SPECIFICATION

CUSTOMER :

MODULE NO.: WG240128B-FMI-VZ#

APPROVED BY:

( FOR CUSTOMER USE ONLY )

PCB VERSION: DATA:

SALES BY APPROVED BY CHECKED BY PREPARED BY

ISSUED DATE:

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 MODLE NO

DOC. FIRST ISSUE

RECORDS OF REVISION

REVISED
PAGE NO. SUMMARY
VERSION DATE

0 2007/12/21 First issue

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Contents
1.Module Classification Information

2.Precautions in use of LCD Modules

3.General Specification

4.Absolute Maximum Ratings

5.Electrical Characteristics

6.Optical Characteristics

7.Power Supply for LCD Module and Contrast Adjust

8.Counter Drawing & Block Diagram

9.Interface Pin Function

10.Display control instruction

11.Timing Characteristics

12.Reliability

13.Backlight Information

14. Inspection specification

15. Material List of Components for RoHs

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1.Module Classification Information
WG 240128 B FMI VZ#
cd e f ghi j

c Brand WINSTAR DISPLAY CORPORATION

d Display Type H Character Type, G Graphic Type
e Display Font 240 * 128
f Model serials no.
g Backlight Type N Without backlight T LED, White
B EL, Blue green A LED, Amber
D EL, Green R LED, Red
W EL, White O LED, Orange
F CCFL, White G LED, Green
Y LED, Yellow Green
h LCD Mode B TN Positive, Gray T FSTN Negative
N TN Negative,
G STN Positive, Gray
Y STN Positive, Yellow Green
M STN Negative, Blue
F FSTN Positive
i LCD Polarizer Type/ A Reflective, N.T, 6:00 H Transflective, W.T,6:00
Temperature range/ D Reflective, N.T, 12:00 K Transflective, W.T,12:00
View direction
G Reflective, W. T, 6:00 C Transmissive, N.T,6:00
J Reflective, W. T, 12:00 F Transmissive, N.T,12:00
B Transflective, N.T,6:00 I Transmissive, W. T, 6:00
E Transflective, N.T.12:00 L Transmissive, W.T,12:00
j Special Code V : Build in Negative voltage ; Z:ICNT7086
#:Fit in with the ROHS Directions and regulations

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2.Precautions in use of LCD Modules

(1) Avoid applying excessive shocks to the module or making any alterations or modifications to it.

(2) Don’t make extra holes on the printed circuit board, modify its shape or change the components of

LCD module.

(3) Don’t disassemble the LCM.

(4) Don’t operate it above the absolute maximum rating.

(5) Don’t drop, bend or twist LCM.

(6) Soldering:only to the I/O terminals.

(7) Storage:please storage in anti-static electricity container and clean environment.

(8) Winstar have the right to change the passive components

(9) Winstar have the right to change the PCB Rev.

3.General Specification

ITEM STANDARD VALUE UNIT

Number of Dots: 240 ×128

Module dimension: 152.0×104.0×14.3(MAX)mm mm

View area: 114.0×64.0mm mm

Active area: 107.98×57.58mm mm

Character size: (L)0.43×(W)0.43 mm mm

Character pitch: (L)0.45×(W)0.45mm mm

LCD type: STN Negative, Blue Transmissive

Duty: 1/128

View direction: 6 o’clock

Backlight: CCFL White

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4.Absolute Maximum Ratings

ITEM SYMBOL MIN. TYP. MAX. UNIT

Operating Temperature TOP -20 +70
Storage Temperature TST -30 +80
Input Voltage VI VSS VDD V
Supply Voltage For Logic VDD-VSS -0.3 +7 V
Supply Voltage For LCD VDD-V0 0 21 V

5.Electrical Characteristics

ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT

Supply Voltage For Logic VDD-VSS 4.75 5.0 5.25 V
Ta=-20 21.7 V
Supply Voltage For LCD VDD-V0 Ta=25 19.5 V
Ta=70 17.6 V
Input High Vol VIH VDD-2.2 VDD V
Input Low Vol VIL 0 0.8 V
Output High Vol VOH VDD-0.3 VDD V
Output Low Vol. VOL 0 0.3 V
Supply Current IDD VDD=5V 45 mA

