 10 uA
pull down resistor)

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Input low leakage current(no pull


IIL -10 - - uA
up resistor)

NOTE

These parameters are for digital interface pins, such as GPIO, I2C, UART, and PCM.

The operating temperature of A7670 is listed in the following table.

Table 33: Operating temperature


Parameter Min. Typ. Max. Unit
Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 90 ℃

NOTE

The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the
normal operating temperature range and still within the extreme operating temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table belowsummarizes the various operating modes of A7670 product.

Table 34: Operating mode Definition


Mode Function
In this case, the current consumption of module will be reduced
GSM/ LTE Sleep to the minimal level and the module can still receive paging
message and SMS.
Software is active. Module is registered to the network, and the
GSM/LTE Idle
module is ready to communicate.
Normal
Connection between two subscribers is in progress. In this
operation
case, the power consumption depends on network settings
GSM/ LTE Talk
such as DTX off/on, FR/EFR/HR, hopping sequences, and
antenna.
Module is ready for data transmission, but no data is currently
GSM/LTE Standby
sent or received. In this case, power consumption depends on

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network settings.

There is data transmission in progress. In this case, power


GPRS/EDGE/LTE
consumption is related to network settings (e.g. power control
Data transmission
level); uplink/downlink data rates, etc.
AT command ‘AT+CFUN=0’ AT+CSCLK=1 can be used to set
the module to a minimum functionality mode without removing
the power supply. In this mode, the RF part of the module will
Minimum functionality mode
not work and the USIM card will not be accessible, but the
serial port and USB port are still accessible. The power
consumption in this mode is lower than normal mode.
AT command ‘AT+CFUN=4’ or pulling down the
FLIGHTMODE pin can be used to set the module to flight
mode without removing the power supply. In this mode, the RF
Minimum functionality mode
part of the module will not work, but the serial port and USB
port are still accessible. The power consumption in this mode
is lower than normal mode.
Module will go into power off mode by sending the AT
command ‘AT+CPOF’ or pull down the PWRKEY pin, normally.
Power off In this mode the power management unit shuts down the
power supply, and software is not active. The serial port and
USB are is not accessible.

5.3.2 Sleep mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still
receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let A7670 enter into sleep
mode:
 USB condition
 Software condition
 UART condition

NOTE

Before designing, pay attention to how to realize sleeping/waking function and refer to Document [24]
for more details.

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5.3.3 Minimum functionality mode and Flight mode

Minimum functionality mode ceasesa majority functionof the module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.

 AT+CFUN=0: Minimum functionality


 AT+CFUN=1: Full functionality (Default)
 AT+CFUN=4: Flight mode

If A7670 has been set to minimum functionality mode, the RF function and SIM card function will be closed.
In this case, the serial port and USB are still accessible, but RF function andSIM card will be unavailable.
If A7670 has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are
still accessible, but RF function will be unavailable.
When A7670 is in minimum functionality or flight mode, it can return to full functionality by the AT command
“AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

Table 35: Current consumption on VBAT Pins (VBAT=3.8V)


GSM sleep/idle mode
GSM supply current Sleep mode@BS_PA_MFRMS=2Typical: TBD
(GNSS off,without USB connection) Idle mode@BS_PA_MFRMS=2 Typical: TBD
LTE sleep/idle mode
LTE supply current Sleep modeTypical: TBD
(GNSS off,without USB connection) Idle mode Typical: TBD
GSM Talk
EGSM 900 @power level #5 Typical: 320 mA
DCS1800 @power level #5 Typical: 262 mA
GPRS
EGSM900( 2 Rx,4 Tx ) @power level #5 Typical: 630mA
DCS1800( 2 Rx,4 Tx ) @power level #0Typical:395mA
EGSM900( 3Rx, 2 Tx ) @power level #5 Typical:370mA
DCS1800( 3Rx, 2 Tx ) @power level #0Typical:275mA
EDGE
EGSM900( 2 Rx,4 Tx ) @power level #8Typical:460mA
DCS1800( 2 Rx,4 Tx ) @power level #2Typical:300mA
EGSM900( 3Rx, 2 Tx ) @power level #8Typical: 336mA
DCS1800( 3Rx, 2 Tx ) @power level #2Typical:208mA

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LTE Cat-M
LTE-FDD B1 @10MTypical:490 mA
LTE-FDD B2 @10M Typical:TBD
LTE-FDD B3 @10MTypical:670 mA
LTE-FDD B4 @10M Typical:TBD
LTE-FDD B5 @10M Typical:510 mA
LTE-FDD B7 @10M Typical:TBD
LTE-FDD B8 @10M Typical:490mA
LTE-FDD B20 @10M Typical:TBD
LTE-FDD B28 @10M Typical:TBD
LTE-FDD B66 @10M Typical:TBD
@5Mbps 23.2dBm Typical: TBD
LTE-TDD B34 @10Mbps 23.3dBm Typical: 230mA
@20Mbps 23.3dBm Typical: TBD
@5Mbps 23.2dBm Typical: TBD
LTE-TDD B38 @10Mbps 23.3dBm Typical: 250 mA
@20Mbps 23.3dBm Typical: TBD
@5Mbps 22.7dBm Typical: TBD
LTE-TDD B39 @10Mbps 22.9dBm Typical: 220 mA
@20Mbps 22.8dBm Typical: TBD
@5Mbps 22.9dBm Typical: TBD
LTE-TDD B40 @10Mbps 23.0dBm Typical: TBD
@20Mbps 22.9dBm Typical: TBD
@5Mbps 23.1dBm Typical: TBD
LTE-TDD B41 @10Mbps 23.1dBm Typical: 260 mA
@20Mbps 23.0dBm Typical: TBD

5.5 ESD Notes

A7670 is sensitive to ESD in the process of storage, transporting, and assembling. WhenA7670 is mounted
on the users’ mother board, the ESD components should be placed beside the connectors which human
body may touch, such as SIM card holder, audio jacks, switches, keys, etc. The following table shows the
A7670 ESD measurement performance without any external ESD component.

