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Kohyoung aSPIre

The document discusses Koh Young Technology's 3D solder paste inspection (SPI) system. It highlights the system's key advantages over other SPI technologies, including true 3D volume measurement without shadows or false calls. This allows for more accurate measurement of increasingly smaller solder paste deposits and optimization of solder paste printing processes. The system specifications are also provided.

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927 views

Kohyoung aSPIre

The document discusses Koh Young Technology's 3D solder paste inspection (SPI) system. It highlights the system's key advantages over other SPI technologies, including true 3D volume measurement without shadows or false calls. This allows for more accurate measurement of increasingly smaller solder paste deposits and optimization of solder paste printing processes. The system specifications are also provided.

Uploaded by

Vin2885
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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The New Dimension in Solder Paste Inspection

The Standard in 3D Measurement & Inspection

More than Inspection - Its Process Optimization


Most defects that impact yields occur in the solder paste printing process. You cant optimize your process and maintain high yields if your SPI technology is unreliable or cant see the problems.

True patented 3D volume measurement No false calls - no escapes - no shadows Highest accuracy and repeatability No PCB color sensitivity - for accurate readings always! Solder paste printing optimization - at its best High speed - with low cost of ownership! Short programming time Powerful SPC package

Three Dimensions of View - Not Two Accurate, reliable measurement of solder paste deposits requires true three-dimensional inspection technology. Anything less just isnt good enough for todays increasingly smaller paste volumes. Only Koh Young Technology brings you the third dimension of measurement reliably using our patented shadow-free technology. No more false calls. No escapes.

True 3D Solder Paste Volume Measurement - its Critical As solder paste deposit volumes become smaller, absolutely correct volume and the verification of that volume becomes even more critical. The process window for printing narrows. Maintaining high yields requires process optimization and constant maintenance.

The smaller the solder paste deposit, the more difficult to measure. Koh Youngs patented 3D shadow-free technology does what other SPI systems cannot do. It delivers true, reliable, whole-deposit measurement for even the smallest paste deposits, at in-line speed.

555 mm / 21.85 inch

898 mm / 35.35 inch Front-Fix

970 mm / 38.19 inch W = 1000 mm / 39.37 inch

373 mm 14.69 inch Electr. Supply & Air Supply D = 1230 mm / 48.43 inch Electr. Supply & Air Supply

Max. PCB Size 510 x 510 mm 20.08 x 20.08 inch Min. PCB Size 50 x 50 mm 1.97 x 1.97 inch PCB Thickness 0.4 ~ 5.0 mm 0.016 ~ 0.20 inch Max. PCB Weight 2.0 kg 4.4 lbs Machine Weight 600 kg 1320 lbs Bottom Side Clearance 30 mm 1.18 inch

H = 1542 mm / 60.71 inch PCB Height 950 mm / 37.40 inch

PCB Transfer Height 970 ~ 870 mm / 38.19 ~ 34.25 inch

In-line Inspection Speed For true automated manufacturing integration - 41 cm2/sec - without compromising accuracy.

Rapid Programming Less than 10 min. programming for a complete inspection file, with NO fine tuning needed.

Accurate Compliance Solution The only way to guarantee correct solder joint volume per IPC 610 requirements.

Best SPI Measurement Performance <<10% GR&R on 01005 deposits. Volume repeatability < 1% at 3 on a KY calibration target. Average volume repeatability < 3% at 3 on a PCB.

Warped PCBs? No Problem! Unique real-time warpage tracking hardware and software ensures uninterrupted inspection of warped boards up to 5 mm.

Detect all Defects Including insufficient and excessive deposits, shape deformation, missing paste, paste offset, smearing, bridging and more.

980 mm / 38.58 inch

1375 mm / 54.13 inch

Koh Young Technology Inc. (Headquarters) 14F, ACE Techno X, 470-5 Gasan-dong, Geumcheon-gu, Seoul, Korea (153-789) Tel. +82-2-6670-5000 / Fax. +82-2-6670-5001 E-mail: [email protected] Manufacturing & Training Center 7F, JEI-PLATZ Bldg, 49 Gasan Digital 1 gil, Gasan-dong, Geumcheon-gu, Seoul, Korea (153-789)

www.kohyoung.com

SPECIFICATIONS
Inspection Range Metrology Capability Types of Defects Measurement Principle Camera Technology Camera XY Pixel Resolution Z Resolution Inspection Performance Inspection Speed at 20 m Volume Repeatability (on a KY Calibration Target) Volume Repeatability (on a PCB) Height Accuracy (on a KY Calibration Target) Gage R&R ( 50 tolerance) Max. PCB Warp Compensation Max. Paste Height Min. Paste Deposit Size at 20 m Rectangle Circle Min. Distance between Paste Deposit PCB Handling Conveyor Width Adjustment Conveyor Fix Type Conveyor Height System & Installation requirements Supply Operating System S/W Statistical Analysis Tool Inspection Program Generation Options Volume, Area, Height, Offset, Bridging and Shape Deformity Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset 3D Shadow Free Moir 4MPix 10/15/20 m (Factory Setting) 0.37m 41 cm2/sec < 1% at 3 < 3% at 3 2 m << 10 % at 6 on 01005 deposits 5.0 mm 400 m 150 m 200 m 100 m (at 150 m paste height) Automatic Front/Rear Fixed (Factory Setting) 970 ~ 870 mm (Standard) 930 ~ 830 mm (Factory Setting)

0.39/0.59/0.79 mils (Factory Setting) 0.015 mils 6.36 sq. inch/sec

0.20 inch 15.75 mils 5.91 mils 7.87 mils 3.94 mils (at 5.91 mils paste height)

38.19 ~ 34.25 inch (Standard) 36.61 ~ 32.68 inch (Factory Setting)

Electrical Air

200 ~ 240VAC, 50/60 Hz Single phase 5 Kgf/cm2 Windows XP Professional SPC Plus Import GERBER Data (274X, 274D) Zoom Head (10, 15, 20 m Autozoom) Off-line SPC & Defect Review Station Flexible Dual Lane Off-line Programming Station ODB++ File Conversion Barcode Reader (1D/2D) HDD Raid 1 (Mirrored) Certified Calibration Target UPS
Above specifications are subject to change whithout notice.

Koh Young Technology Inc. 2008

aSPIre-B-08-2008-E

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