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6.Optical Characteristics

ITEM SYMBAL CONDITION MIN. TYP. MAX. UNIT

(V) CR 2 20 40 deg
View Angle
(H) CR 2 -30 30 deg

Contrast Ratio CR 3

T rise 200 300 ms

Response Time
T fall 200 300 ms
6.1 Definitions

■View Angles ■Contrast Ratio

Z ( Visual angle direction ) Brightness at selected state ( BS )
CR =
θ Brightness at non-selected state ( Bns )
Selected state
Brightness (%)

Non-selected state
LCD
X

φ Bs

Bns
Y
Operating voltage for LCD driving
( Best visual angle direction )

Response Time

Nonselected Condition Selected Condition Nonselected Condition

90 %
Brightness

100 %

10 %

tr td
Rise Time Decay Time ( fall time tf )
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7.Power Supply for LCD Module and Contrast Adjust

VDD 2

VO 3
10 KΩ 5V
LCD
MODULE

1
VSS

17
VEE ( - 16 V )

VDD-V0:LCD Operating Voltage

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8.Counter Drawing & Block Diagram

152.0 0.5
144.0 0.5
8.0 128.0 1 Vss
2 Vdd
20.21

15.0 114.0(VA) 14.3 M AX

12.0
17.0

3.5
18.01 107.98(AA) 9.2 3 Vo
4 C/D
5 RD
6 WR
7 DB0
125.0 10 8 DB1
57.58(AA)
64.0(VA)
104.0 0.5

240*128 DOTS 9 DB2

74.0

97.0
10 DB3
11 DB4
12 DB5
13 DB6
20- 1.0 PTH 14 DB7
20- 2.0 PAD 15 CE
20 2.0 1 4- 3.5 PTH 1.6
16 RESET
13.74 P2.54x19=48.26 4- 7.0 PAD 17 Vee
3.0 138.0 18 M D2
CCFL B/L 19 FS1
20 NC

The non-specified tolerance of dimension is 0.3mm.

0.45
0.43
0.43
0.45

DOT SIZE
Com Driver

WR CData
Com1~64

RD T6963C LP
M PU Controller
CE FR
NT7086

C /D HSCP
80 series
or
68 series R ESET ED 240X128 DOT
DB0~DB7
Com Driver
Com64~128

M D2
FS
Vdd,Vss,V1,V4,V5

NT7086

N T7086 NT7086 NT7086

Address D ata Seg1~80 Seg81~160 Seg160~240
FS H L
Font 6X8 8X8 8K Seg Driver Seg Driver Seg Driver
Font select SRAM
(32K optional)
M D2 H L
Colum n 32 40
Colum n select Vdd,Vss,V2,V3,V5

V dd,V ss Bias and N .V. Fram e

Power C ircuit Generator (Bezel)

Vdd
VR Vo
10K~20K Vee

External contrast adjustm ent.

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 9.Interface Pin Function

Pin No. Symbol Level Description

1 Vss GND

2 Vdd Power supply ( +5 V )

3 Vo Power supply for LCD driver

4 C/D H/L WR=L , C/D=H : Command Write C/D=L: Data write

RD=L , C/D=H : Status Read C/D=L: Data read

5 RD L Data read. Read data from T6963C when RD = L

6 WR L Data write. Write data into T6963C when WR = L

7 DB0 H/L Data bus line

8 DB1 H/L Data bus line

9 DB2 H/L Data bus line

10 DB3 H/L Data bus line

11 DB4 H/L Data bus line

12 DB5 H/L Data bus line

13 DB6 H/L Data bus line

14 DB7 H/L Data bus line

15 CE L L : Chip enable

16 RESET H/L H : Normal ; L : Initialize T6963C

17 Vee Negative Voltage output

18 MD2 H/L H: 32 columns ; L: 40 columns

19 FS1 H/L Pins for selection of font ; H : 6 * 8 , L : 8 * 8

20 NC No connection

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 10.Display control instruction

The LCD Module has built in a T6963C LSI controller, It has an 8-bit parallel data bus and control

lines for writing or reading through an MPU interface, it has a 128-word character generator ROM ( refer to

Table 1. ), which can control an external display RAM of up to 8K bytes. Allocation of text, graphics and

external character generator RAM can be made easily and the display window can be moved freely within

the allocated memory range.

