M27C4001

4 Mbit (512Kb x 8) UV EPROM and OTP EPROM

Feature summary
■ 5V ± 10% supply voltage in Read operation
■ Access time: 35ns
■ Low power consumption: 32
– Active Current 30mA at 5MHz
– Standby Current 100µA 1
■ Programming voltage: 12.75V ± 0.25V
FDIP32W (F)
■ Programming time: 100µs/Word
■ Electronic signature
– Manufacturer Code: 20h
– Device Code: 41h
32
■ Packages
– ECOPACK® compliant versions
1

PDIP32 (B)

PLCC32 (C)

TSOP32 (N) 8 x 20 mm

March 2006 Rev 4 1/24

www.st.com 1
Contents M27C4001

Contents

1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24
M27C4001 List of tables

List of tables

Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 7. Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 11. Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18
Table 13. PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19
Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20
Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 21
Table 16. Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3/24
List of figures M27C4001

List of figures

Figure 1. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18
Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19
Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20
Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 21

4/24
M27C4001 Summary description

1 Summary description

The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organised as 524,288 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C4001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 1. Logic Diagram

VCC VPP

19 8
A0-A18 Q0-Q7

E M27C4001

VSS
AI00721B

Table 1. Signal names

A0-A18 Address Inputs
Q0-Q7 Data Outputs
E Chip Enable
G Output Enable
VPP Program Supply
VCC Supply Voltage
VSS Ground

5/25
Summary description M27C4001

Figure 2. DIP Connections

VPP 1 32 VCC
A16 2 31 A18
A15 3 30 A17
A12 4 29 A14
A7 5 28 A13
A6 6 27 A8
A5 7 26 A9
A4 8 25 A11
M27C4001
A3 9 24 G
A2 10 23 A10
A1 11 22 E
A0 12 21 Q7
Q0 13 20 Q6
Q1 14 19 Q5
Q2 15 18 Q4
VSS 16 17 Q3
AI00722

Figure 3. LCC Connections

VCC
VPP
A12
A15
A16

A18
A17

1 32
A7 A14
A6 A13
A5 A8
A4 A9
A3 9 M27C4001 25 A11
A2 G
A1 A10
A0 E
Q0 Q7
17
Q1
Q2
VSS
Q3
Q4
Q5
Q6

AI00723

6/25
M27C4001 Summary description

Figure 4. TSOP Connections

A11 1 32 G
A9 A10
A8 E
A13 Q7
A14 Q6
A17 Q5
A18 Q4
VCC 8 M27C4001 25 Q3
VPP 9 (Normal) 24 VSS
A16 Q2
A15 Q1
A12 Q0
A7 A0
A6 A1
A5 A2
A4 16 17 A3
AI01155B

7/25
Device operation M27C4001

2 Device operation

The operating modes of the M27C4001 are listed in the Operating Modes table. A single
power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V
on A9 for Electronic Signature.

2.1 Read Mode

The M27C4001 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is
available at the output after a delay of tGLQV from the falling edge of G, assuming that E has
been low and the addresses have been stable for at least tAVQV-tGLQV.

2.2 Standby Mode

The M27C4001 has a standby mode which reduces the supply current from 30mA to 100µA.
The M27C4001 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
the G input.

2.3 Two Line Output Control

Because EPROMs are usually used in larger memory arrays, this product features a 2 line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
a) the lowest possible memory power dissipation,
b) complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.

8/25
M27C4001 Device operation

2.4 System Considerations

The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, ICC, has three segments that are of interest to
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between VCC and VSS for every eight devices. The bulk capacitor should be located near the
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.

2.5 Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C4001 are in the
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.
Although only '0's will be programmed, both '1's and '0's can be present in the data word.
The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The
M27C4001 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is
pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output
pins. The levels required for the address and data inputs are TTL. VCC is specified to be
6.25V ± 0.25V.

2.6 PRESTO II Programming Algorithm

PRESTO II Programming Algorithm allows the whole array to be programmed with a
guaranteed margin, in a typical time of 52.5 seconds. Programming with PRESTO II
consists of applying a sequence of 100µs program pulses to each byte until a correct verify
occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is
automatically activated in order to guarantee that each cell is programmed with enough
margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the
necessary margin to each programmed cell.