Table 36: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.)
Part Contact discharge Air discharge
VBAT,GND +/-5K +/-10K
Antenna port +/-5K +/-10K
USB interface +/-4K +/-8K
UARTinterface +/-4K +/-6K
Other PADs +/-1K +/-2K

NOTE

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Test conditions: The module is on the SIMCom development board (the development board has the
necessary ESD protection devices)

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6 SMT Production Guide


6.1 Top and Bottom View of A7670

Figure 26: Top and bottom view of A7670

NOTE

The above is the design effect diagram of the module for reference. The actual appearance is subject to
the actual product.

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6.2 Label Information

Figure 27: Label information

Table 37: The description of label information


No. Description
A Project name
B No.1 Pin
C Serial number
D International mobile equipment identity
E QR code

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6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic
recommendation and should be adjusted to the specific application and manufacturing constraints.

Figure 28: The ramp-soak-spike reflow profile of A7670

NOTE

For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

A7670 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.

The following table shows thefeatures ofMoisture Sensitivity Level (MSL). After seal off, storage conditions
must meet the following table. If the storage time was expired, module must be baking before SMT.

Table 38: Moisture Sensitivity Level and Floor Life


Moisture Sensitivity Floor Life (out of bag) at factory ambient≤30°C/60% RH or
Level (MSL) as stated
1 Unlimited at ≦30℃/85% RH
2 1 yearat ≦30℃/60% RH
2a 4 weeks at ≦30℃/60% RH
3 168 hours at ≦30℃/60% RH
4 72 hours at ≦30℃/60% RH

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5 48 hours at ≦30℃/60% RH
5a 24 hours at ≦30℃/60% RH
Mandatory bake before use. After bake, it must be reflowed within the
6
time limit specified on the label.

NOTE

IPC / JEDEC J-STD-033standard must be followed for production and storage.

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7 Packaging
7.1 Tray packaging

A7670 module support tray packaging.

Figure 29: packaging diagram

Module tray drawing:

Figure 30: Tray drawing

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Table 39: Tray size


Length(±3mm) Width(±3mm) Module number
242.0 161.0 20
Small carton drawing:

Figure 31: Small carton drawing

Table 40: Small Carton size


Length(±10mm) Width(±10mm) Height(±10mm) Module number
270 180 120 20*20=400
Big carton drawing:

Figure 32: Big carton drawing

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Table 41: Big Carton size


Length(±10mm) Width(±10mm) Height(±10mm) Module number
380 280 280 400*4=1600

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8 Appendix
8.1 Coding Schemes and Maximum Net Data Rates over Air Interface

Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface
Multislot definition(GPRS/EDGE)
Active slot
Slot class DL slot number UL slot number
number
1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5
GPRS coding scheme Max data rata(4 slots) Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK
CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK
EDGE coding scheme Max data rata(4 slots) Modulation type
MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK
MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK
MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK
MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK
MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK
MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK
MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK

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LTE-FDD device category


Max data rate(peak) Modulation type
(Downlink)
Category M1 1Mbps QPSK/16QAM
LTE-FDD device category
Max data rate(peak) Modulation type
(Uplink)
Category M1 375kbps QPSK/16QAM

8.2 Related Documents

Table 43: Related Documents


NO. Title Description
A7600 Series_AT Command
[1] AT Command Manual
Manual _V1.00.04
ITU-T Draft new
[2] Serial asynchronous automatic dialing and control
recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command
[3] GSM 07.07
set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
[5] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS) and
Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
[6] GSM 11.14 Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
[7] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
[8] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ;
[9] GSM 11.10 Mobile Station (MS) conformance specification ; Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
[10] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals and
[11] 3GPP TS 34.124
ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals and
[12] 3GPP TS 34.121
ancillary equipment.
Technical Specification Group Radio Access Network;
[13] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[14] 3GPP TS 34.123-3
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
[15] EN 301 908-02 V2.2.1
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive

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Electromagnetic compatibility and Radio Spectrum Matters


(ERM); Electromagnetic Compatibility (EMC) standard for
[16] EN 301 489-24 V1.2.1 radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
[18] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain
[20] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)
Module
[21] Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
A7600Series_UART_Applicati This document describes how to use UART interface of
[22]
on Note_V1.xx SIMCom modules.
Antenna design guidelines for
[23] Antenna design guidelines for diversity receiver system
diversity receiver system
A7600 Series_Sleep
[24] Sleep Mode Application Note
Mode_Application Note_V1.xx

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8.3 Terms and Abbreviations

Table 44: Terms and Abbreviations


Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BD BeiDou
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
DAM Downloadable Application Module
DPO Dynamic Power Optimization
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global Standard for Mobile Communications
HR Half Rate
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated

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NMEA National Marine Electronics Association


PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
SIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter
PSM Power saving mode
FD SIM fix dialing phonebook
LD SIM last dialing phonebook (list of numbers most recently dialed)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ON SIM (or ME) own numbers (MSISDNs) list
RC Mobile Equipment list of received calls
SM SIM phonebook
NC Not connect

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8.4 Safety Caution

Table 45: Safety Caution


Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

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