•RAM Interface
The external RAM is used to store display data( text, graphic and external CG data ). It can be freely

allocated to the memory area( 8 Kbyte max ).

Recommend

0000H

TEXT AREA

0C00H

GRAPHIC
AREA

1800H
CG RAM
AREA
2000H

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 Flowchart of communications with MPU

(1)Status Read

A status check must be performed before data is read or written.

Status check

The Status of T6963C can be read from the data lines.

RD L
WR H
CE L

C/D H
Do to D7 H

The T6963C status word format is as follows:

MSB LSB
STA7 STA6 STA5 STA4 STA3 STA2 STA1 STA0
D7 D6 D5 D4 D3 D2 D1 D0

0:Disable
STA0 Check command execution capability
1:Enable
0:Disable
STA1 Check data read/write Capability
1:Enable
0:Disable
STA2 Check Auto mode data read capability
1:Enable
0:Disable
STA3 Check Auto mode data write capability
1:Enable
STA4 Not used
0:Disable
STA5 Check controller operation capability
1:Enable
Error flag. Used for Screen Peek and Screen copy 0:No error
STA6
commands. 1:Error
0:Disable off
STA7 Check the blink condition
1:Normal display

(Note 1) It is necessary to check STA0 and STA1 at the same time.

There is a possibility of erroneous operation due to a hardware interrupt.

(Note 2) For most modes STA0/STA1 are used as a status check.

(Note 3) STA2 and STA3 are valid in Auto mode; STA0 and STA1 are invalid.

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Status Checking flow

(a) (b)

(Note 4) When using the MSB=0 command, a Status Read must be performed.

If a status check is not carried out, the T6963C cannot operate normally, even after a delay

time.

The hardware interrupt occurs during the address calculation period (at the end of each line).

If a MSB=0 command is sent to the T6963C during this period, the T6963C enters Wait status.

If a status check is not carried out in this state before the next command is sent, there is the

possibility that the command or data date will not be received.

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(2)Setting date

When using the T6963C, first set the data, then set the command.

Procedure for sending a command

(a)The case of 1 date (b)The case of 2 data

(Note) When sending more than two data, the last datum (or last two data)is valid.

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 COMMAND DEFINITIONS
COMMAND CODE D1 D2 FUNCTION
00100001 X address Y address Set Cursor Pointer
REGISTERS SETTING 00100010 Date 00H Set Offset Register
00100100 Low address High address Set Address Pointer
01000000 Low address High address Set Text Home Address
01000001 Columns 00H Set Text Area
SET CONTROL WORD
01000010 Low address High address Set Graphic Home Address
01000011 Columns 00H Set Graphic Area
1000×000 OR mode
1000×001 EXOR mode
1000×011 AND mode
MODE SET
1000×100 Text Attribute mode
10000××× Internal CG ROM mode
10001××× External CG RAM mode
10010000 Display off
1001××10 Cursor on, blink off
10001××11 Cursor on, blink on
DISPLAY MODE
100101×× Text on, graphic off
100110×× Text off, graphic on
100111×× Text on, graphic on
10100000 1-line cursor
10100001 2-line cursor
10100010 3-line cursor
CURSOR PATTERN 10100011 4-line cursor
SELECT 10100100 5-line cursor
10100101 6-line cursor
10100110 7-line cursor
10100111 8-line cursor
10110000 Set Data Auto Write
DATA AUTO
10110001 Set Data Auto Read
READ/WRITE
10110010 Auto Reset
11000000 Data Data Write and Increment ADP
11000001 Data Read and Increment ADP
11000010 Data Data Write and Decrement ADP
DATA READ/WRITE
11000011 Data Read and Decrement ADP
11000100 Data Data Write and Nonvariable ADP
11000101 Data Read and Nonvariable ADP
SCREEN PEEK 11100000 Screen Peek

X : invalid
COMMAND CODE D1 D2 FUNCTION

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SCREEN COPY 11101000 Screen Copy
11110××× Bit Reset
11111××× Bit Set
1111×000 Bit 0 (LSB)
11111×001 Bit 1
11111×010 Bit 2
BIT SET/RESET
11111×011 Bit 3
11111×100 Bit 4
11111×101 Bit 5
11111×110 Bit 6
11111×111 Bit 7 (MSB)
X : invalid

Setting registers
CODE HEX. FUNCTION D1 D2
00100001 21H SET CURSOR POINTER X ADRS Y ADRS
00100010 22H SET OFFSET REGISTER DATA 00H
00100100 24H SET ADDRESS POINTER LOW ADRS HIGH ADRS

(1)Set Cursor Pointer

The position of the cursor is specified by X ADRS and Y ADRS. The cursor position can only be moved

by this command. Data read/write from the MPU never changes the cursor pointer. X ADRS and Y

ADRS are specified as follows.

