AB - DIDO - User Manual - EN - 01
AB - DIDO - User Manual - EN - 01
M572AB000y / AB_DIDO
User Manual
This manual provides information for the assembly, wiring, configuration and
maintenance of the AB_DIDO module.
SE-M572-USR
www.schneider-electric.com
24/03/2020 User Manual – AB_DIDO
Change Control
Rev Date Description
01 24-03-2020 Initial edition.
General Information
The Saitel platform and all its components have been developed in accordance to the requirements
for a quality management system, complying with the ISO 9001:2015 Norm.
Reference Documents
User Manual Document Code
Easergy Builder User Manual FTE-MSS-S856
RTU Software
Module
Module Version
Content
Content
1 SAFETY & HEALTH .................................................................................................. 4
1.1 Introduction
1.1.1 Information of Safety
Important information
Read these instructions carefully and look at the equipment to become familiar with the device
before trying to install, operate, service or maintain it. In this manual you can find different types of
messages associated with situations that have different level of risk for people and / or for the
equipment.
DANGER
DANGER indicates a hazardous situation which, if not avoided, will result in death or serious
injury.
WARNING
WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.
NOTICE
NOTICE is used to address practices not related to physical injury. The safety alert symbol shall
not be used with this signal word.
To Keep in Mind
Electrical equipment should be installed, operated, serviced, and maintained only by qualified
personnel. No responsibility is assumed by Schneider Electric for any consequences arising out of
the use of this material.
A qualified person is who fulfill with requirements in paragraph 1.2
1.1.2 Presentation
This manual provides information for a safe handling, commissioning and testing. This Safety
chapter also includes descriptions of the labels on the equipment.
Documentation for equipment ordered from Schneider Electric is dispatched separately from
manufactured goods and may not be received at the same time. Therefore, this guide is provided in
order to do that printed information which may be present on the equipment is fully understood by
the recipient.
The technical data in this safety guide is typical only, see the technical data section of the user
manual for specific details of a particular equipment.
Before carrying out any work on the equipment the user should be familiar with the
contents of this Safety chapter and the ratings on the equipment’s rating label.
THE SAFETY SECTION MUST BE READ BEFORE STARTING ANY WORK ON
THE EQUIPMENT.
WARNING
Before working with the terminal of connection, the device must be turned off and disconnected
of the feeding.
Proper and safe operation of the equipment depends on appropriate shipping and handling, proper
storage, installation and commissioning, and on careful operation, maintenance and servicing. For
this reason, only qualified personnel may work on or operate the equipment.
Qualified personnel are individuals who:
• Are familiar with the installation, commissioning, and operation of the equipment and of the
system to which it is being connected.
• Are able to safely perform switching operations in accordance with accepted safety engineering
practices and are authorized to energize and de-energize equipment and to isolate, ground,
and label it.
• Are trained in the care and use of safety apparatus in accordance with safety engineering
practices.
DANGER
Devices that handle dangerous tensions are marked with a sticker on the front label (size: 12,5
mm). This label must be visible all the time while the module is installed on the DIN rail.
• HU_AF: Advanced head unit with acquisition (P/N M503xx3x0x and P/N M503xx4x0x). For
other part numbers, depending on the voltage handled by the equipment connected to the
digital outputs (voltage > 50 V), this module must be marked with an electric risk label. It will
not be marked on factory.
• AB_DIDO: Input and output digital module (P/N M5722x000x, M5723x000x and M5724x000x).
For other part numbers, depending on the voltage handled by the equipment connected to the
digital outputs (voltage > 50 V), this module must be marked with an electric risk label. It will
not be marked on factory.
• AB_DO: This module does not handle high voltages, it will not be marked at the factory. This
module must be marked to inform about the risk when some equipment that manage voltage
higher than 50 V are connected to digital outputs.
It is recommended to install the RTU inside a cabinet with a key. This cabinet only should be
opened by a qualified person.
WARNING
If this type of cabinet isn't available, a barrier must be installed in order to avoid an accidental
contact with these dangerous elements. This barrier only should can be removed using a
special tool.