9/25
Device operation M27C4001

Figure 5. Programming Flowchart

VCC = 6.25V, VPP = 12.75V

n=0

E = 100µs Pulse

NO

++n NO
= 25 VERIFY ++ Addr

YES YES

Last NO
FAIL Addr

YES

CHECK ALL BYTES

1st: VCC = 6V
2nd: VCC = 4.2V

AI00760B

2.7 Program Inhibit

Programming of multiple M27C4001s in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C4001 may be
common. A TTL low level pulse applied to a M27C4001's E input, with VPP at 12.75V, will
program that M27C4001. A high level E input inhibits the other M27C4001s from being
programmed.

2.8 Program Verify

A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and
VCC at 6.25V.

2.9 Electronic Signature

The Electronic Signature (ES) mode allows the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C4001. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C4001 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to VIH. All other address lines must be
held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer
code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics
M27C4001, these two identifier bytes are given in Table 3 and can be read-out on outputs
Q7 to Q0.

10/25
M27C4001 Device operation

2.10 Erasure operation (applies to UV EPROM)

The erasure characteristics of the M27C4001 are such that erasure begins when the cells
are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Data shows that constant exposure to room level fluorescent lighting could erase a
typical M27C4001 in about 3 years, while it would take approximately 1 week to cause
erasure when exposed to direct sunlight. If the M27C4001 is to be exposed to these types of
lighting conditions for extended periods of time, it is suggested that opaque labels be put
over the M27C4001 window to prevent unintentional erasure. The recommended erasure
procedure for the M27C4001 is exposure to short wave ultraviolet light which has
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C4001
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.

Table 2. Operating Modes(1)

Mode E G A9 Vpp Q7 - Q0

Read VIL VIL X VCC or VSS Data Out

Output Disable VIL VIH X VCC or VSS Hi-Z
Program VIL Pulse VIH X VPP Data In
Verify VIH VIL X VPP Data Out
Program Inhibit VIH VIH X VPP Hi-Z
Standby VIH X X VCC or VSS Hi-Z
Electronic Signature VIL VIL VID VCC Codes
1. X = VIH or VIL, VID = 12V ± 0.5V.

Table 3. Electronic Signature

Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data

Manufacturer’s
VIL 0 0 1 0 0 0 0 0 20h
Code
Electronic
VIH 0 1 0 0 0 0 0 1 41h
Signature

11/25
Maximum rating M27C4001

3 Maximum rating

Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.

Table 4. Absolute Maximum Ratings

Symbol Parameter Value Unit

TA Ambient Operating Temperature(1) –40 to 125 °C

TBIAS Temperature Under Bias –50 to 125 °C
TSTG Storage Temperature –65 to 150 °C
VIO(2) Input or Output Voltage (except A9) –2 to 7 V
VCC Supply Voltage –2 to 7 V
VA9(2) A9 Voltage –2 to 13.5 V
VPP Program Supply Voltage –2 to 14 V
1. Depends on range.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period
less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC
+2V for a period less than 20ns.

12/25
M27C4001 DC and AC parameters

4 DC and AC parameters

This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.

Table 5. AC Measurement Conditions

High Speed Standard

Input Rise and Fall Times ≤10ns ≤20ns

Input Pulse Voltages 0 to 3V 0.4 to 2.4V
Input and Output Timing Ref. Voltages 1.5V 0.8 and 2V

Figure 6. AC Testing Input Output Waveform

High Speed

3V

1.5V

0V

Standard

2.4V
2.0V

0.8V
0.4V

AI01822

Figure 7. AC Testing Load Circuit

1.3V

1N914

3.3kΩ

DEVICE
UNDER OUT
TEST
CL

CL = 30pF for High Speed

CL = 100pF for Standard
CL includes JIG capacitance AI01823B

13/25
DC and AC parameters M27C4001

Table 6. Capacitance (1) (2)

Symbol Parameter Test Condition Min Max Unit

CIN Input Capacitance VIN = 0V 6 pF

COUT Output Capacitance VOUT = 0V 12 pF
1. TA = 25 °C, f = 1 MHz.
2. Sampled only, not 100% tested.
.
Table 7. Read Mode DC Characteristics(1) (2)
Symbol Parameter Test Condition Min Max Unit

ILI Input Leakage Current 0V ≤VIN ≤VCC ±10 µA

ILO Output Leakage Current 0V ≤VOUT ≤VCC ±10 µA
E = VIL, G = VIL,
ICC Supply Current 30 mA
IOUT = 0mA, f = 5MHz
ICC1 Supply Current (Standby) TTL E = VIH 1 mA
Supply Current (Standby)
ICC2 E > VCC – 0.2V 100 µA
CMOS
IPP Program Current VPP = VCC 10 µA
VIL Input Low Voltage –0.3 0.8 V
VIH(3) Input High Voltage 2 VCC + 1 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
Output High Voltage TTL IOH = –400µA 2.4 V
VOH
Output High Voltage CMOS IOH = –100µA VCC – 0.7V V
1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP..
3. Maximum DC voltage on Output is VCC +0.5V.