X ADRS 00H to 4FH (lower 7 bits are valid)

Y ADRS 00H to 1FH (lower 5 bits are valid)

Single-Scan

X ADRS 00 to 4FH

Y ADRS 00H to 0FH

(2)Set Offset Register

The offset register is used to determine the external character generator RAM area.

The T6963C has a 16-bit address bus as follows.

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 T6963C assign External character generator, when character code set 80H TO FFH in using internal

character generator. Character code 00H to 80H assign External character generator, when External

generator mode.

The senior five bits define the start address in external memory of the CG RAM area. The next eight

bits represent the character code of the character. In internal CG ROM, character codes 00H to 7FH

represent the predefined “internal” CG ROM characters, and codes 80H to FFH represent the user’s

own “external” characters. In external CG ROM mode, all 256 codes from 00H to FFH can be used to

represent the user’s own characters. The three least significant bits indicate one of the eight rows of

eight dots that define the character’s shape.

The relationship between display RAM address and offset register

Offset register data CG RAM hex. address (start to end)

00000 0000 to 07 FFH

00001 0800 to 0FFFH

00010 1000 to 17FFH

11100 E000 to E7FFH

11101 E800 to EFFFH

11110 F000 to F7FFH

11111 F800 to FFFFH

(Example 1)

Offset register 02H

Character code 80H

Character generator RAM start address 0001 0100 0000 0000

1 4 0 0 H

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(Example 2) The relationship between display RAM data and display characters

and are displayed by character generator RAM.

(3)Set Address Pointer

The Set Address Pointer command is used to indicate the start address for writing to (or reading

from)external RAM.

The Flowchart for Set Address Pointer command

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Set Control Word

CODE HEX. FUNCTION D1 D2

01000000 40H Set Text Home Address Low address High address
01000001 41H Set Text Area Columns 00H
01000010 42H Set Graphic Home Address Low address High address
01000011 43H Set Graphic Area Columns 00H

The home address and column size are defined by this command.

(1)Set Text Home Address

The starting address in the external display RAM for text display is defined by this command.

The text home address indicates the leftmost and uppermost position.

The relationship between external display RAM address and display position

TH TH+CL
TH+TA TH+TA+CL
(TH+TA)+TA TH+2TA+CL
(TH+2TA)+TA TH+3TA+CL

TH+(n-1)TA TH+(n-1)TA+CL

TH:Text home address

TA:Text area number (columns)
CL:Columns are fixed by hardware (pin-programmable).

(Example)
Text home address 0000H
Text area 0020H
32 Columns
4 Lines

0000H 0001H 001EH 001FH

0020H 0021H 003EH 002FH
0040H 0041H 005EH 005FH
0060H 0061H 007EH 007FH

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(2)Set Graphic Home Address

The starting address of the external display RAM used for graphic display is defined by this command.

The graphic home address indicates the leftmost and uppermost position.

The relationship between external display RAM address and display position

GH GH+GL
GH+GA GH+GA+CL
(GH+GA)+GA GH+2GA+CL
(GH+2GA)+GA GH+3GA+CL

GH+(n-1)GA GH+(n-1)GA+CL

GH:Graphic home address

GA:Graphic area number (columns)

CL:Columns are fixed by hardware (pin-programmable).