If the barrier has to be removed in order to access to equipment, personnel responsible for the
task must be sure that the barrier is installed again when the task is finished.
While the RTU is accessible for a user, all people must follow all instructions to prevent
electrical risk or discharges.
Not following these instructions can give like result that the device do not work properly
or even can damage to the people or devices.
An electrical risk symbol with enough size must be included on the cabinet’s door or
on the barrier.
NOTICE
Terminals will not be accessible to the user directly once it has made the installation of the
device. The cabinet will have to remain closed with key or the screen of installed protection.
The cabinet or installation must have a general switch placed just in the cable entry of the
installation (see paragraph 1.7.1 )
For the cleaning of the device it is only necessary using a dry cloth by the surface when it detects
excessive presence of dust or any element deposited on the surface.
WARNING
You mustn't use a liquid product of cleanliness due to the presence of active parts.
Because of the variety of uses of the product, the managers of the application and use of this
device of control will have to take the measures to ensure the fulfillment of all the requests of
security and provision of each application. The requests do reference to the applicable laws,
regulations, codes and standard.
1.5 Earthing
WARNING
Before energizer the device, it has to be placed to earth properly such as it indicates in sections
1.5.1 and 1.5.2 .
When installing the device, ground is the first thing that should be connected and the last one
that should be disconnected.
• Improve the behavior in EMC and derive perturbations to earth (functional Earth).
The DIN rail must be installed on a metallic surface. This metallic surface must have
available an M4 screw marked with this symbol. The ground of the cabinet or
installation must be connected to this screw, according to the norm IEC 61010-1.
Saitel DR modules have a metallic enclosure offering protection for isolation faults. Earthing is
done by the metal rail fixing clip.
WARNING
All devices with high voltage must be disconnected before dismount a module from the DIN rail.
A dedicated connection with green/yellow wire should be used to assure electric continuity to the
installation protective earth. Section of these wires must be enough in order to support 25 A
(ground bonding test).
Figure 2 – Yellow and Green cable for earthing.
The design and installation of the cabinet is responsible for compliance with all the existing
international and national electrical codes concerning protective grounding of any device.
WARNING
According to Electrical Safety:
NOTICE
The DIN rail must have terminals of earthing (of yellow and green color) necessary to connect
the terminals of PE (if it is present).
All Saitel DR modules with power or polarization connector have an exclusive terminal for earthing
EMC. These modules are HU120, HUe, HU_B, HU_A, HU_AF, XU, AB_DO, AB_DIDO and
AB_SER with external polarization.
Figure 4 – Example of earthing for EMC.
WARNING
The enclosure ONLY should be removed when is strictly necessary, because this action has a
risk for the equipment:
• Before removing the enclosure, the operator must be equipotential with the equipment.
• Avoid touching the electronic. The board must be always manipulated for the edges.
• If the equipment has to be passed between two persons, both must be equipotential.
• Put the module always on an antistatic surface or on a surface equipotential with you.
• During the storage and transport, the module will remain in the packaging.
Not following these instructions can give like result that the device do not work properly
or even can damage to the people or devices.
WARNING
The connection / disconnection switch must be installed in a fixed element (for example the wall
of the cabinet) and it mustn’t break any earthing wire.
• Operation temperature range: Between -40 ºC and 70 ºC. (IEC 60068-2-1 and IEC 60068-2-2).
NOTICE
On the “Technical data” zone, you can see relevant information about the input and output
voltage in the module. Any voltage greater than 50 V must be consider as a high voltage.
Content
• The communication between the controls units integrated in a distributed system is mainly
established by Ethernet.
• The terminal blocks for field-connection are completely built into acquisition blocks.
Figure 6 – Saitel DR.
Saitel DR’s design has been optimized to meet the most demanding requirements of multiple
sectors:
• Safety and reliability requirements for power, gas and water supply, as well as sewage
treatment plants, etc.
• Local monitoring and control with data sharing capabilities of plant-distributed equipments.
