Koneru Lakshmaiah Education Foundation: Department of Electronics and Communication Engineering
Koneru Lakshmaiah Education Foundation: Department of Electronics and Communication Engineering
Analog VLSI Design is a course offered to create students who are academically and
practically skilled in designing analog circuits which are required as building blocks for the
real time applications. During this course, the students will learn about the process of
analyzing the different parameters of a circuit by varying different loads and different
configurations. This course provides insights to amplifiers, Op-amps and mixer circuits.
2. Aim
To learn the effects of short channel MOSFETs through various secondary effects.
Apply the fundamentals of MOS transistors for the design of single stage amplifiers.
Realize the active & passive current Mirrors and analyze the differential amplifiers
with qualitative and quantative approaches.
Analyze the CMOS Op Amps, and various types of Op Amps with qualitative and
quantative approaches.
Analyze the high frequency response of CS, CG and CD amplifiers and noise analysis
of various amplifiers and mixers.
CO1: Apply the fundamentals of MOS transistors for the design of single stage amplifiers.
6. Session Introduction
The session provides insights to learn the reason for the existence of secondary effects of
MOSFET and their consequences on the function of MOSFET.
7. Session description
We have studied until now that for a MOSFET operating in saturation, the drain current is
independent of the drain-to-source voltage 𝑉𝐷𝑆 i.e.
The pinch-off point moves towards the source with the increase in VDS.
This modulation of channel length (L) by VDS is known as channel-length modulation and
leads to slight dependence of 𝐼𝐷 on VDS.
(1)
The decrease in channel length with increase in VDS essentially increases the drain current ID
(3)
• In discrete circuit usually there is no body effect as the body is connected to the
source terminal.
• Thus, if we were to tie (connect) all the MOSFET source terminals to the single body
terminal, we would be connecting all the MOSFET source terminals to each other.
• Therefore, for integrated circuits, the MOSFET source terminals are not connected to
the substrate body.
• Actually, the substrate is connected to the most negative power supply for NMOS
circuit for achieving the desired functionality from the device.
• In such a scenario, what happens if the bulk voltage drops below the source voltage?
• Now the voltage 𝑽𝑺𝑩(voltage source-to-body) is not necessarily equal to zero (i.e.,
𝑉𝑆𝐵 ≠ 0 ). Thus, we are back to a four-terminal MOSFET device.
• There are many ramifications of this body effect; perhaps the most significant is
• As VB becomes negative, more holes get attracted to the substrate which leaves a
larger negative charge behind and as a result the depletion region becomes wider.
• The wider depletion region leads to increase in threshold voltage given by:
(4)
• Various breakdown occurs if their terminal voltage differences exceed certain limits
• In short-channel devices, an excessively large VDS can widen the depletion region
around the drain so much that it touches that around the source, creating a very large
drain current results in punch through.
Description: In low-power IC designs, the body effect plays a crucial role in threshold
voltage modulation. A case study could involve analyzing the impact of body biasing
techniques on the threshold voltage of MOSFETs in order to optimize power consumption
and performance. By leveraging body biasing, designers can dynamically adjust the threshold
voltage and enhance circuit efficiency in portable devices with varying power requirements.
9. Examples & contemporary extracts of articles/ practices to convey the idea of the
session
1. Which of the following secondary effects occurs when a MOSFET is operated at high
temperatures?
c) Thermal runaway
d) Avalanche breakdown
a) Substrate biasing
b) Body effect
d) Avalanche breakdown
4. Which secondary effect can lead to a decrease in the MOSFET's threshold voltage?
a) Hot carrier injection
a) Latch-up
b) Body effect
d) Avalanche breakdown
b) Punch-through breakdown
c) Body effect
d) Avalanche breakdown
7. Which secondary effect can result in increased off-state leakage current in a MOSFET?
d) Body effect
b) Substrate biasing
d) Avalanche breakdown
9. Which secondary effect is responsible for the decrease in threshold voltage with decreasing
gate length?
d) Body effect
10. Which effect can lead to an increase in the MOSFET's output resistance?
a) Body effect
d) Substrate biasing
a) Impact ionization
12. Which secondary effect can cause a decrease in the MOSFET's transconductance?
a) Body effect
13. Which effect is responsible for the increase in drain current with increasing drain voltage
in a MOSFET?
a) Body effect
d) Avalanche breakdown
15. Which secondary effect can lead to an increase in the MOSFET's on-resistance?
a) Body effect
d) Substrate biasing
d) Substrate biasing
17. Which secondary effect can cause a shift in the MOSFET's threshold voltage over time?
c) Body effect
a) Miller effect
b) Body effect
d) Avalanche breakdown
19. Which secondary effect can lead to an increase in the MOSFET's gate leakage current?
b) Body effect
c) Hot carrier injection
d) Substrate biasing
20. Which effect can cause a reduction in the MOSFET's breakdown voltage?
c) Body effect
11. Summary
Channel length modulation (CLM) is an effect in field effect transistors, a shortening of the
length of the inverted channel region with increase in drain bias for large drain biases. The
result of CLM is an increase in current with drain bias and a reduction of output resistance.
The body effect is the change in the threshold voltage by an amount approximately equal to
the change in the source-bulk voltage, , because the body influences the threshold voltage
(when it is not tied to the source)
1. What are the second-order effects of MOSFETs and how do they impact circuit
performance?
2. Explain the body effect (back-gate effect) in MOSFETs and its implications on threshold
voltage and transconductance.
3. Discuss the impact of channel length modulation on MOSFET characteristics and how it
affects device behavior in saturation region.
4. What is the impact of drain-induced barrier lowering (DIBL) on MOSFET performance
and how does it affect subthreshold characteristics?
5. Describe the effects of substrate biasing
6. How does the presence of short channel effect behavior of MOSFETs?
7. Discuss the impact of temperature variations on MOSFET parameters.
1. c) Thermal runaway
3. b) Body effect
5. a) Latch-up
8. b) Substrate biasing
15. Glossary
Text Books:
1) BehzadRazavi, “Design of Analog CMOS Integrated Circuits”, Tata Mc Graw Hill, (2005)
2) Jacob Baker, “CMOS Mixed Signal Circuit Design”, John Wiley, (2008)
Reference Books:
1) Neil H. E. Weste and David. Harris Ayan Banerjee, “CMOS VLSI Design” – Pearson
Education, 1999.
2) Gray& Mayer, “Analysis & Design of Analog Integrated Circuits”, 4th edition, Wiley,
(2001).17. Keywords
Web references:
1. https://www.coursera.org/learn/mosfet
2. https://nptel.ac.in/courses/108106068
3. https://www.coursera.org/learn/rf-mmwave-circuit-design#syllabus
17. Keywords