(Example)

Graphic home address 0000H

Graphic area 0020H

32 Columns

2 Lines

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 0000H 0001H 001EH 001FH
0020H 0021H 003EH 003FH
0040H 0041H 005EH 005FH
0060H 0061H 007EH 007FH
0080H 0081H 009EH 009FH
00A0H 00A1H 00BEH 00BFH
00C0H 00C1H 00DEH 00DFH
00E0H 00E1H 00FEH 00FFH
0100H 0101H 011EH 011FH
0120H 0121H 013EH 013FH
0140H 0141H 015EH 014FH
0160H 0161H 017EH 017FH
0180H 0181H 109EH 019FH
01A0H 01A1H 01BEH 01BFH
01C0H 01C1H 01DEH 01DFH
01E0H 01E1H 01FEH 01FFH

(3)Set Text Area

The display columns are defined by the hardware Setting. This command can be used to adjust the

columns of the display.

(Example)

LCD size 20 columns, 4lines

Text home address 0000H

Text area 0014H

Set 32 columns, 4 Lines

0000 0001 ……… 0013 0014 ……… 001F

0014 0015 ……… 0027 0028 ……… 0033
0028 0029 ……… 003B 003C ……… 0047
003C 003D ……… 004F 0050 ……… 005B

LCD
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(4)Set Graphic Area

The display columns are defined by the hardware setting. This command can be used to adjust the

columns of the graphic display.

(Example)

LCD size 20 columns, 2lines

Graphic home address 0000H

Graphic are 0014H

Set 32 columns, 2 Lines

0000 0001 ……… 0013 0014 ……… 001F
0014 0015 ……… 0027 0028 ……… 0033
0028 0029 ……… 003B 003C ……… 0047
003C 003D ……… 004F 0050 ……… 005B
0050 0051 ……… 0063 0064 ……… 006F
0064 0065 ……… 0077 0078 ……… 0083
0078 0079 ……… 008B 008C ……… 0097
008C 008D ……… 009F 00A0 ……… 00AB
00A0 00A1 ……… 00B3 00B4 ……… 00BF
00B4 00B5 ……… 00C7 00C8 ……… 00D3
00C8 00C9 ……… 00DB 00DC ……… 00E7
00DC 00DD ……… 00EF 00F0 ……… 00FD
00F0 00F1 ……… 0103 0104 ……… 011F
0104 0105 ……… 0127 0128 ……… 0123
0128 0129 ……… 013B 0013C ……… 00147
013C 013D ……… 014F 0150 ……… 015B

LCD

If the graphic area setting is set to match the desired number of columns on the LCD, the addressing

scheme will be automatically modified so that the start address of each line equals the end address of

the previous line +1.

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 Mode set

CODE FUNCTION OPERAND

1000×000 OR Mode
1000×001 EXOR Mode
1000×011 AND Mode
1000×100 TEXT ATTRIBUTE Mode
10000××× Internal Character Generator Mode
10001××× External Character Generator Mode X:invalid

The display mode is defined by this command. The display mode does not change until the next

command is sent. The logical OR, EXOR, AND of text or graphic display can be displayed. In Internal

Character Generator mode, character codes 00H to 7FH are assigned to the built-in character generator

ROM. The character codes 80H to FFH are automatically assigned to the external character generator

RAM.
(Example)

(Note)Attribute functions can only be applied to text display, since the attribute data is placed in the graphic

RAM area.

Attribute function

The attribute operations are Reverse display, Character blink and Inhibit. The attribute data is written into the

graphic area which was defined by the Set Control Word command. Only text display is possible in Attribute

Function mode; graphic display is automatically disabled. However, the Display Mode command must be

used to turn both Text and Graphic on in order for the Attribute function to be available.

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The attribute data for each character in the text area is written to the same address in the graphic area. The

Attribute function is defined as follows.

Attribute RAM 1byte

× × × × d3 d2 d1 d0

d3 d2 d1 d0 FUNCTION
0 0 0 0 Normal display
0 1 0 1 Reverse display
0 0 1 1 Inhibit display
1 0 0 0 Blink of normal display
1 1 0 1 Blink of reverse display
X:invalid
1 0 1 1 Blink of inhibit display

Display mode
CODE FUNCTION OPERAND
10010000 Display off
1001××10 Cursor on, blink off
1001××11 Cursor on, blink on
100101×× Text on, graphic off
100110×× Text off, graphic on
100111×× Text on, graphic on X:invalid

(Note)It is necessary to turn on “Text display” and “Graphic display” in the following cases.

a)Combination of text/graphic display

b)Attribute function

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Cursor pattern select

CODE FUNCTION OPERAND

10100000 1-line cursor
10100001 2-line cursor
10100010 3-line cursor
10100011 4-line cursor
10100100 5-line cursor
10100101 6-line cursor
10100110 7-line cursor
10100111 8-line cursor

When cursor display is ON, this command selects the cursor pattern in the range 1 line to 8 lines.