WARNING
Please note Saitel DR does not support hot-swapping, that is, module replacements during
operation.
The diagram below illustrates the functional blocks integrated in the AB_DIDO:
Digital Inputs
The AB_DIDO has two blocks of 8 digital inputs plus a common block. Each input can be
configured as:
• Slow counter.
Digital Outputs
The AB_DIDO module contains two terminal blocks for 4 digital outputs each. The main features of
these outputs include:
• The outputs can be: SBO (Select Before Operate) or DO (Direct Operate).
• External polarization.
• Galvanic isolation.
In relation to outputs, and alike the AB_DO module, the AB_DIDO can operate in two modes:
Select Before Operate (SBO) or Direct Operate (DO).
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This block performs a pre-filtering before transmitting the information to the HU through the bus. As
the AB_DI module, it applies a debounce filter to each input and an anti-chattering filter.
When the input changes, it is transmitted to the HU as an event, which includes the value change
and the timestamp. The CPU performs the rest of the processing on digital inputs.
2.3 Interfaces
The AB_DIDO module offers 16 high-precision (1 ms) configurable digital inputs and a digital filter
for each of them. It also integrates 8 digital relay outputs with a high level of security.
• 28 LED indicators.
The following figure shows AB_DIDO module’s front panel:
The figure below illustrates the block diagram which describes the AB_DIDO hardware:
Indications
There are 28 LED indicators on the module’s front panel which provide information about the
module and the input/output signals.
Polarization (B1)
The AB_DIDO digital outputs need an external polarization. The module has a dedicated 24/48 VDC
polarization input terminal.
NOTICE
The 48 VDC version is available for revision C0 and later.
DANGER
HAZARD OF ELECTRIC SHOCK, ELECTRIC ARC OR BURNS
• Only qualified personnel should install this equipment. Such work should be performed
only after reading this entire set of instructions and checking the technical characteristics of
the device.
• NEVER work alone.
• Turn off all power supplying this equipment before working on or inside it. Consider all
sources of power, including the possibility of back feeding.
• Always use a properly rated voltage sensing device to confirm that all power is off.
• Start by connecting the device to the protective earth and to the functional earth.
• Screw tight all terminals, even those not in use.
Failure to follow these instructions will result in death or serious injury.
There are various versions of the AB_DIDO module depending on the polarization for the digital
inputs. These versions are included in the module’s technical specifications table.
The module has two terminal blocks labeled as B4 and B5 which allow the 16 digital inputs to be
connected through screw terminals. Both terminal blocks support 8 inputs each. The signals DI 1 to
DI 8 are connected to B4 and the signals DI 9 to DI 16 are connected to B5.
Content
3 PHYSICAL MOUNTING & INSTALLING ................................................................ 20
3.1.1 Handling
DANGER
Depending on the devices connected to the module AB_DIDO, could exist hazard of
electric chock, electric arc or burns. For any of these cases, follow these instructions:
• Only qualified operator should install this equipment. Such work should be performed only
after reading this entire set of instructions and checking the technical characteristics of the
device.
• NEVER work alone.
• Turn off all power supplying this equipment before working on or inside it. Consider all
sources of power, including the possibility of back feeding.
• Always use a properly rated voltage sensing device to confirm that all power is off.
• Start by connecting the device to the protective ground and to the functional ground.
• Screw tight all terminals, even those not in use.
Failure to follow these instructions will result in death or serious injury.
WARNING
Electrostatic discharges may damage semi-conducive devices within the module.
• Polarization supply: 16 * Polarization voltage per signal 2 * Maximum current per signal1.
1
Basic consumption and Maximum current per signal values are indicated in the technical specifications table at
the end of this manual.
2
Polarization voltage per signal value depends on the manufacturing option of each module.
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All Saitel DR modules have a DIN-rail bracket at the rear side that allows mounting on a DIN rail.
Figure 10 – Mount bracket on DIN rail.
• Press the lower front panel gently until a click confirms that the bracket is fit on the rail.
• Verifying the module is anchored firmly to the rail, although lateral movement is possible.