Table 8. Programming Mode DC Characteristics (1) (2)

Symbol Parameter Test Condition Min Max Unit

ILI Input Leakage Current 0 ≤VIN ≤VCC ±10 µA

ICC Supply Current 50 mA
IPP Program Current E = VIL 50 mA
VIL Input Low Voltage –0.3 0.8 V
VIH Input High Voltage 2 VCC + 0.5 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
VOH Output High Voltage TTL IOH = –400µA 2.4 V
VID A9 Voltage 11.5 12.5 V
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

14/25
M27C4001 DC and AC parameters

Figure 8. Read Mode AC Waveforms

A0-A18 VALID VALID

tAVQV tAXQX

tEHQZ
tGLQV

tELQV tGHQZ

Hi-Z
Q0-Q7

AI00724B

Table 9. Read Mode AC Characteristics(1) (2)

M27C4001

Symbol Alt Parameter Test Condition -35(3) -45(3) -55(3) Unit

Min Max Min Max Min Max

Address Valid to
tAVQV tACC E = VIL, G = VIL 35 45 55 ns
Output Valid
Chip Enable Low to
tELQV tCE G = VIL 35 45 55 ns
Output Valid
Output Enable Low
tGLQV tOE E = VIL 20 25 30 ns
to Output Valid
Chip Enable High to
tEHQZ(4) tDF G = VIL 0 30 0 30 0 30 ns
Output Hi-Z
Output Enable High
tGHQZ(4) tDF E = VIL 0 30 0 30 0 30 ns
to Output Hi-Z
Address Transition
tAXQX tOH E = VIL, G = VIL 0 0 0 ns
to Output Transition
1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Speed obtained with High Speed AC measurement conditions.
4. Sampled only, not 100% tested.

15/25
DC and AC parameters M27C4001

Table 10. Read Mode AC Characteristics(1) (2)

M27C4001

Symbol Alt Parameter Test Condition -70 -80/-90 -10/-12/-15 Unit

Min Max Min Max Min Max

Address Valid to
tAVQV tACC E = VIL, G = VIL 70 80 100 ns
Output Valid
Chip Enable Low to
tELQV tCE G = VIL 70 80 100 ns
Output Valid
Output Enable Low
tGLQV tOE E = VIL 35 40 50 ns
to Output Valid
Chip Enable High to
tEHQZ(3) tDF G = VIL 0 30 0 30 0 30 ns
Output Hi-Z
Output Enable High
tGHQZ(3) tDF E = VIL 0 30 0 30 0 30 ns
to Output Hi-Z
Address Transition
tAXQX tOH E = VIL, G = VIL 0 0 0 ns
to Output Transition
1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.

16/25
M27C4001 DC and AC parameters

Figure 9. Programming and Verify Modes AC Waveforms

A0-A18 VALID

tAVPL

Q0-Q7 DATA IN DATA OUT

tQVEL tEHQX

VPP

tVPHEL tGLQV tGHQZ

VCC

tVCHEL tGHAX

E
tELEH tQXGL

PROGRAM VERIFY
AI00725

Table 11. Programming Mode AC Characteristics(1) (2) (3)

Symbol Alt Parameter Test Condition Min Max Unit

tAVEL tAS Address Valid to Chip Enable Low 2 µs

tQVEL tDS Input Valid to Chip Enable Low 2 µs
tVPHEL tVPS VPP High to Chip Enable Low 2 µs
tVCHEL tVCS VCC High to Chip Enable Low 2 µs
tELEH tPW Chip Enable Program Pulse Width 95 105 µs
tEHQX tDH Chip Enable High to Input Transition 2 µs
tQXGL tOES Input Transition to Output Enable Low 2 µs
tGLQV tOE Output Enable Low to Output Valid 100 ns
tGHQZ tDFP Output Enable High to Output Hi-Z 0 130 ns
Output Enable High to Address
tGHAX tAH 0 ns
Transition
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.