The cursor address is defined by the Cursor Pointer Set command.

Data Auto Read/Write

CODE HEX. FUNCTION OPERAND

10110000 B0H Set Data Auto Write

1011001 B1H Set Data Auto Read

10110010 B2H Auto Reset

The command is convenient for sending a full screen of data from the external display RAM. After setting
Auto mode, a Data Write (or Read) command is need not be sent between each datum. A Data Auto Write
(or Read) command must be sent after a Set Address Pointer command. After this command, the address
pointer is automatically incremented by 1 after each datum. In Auto mode, the T6963C cannot accept any
other commands.
The Auto Reset command must be sent to the T69963C after all data has been sent, to clear Auto mode.
(Note)A Status check for Auto mode
(STA2, STA3 should be checked between sending of each datum. Auto Reset should be performed
after checking STA3=1 (STA2=1.) Refer to the following flowchart.

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a)Auto Read mode b)Auto Write mode

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Date Read/Write

CODE HEX. FUNCTION OPERAND

11000000 C0H Data Write and Increment ADP Data

11000001 C1H Data Read and Increment ADP

11000010 C2H Data Write and Decrement ADP Data

11000011 C3H Data Read and Decrement ADP
11000100 C4H Data Write and Nonvariable ADP Data
11000101 C5H Data Read and Nonvariable ADP

This command is used for writing data from the MPU to external display RAM, and reading data from

external display RAM to the MPU. Data Write/Data Read should be executed after setting address using

Set Address Pointer command. The address pointer can be automatically incremented or decremented

using this command.

(Note)This command is necessary for each 1-byte datum.

Refer to the following flowchart.

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Screen Peek

CODE HEX. FUNCTION OPERAND

11100000 E0H Screen Peek e

This command is used to transfer 1 byte of displayed data to the data stack; this byte can then be read from

the MPU by data access. The logical combination of text and graphic display data on the LCD screen can

be read by this command.

The status (STA6) should be checked just after the Screen Peek command. If the address determined by

the Set Address Pointer command is not in the graphic area, this commands is ignored and a status flag

(STA6) is set.

Refer to the following flowchart.

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Screen Copy

CODE HEX. FUNCTION OPERAND

11101000 E8H Screen Copy

This command copies a single raster line of data to the graphic area.

The start point must be set using the Set Address Pointer command.

(Note 1) If the attribute function is being used, this command is not available.

(With Attribute data is graphic area data.)

Refer to the following flowchart.

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Bit Set/Reset

CODE FUNCTION OPERAND

11110××× Bit Reset

11111××× Bit Set
1111×000 Bit 0 (LSB)
1111×001 Bit 1
1111×010 Bit 2
1111×011 Bit 3
1111×100 Bit 4
1111×101 Bit 5
1111×110 Bit 6 X:invalid
1111×111 Bit 7 (MSB)

This command use to set or reset a bit of the byte specified by the address pointer.

Only one bit can be set/reset at a time.

Refer to the following flowchart.

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CHARACTERCODEMAP

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11.Timing Characteristics

Bus Timing
( Vss = 0 V , VDD = 5 V )
Item Symbol Min Typ Max Unit
C/D Set-up Time tCDS 100 ns
C/D Hold Time tCDH 10 ns
CE,RD,WR Pulse Width tCDS,tRD,tWR 80 ns
Data Set-up Time tDS 80 ns
Data Hold Time tDH 40 ns
Access Time tACC 150 ns
Output Hold Time tOH 10 50 ns

C/D

tCDS tCDH

CE

tCE ,tRD,tWR

RD,WR

tDS

D0 to D7
( WRITE)
tDH

D0 to D7
( READ)

tACC tOH

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 12.RELIABILITY
Content of Reliability Test (wide temperature, -20 ~70 )