Figure 11 – Saitel DR module on a DIN rail.
• If necessary, disconnect the bridge(s) connecting the module to the system bus.
• Holding the module by the front panel, push the upper metal tab downward. The user can also
pull the tab down using for example a screwdriver as shown:
Figure 12 – Remove module.
• Pressing the tab, remove the module from the lower DIN rail.
This module has five terminal blocks labeled from B1 to B5 to connect polarization, digital inputs
and digital outputs through screw terminals.
Depending on the voltage for digital inputs and devices connected to digital outputs, please pay
attention on the following safety message:
DANGER
Depending on the devices connected to the module AB_DO, could exist hazard of
electric chock, electric arc or burns. For any of these cases, follow these instructions:
• Only qualified operator should install this equipment. Such work should be performed only
after reading this entire set of instructions and checking the technical characteristics of the
device.
• NEVER work alone.
• Turn off all power supplying this equipment before working on or inside it. Consider all
sources of power, including the possibility of back feeding.
• Always use a properly rated voltage sensing device to confirm that all power is off.
• Start by connecting the device to the protective ground and to the functional ground.
• Screw tight all terminals, even those not in use.
Failure to follow these instructions will result in death or serious injury.
Type of wire
2.5 mm²
Analog Ouputs 7 mm 0.5 Nm Copper
13 AWG
2.5 mm²
Polarization 7 mm 0.5 Nm Copper
13 AWG
2.5 mm²
Digital Outputs 7 mm 0.5 Nm Copper
13 AWG
In the B2 and B3 terminal blocks, the field outputs are voltage-free NO (Normally open) contacts.
The B3 terminal block can be wired following the same connection diagram as B2.
The AB_DIDO module has the following indicators on the front panel:
Module not in acquisition mode. The module was not included into the
configuration, the module doesn't have an
address or according to the loaded
configuration, the type of the module is wrong.
NS Synchronization message not received for over Check the synchronization source.
10s.
Synchronization message is being received.
Fail Module not configured or in abnormal state. Check the configuration loaded in the HU. The
module must be addressed and with the correct
type (AB_DIDO).
No fault has been detected in configuration or
hardware.
Failure in EEPROM.
Recommended action
LED Status Description
Mnt The module is in maintenance (Flashing,
addressing, ...)
The module is in operation.
Content
INFORMACIÓN
To perform the operations described in this chapter, the user must be familiar with the
configuration tool. Otherwise, please consult the user manual of Easergy Builder.
In the Workspace of Easergy Builder, create a new RTU using button or pressing right button
of the mouse in an empty area of the RTUs tree:
Figure 17 –Add RTU.
Pressing button next to the graphical ITB, you can add, remove or change the I/O modules
included on the default configuration.
Figure 18 –Modify acquisition.
The user needs understand some basic concepts about Saitel DR before configuring the
acquisition:
• Each acquisition block is allocated to a unique address in the ITB, the Node Number; this
number identifies both the module and its type.
The number under each module corresponds with its address. You can select any AB and use
buttons to change its physical position.
When “Auto Address” box is checked (by default), if you reorder, add or delete an AB, all
addresses are automatically recalculated matching their physical position in the rail. Address
number 1 is assigned to the AB closest to the HU module (for HU_AF or HU_BI, address number 1
will be attached to the HU itself).
If “Auto Address” box is unchecked, modules will retain the allocated address, ignoring any
changes made. If rechecked, the following message will appear:
Figure 20 – Confirmation for automatic addressing.
Select an AB (click on the AB image) and use button to remove it. Use button to add a new
AB and select the type of module to include:
Figure 21 – Adding one (or several) AB.
If “Auto Address” is checked, you can add several AB at one time. This window allows selecting
the quantity of modules to be added. If “Auto Address” in unchecked, you only can add one AB
each time and you have to select the address to be assigned.
To create a new configuration, select RTU in the tree and pulse right button of the mouse or use
button.
Figure 22 – Adding configuration.