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Package mechanical M27C4001

5 Package mechanical

Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline

A2 A3 A

A1 L α
B1 B e C
eA
D2
eB
D
S
N

∅ E1 E

1
FDIPW-a

1. Drawing is not to scale.

Table 12. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical
data
millimeters inches
Symbol
Typ Min Max Typ Min Max

A 5.72 0.225
A1 0.51 1.40 0.020 0.055
A2 3.91 4.57 0.154 0.180
A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022
B1 1.45 – – 0.057 – –
C 0.23 0.30 0.009 0.012
D 41.73 42.04 1.643 1.655
D2 38.10 – – 1.500 – –
e 2.54 – – 0.100 – –
E 15.24 – – 0.600 – –
E1 13.06 13.36 0.514 0.526
eA 14.99 – – 0.590 – –
eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
N 32 32
S 1.52 2.49 0.060 0.098
Ø 7.11 – – 0.280 – –
α 4° 11° 4° 11°

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M27C4001 Package mechanical

Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline

A2 A

A1 L α
b1 b e c
eA
D2

D
S
N

E1 E

1
PDIP-C

1. Drawing is not to scale.

Table 13. PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data
millimeters inches
Symbol
Typ Min Max Typ Min Max

A 4.83 0.190
A1 0.38 0.015
A2 3.81 0.150
b 0.41 0.53 0.016 0.021
b1 1.14 1.65 0.045 0.065
c 0.23 0.38 0.009 0.015
D 41.78 42.29 1.645 1.665
eA 15.24 – – 0.600 – –
e 2.54 – – 0.100 – –
E 15.24 15.88 0.600 0.625
E1 13.46 13.97 0.530 0.550
S 1.65 2.21 0.065 0.087
L 3.05 3.56 0.120 0.140
α 0° 15° 0° 15°
N 32 32

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Package mechanical M27C4001

Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline
D A1
D1 A2

1 N
B1
E2

e
E3 E1 E F
B
0.51 (.020) E2

1.14 (.045)

D3 A

R CP

D2 D2
PLCC-A

1. Drawing is not to scale.

Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data
millimeters inches
Symbol
Typ Min Max Typ Min Max

A 3.18 3.56 0.125 0.140

A1 1.53 2.41 0.060 0.095
A2 0.38 – 0.015 –
B 0.33 0.53 0.013 0.021
B1 0.66 0.81 0.026 0.032
CP 0.10 0.004
D 12.32 12.57 0.485 0.495
D1 11.35 11.51 0.447 0.453
D2 4.78 5.66 0.188 0.223
D3 7.62 – – 0.300 – –
E 14.86 15.11 0.585 0.595
E1 13.89 14.05 0.547 0.553
E2 6.05 6.93 0.238 0.273
E3 10.16 – – 0.400 – –
e 1.27 – – 0.050 – –
F 0.00 0.13 0.000 0.005
R 0.89 – – 0.035 – –
N 32 32

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M27C4001 Package mechanical

Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline

A2

1 N
e

B
N/2

D1 A
D CP

DIE

TSOP-a A1 α L

1. Drawing is not to scale.

Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package
Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max

A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 0.950 1.050 0.0374 0.0413
B 0.170 0.250 0.0067 0.0098
C 0.100 0.210 0.0039 0.0083
CP 0.100 0.0039
D 19.800 20.200 0.7795 0.7953
D1 18.300 18.500 0.7205 0.7283
e 0.500 – – 0.0197 – –
E 7.900 8.100 0.3110 0.3189
L 0.500 0.700 0.0197 0.0276
N 32 32
α 0° 5° 0° 5°

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Part numbering M27C4001

6 Part numbering

Table 16. Ordering Information Scheme

Example: M27C4001 -45 X C 1

Device Type
M27

Supply Voltage
C = 5V

Device Function
4001 = 4 Mbit (512Kb x 8)

Speed
-35(1) = 35 ns
-45(1) = 45 ns
-55(1) = 55 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns

VCC Tolerance
blank = ± 10%
X = ± 5%

Package
F = FDIP32W
B = PDIP32
C = PLCC32
N = TSOP32: 8 x 20 mm

Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
1. High Speed, see AC Characteristics section for further information.

For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.

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M27C4001 Revision history

7 Revision history

Table 17. Document revision history

Date Revision Changes

July 1998 1 First Issue

09/25/00 2 AN620 Reference removed
11/29/00 3 PLCC codification changed (Table 16.)
Document converted to new template (sections added, information
moved). LCCC32W package removed. Package specifications
28-Mar-2006 4 updated (see Section 5: Package mechanical). Packages are
ECOPACK® compliant. X and TR options removed from Table 16:
Ordering Information Scheme.

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 M27C4001

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