Environmental Test
Test Item Content of Test Test Condition Note
High Temperature Endurance test applying the high storage 80
2
storage temperature for a long time. 200hrs
Low Temperature Endurance test applying the high storage -30
1,2
storage temperature for a long time. 200hrs
Endurance test applying the electric stress
High Temperature 70
(Voltage & Current) and the thermal stress to ——
Operation 200hrs
the element for a long time.
Low Temperature Endurance test applying the electric stress -20
1
Operation under low temperature for a long time. 200hrs
The module should be allowed to stand at 60
,90%RH max
High Temperature/ For 96hrs under no-load condition excluding 60 ,90%RH
1,2
Humidity Operation the polarizer, 96hrs
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of operation
-20 25 70
Thermal shock -20 /70
——
resistance 10 cycles
30min 5min 30min
1 cycle
Total fixed
amplitude : 1.5mm
Vibration
Frequency :
Endurance test applying the vibration during 10~55Hz
Vibration test 3
transportation and using. One cycle 60
seconds to 3
directions of X,Y,Z
for Each 15
minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to Ω
Static electricity test ——
the terminal. CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.

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13.Backlight Information
CCFL backlight Specification (Ta=25 )
Specification
Item Symbol Unit Condition
Min Typ Max
Driving Voltage VFL 590 Vrms

Input current IFL 5.0 5.5 6.0 mArms

Luminance L 879 Cd/m2 φ,θ=0 deg, IFL =5.5mArms

x 0.321
Chromaticity
y 0.376
Luminance
Uniformity 75% % φ,θ=0 deg, IFL =5.5mArms
(Testing 9 point)
Life time 17000 hrs

CCFL B\L drives directly from A , K.

Inverter
DC/AC

A
B/L
K

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14. Inspection specification
NO Item Criterion AQL
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical
01 1.4 No function or no display. 0.65
Testing
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
Black or
white spots 2.1 White and black spots on display 0.25mm, no more
02 on than three white or black spots present. 2.5
LCD(display 2.2 Densely spaced: No more than two spots or lines within
only) 3mm
3.1 Round type : As following drawing
Φ=( x + y ) / 2 SIZE Acceptable Q
TY
Φ 0.10 Accept no
dense
2.5
0.10 2
Φ 0.20
LCD black 0.20 1
spots, white Φ 0.25
spots,
03 0.25 Φ 0
contaminatio
3.2 Line type : (As following drawing)
n
(non-display) Length Width Acceptable Q
TY
--- W 0.02 Accept no dense
L 3.0 0.02 2.5
W 0.03
2
L 2.5 0.03
W 0.05
--- 0.05 W As round type

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 If bubbles are visible, Size Φ Acceptable Q
judge using black spot TY
specifications, not easy Φ 0.20 Accept no dense
Polarizer to find, must check in 0.20 3
04 2.5
bubbles specify direction. Φ 0.50
0.50 2
Φ 1.00
1.00 Φ 0
Total Q TY 3

NO Item Criterion AQL

05 Scratches Follow NO.3 LCD black spots, white spots, contamination

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 Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width x: Chip length

Z 1/2t Not over viewing x 1/8a
area
Chipped
06
glass 1/2t z 2t Not exceed 1/3k x 1/8a 2.5
If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length

Z 1/2t Not over viewing x 1/8a
area

1/2t z 2t Not exceed 1/3k x 1/8a

If there are 2 or more chips, x is the total length of each
chip.

NO Item Criterion AQL

40 46 www.sycelectronica.com.ar
 Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness

y 0.5mm x 1/8a 0 z t
6.2.2 Non-conductive portion:

Glass
06 2.5
crack

y: Chip width x: Chip length z: Chip

thickness
y L x 1/8a 0 z t
If the chipped area touches the ITO terminal, over 2/3 of
the ITO must remain and be inspected according to
electrode terminal specifications.
If the product will be heat sealed by the customer, the
alignment mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length
y 1/3L x a

NO Item Criterion AQL

41 46 www.sycelectronica.com.ar
 Cracked
07 The LCD with extensive crack is not acceptable. 2.5
glass

8.1 Illumination source flickers when lit.

0.65
8.2 Spots or scratched that appear when lit must be
Backlight 2.5
08 judged. Using LCD spot, lines and contamination
elements
standards.
0.65
8.3 Backlight doesn’t light or color wrong.

9.1 Bezel may not have rust, be deformed or have

fingerprints, stains or other contamination. 2.5
09 Bezel
9.2 Bezel must comply with job specifications. 0.65

10.1 COB seal may not have pinholes larger than

0.2mm or contamination. 2.5
10.2 COB seal surface may not have pinholes
through to the IC. 2.5
10.3 The height of the COB should not exceed the height 0.65
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside 2.5
the seal area on the PCB. And there should be no more
than three places.
10.5 No oxidation or contamination PCB terminals. 2.5
10.6 Parts on PCB must be the same as on the production 0.65
10 PCB COB characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the 0.65
product characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad 2.5
or screw hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of 2.5
PCB
X
Y
X * Y<=2mm2

11.1 No un-melted solder paste may be present on 2.5

the PCB. 2.5
11.2 No cold solder joints, missing solder
11 Soldering
connections, oxidation or icicle. 2.5
11.3 No residue or solder balls on PCB. 0.65
11.4 No short circuits in components on PCB.

42 46 www.sycelectronica.com.ar
 NO Item Criterion AQL

12.1 No oxidation, contamination, curves or, bends on 2.5

interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP. 0.65
12.3 No contamination, solder residue or solder balls 2.5
on product. 2.5
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it cause 2.5
the interface pin to sever.
General
12 12.6 The residual rosin or tin oil of soldering 2.5
appearance
(component or chip component) is not burned into 0.65
brown or black color. 0.65
12.7 Sealant on top of the ITO circuit has not hardened. 0.65
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins. 0.65
12.10 Product packaging must the same as specified
on packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.

15. Material List of Components for RoHs

43 46 www.sycelectronica.com.ar
1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.

Exhibit A The Harmful Material List

.

Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs

Limited 100 1000 1000 1000 1000 1000

Value ppm ppm ppm ppm ppm ppm

Above limited value is set up according to RoHS.

2.Process for RoHS requirement

(1) Use the Sn/Ag/Cu soldering surface the surface of Pb-free solder is rougher than we used
before.
(2) Heat-resistance temp.
Reflow 250 ,30 seconds Max.
Connector soldering wave or hand soldering 320 , 10 seconds max.
(3) Temp. curve of reflow, max. Temp. 235±5
Recommended customer’s soldering temp. of connector 280 , 3 seconds.

winstar LCM Sample Estimate Feedback Sheet

44 46 www.sycelectronica.com.ar
Module Number Page: 1
1 Panel Specification
1. Panel Type Pass NG ,
2. View Direction Pass NG ,
3. Numbers of Dots Pass NG ,
4. View Area Pass NG ,
5. Active Area Pass NG ,
6. Operating Temperature Pass NG ,
7. Storage Temperature Pass NG ,
8. Others
2 Mechanical
1. PCB Size Pass NG ,
2. Frame Size Pass NG ,
3. Materal of Frame Pass NG ,
4. Connector Position Pass NG ,
5. Fix Hole Position A Pass NG ,
6. Backlight Position Pass NG ,
7. Thickness of PCB Pass NG ,
8. Height of Frame to Pass NG ,
9. Height of Module Pass NG ,
Others Pass NG ,
3 Relative Hole Size
1. Pitch of Connector Pass NG ,
2. Hole size of Connector Pass NG ,
3. Mounting Hole size Pass NG ,
4. Mounting Hole Type Pass NG ,
5. Others Pass NG ,
4 Backlight Specification
1. B/L Type Pass NG ,
2. B/L Color Pass NG ,
3. B/L Driving Voltage (Reference for LED Pass NG ,
)
4. B/L Driving Current Pass NG ,
5. Brightness of B/L Pass NG ,
6. B/L Solder Method Pass NG ,
7. Others Pass NG ,
Go to page 2

winstar

45 46 www.sycelectronica.com.ar
Module Number Page: 2
5 Electronic Characteristics of Module
1. Input Voltage Pass NG ,
2. Supply Current Pass NG ,
3. Driving Voltage for LCD Pass NG ,
4. Contrast for LCD Pass NG ,
5. B/L Driving Method Pass NG ,
6. Negative Voltage Output Pass NG ,
7. Interface Function Pass NG ,
8. LCD Uniformity Pass NG ,
9. ESD test Pass NG ,
10. Others Pass NG ,
6 Summary

Sales signature
Customer Signature Date / /

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