If the field "Create acquisition points defined in the RTU" is marked, all points of the local
acquisition of the acquisition blocks included in the default acquisition configuration associated with
the RTU will be included in coreDb.
For example, if a HUe has an ITB with a AB_DIDO module, if "Create acquisition points defined
in the RTU", following points are generated:
Double click on the claq Device open the window to configure/modify the ITB.
Figure 24 – Easergy Builder address.
The local acquisition Device for Saitel DR is named “Local Acquisition Device Controller” (claq).
The main functionality of claq is supporting the communication between field signals of each AB
and its linked coreDb points.
The first step to configure the acquisition settings is to assure that the ITB in the graphical interface
is according to the system. Each module must be addressed according its position in the ITB.
NOTICE
The graphical interface does not take into account if the ITB is assembled in one or multiple rows. The
modules should always be added in the adequate order, regardless the number of TU-XU modules that
we have installed.
All signals in this picture are simple. If a signal is configured as double or counter its default name
will be different.
Select the module in the ITB and all its field signals are shown (marked in red).
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The first position of each row corresponds with the signal’s description (DI_ISIM_1 .. DI_ISIM_16).
In coreDb, each signal will be identified using its coordinate. (see paragraph 4.2.3
For each signal, the following parameters can be changed:
• Type of signal: The signal is configured as: Simple digital (DI_ISIM), double digital (DI_IDOB)
or slow counter (DI_ICNT32).
The following parameters will be available or not depending on the type of signal:
• Invert: Inversion flag. The signal is inverted (Y) or not inverted (N).
• TF (ms): Filtering time. All changes that take less than this time are rejected.
• TM (ms*10): It applies to the signals set to "event". After an event, the signal's value is retained
for this time before another event occurs. It must assure the correct detection by the logic.
• TS (ms*100): It applies only for double signals. The stand-by time intends to create a time
frame in which the deactivation of the active input is not detected until the other input is
activated.
• NChat and TChat: These parameters are associated to the anti-chattering function and it
applies to the signals set to "event". If a number of changes (NChat) are made in a specific
timeframe (TChat), these all changes are rejected.
The following figure shows the configuration panel for digital output signals:
Figure 27 – AB_DIDO digital output signals.
• Digital Output Checkbox: Disable the digital output. It will not be used and cannot be mapped
on coreDb.
• DO_OSIM/DO_ODOB:
o DO_OSIM: The digital output is configured as simple.
o DO_ODOB: The digital output is configured as double.
• Latch:
o No: The digital output is not configured as latch.
o Yes: The digital output is configured as latch.
• ExeTim(ms): In case latch option is not used ExeTim can be configured. It means the pulse
time duration when the digital output is activated.
• XXX: Number that identifies the acquisition block. For the HUe signals, it will always be 000.
For the rest of the ABs, this number will correspond with the address of the module.
These points can be created automatically when the module is included in the ITB, but they can be
created manually using the claq’s wizard.
In order to include a point manually, please create a new point, select claq as Destination Device,
click right-button on the field Destination Coordinates and select Launch Point wizard:
Figure 29 – Launch Point Wizard.
Select the module in which it wants to create these points and then select type.
Only not created point will be shown in the list.
The following point can be added for an AB_DIDO module:
• 16 points for information from field. A coreDb point will be included in the Status table for each
field signal. The default name is: D00x_00000 .. D00x_00015, where 00x is the module’s
address.
These points can be created automatically when the module is included in the ITB, but they can be
created manually using the claq’s wizard.
In order to include a point manually, please create a new point, select claq as Source Device, click
right-button on the field Source Device and select Launch Point wizard as explained above.
Figure 32 – Launch Point Wizard
Select the module in which it wants to create these points and then select type.
Only not created point will be shown in the list.
The following point can be added for an AB_DIDO module:
• 8 points for information from field. A coreDb point will be included in the Command table for
each field signal. The default name is: D00x_00000 .. D00x_0007, where 00x is the module’s
address.
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When use WebApp, the following message is shown previously to access the tool:
Figure 34 - Disclaimer information
Home tab
Select Home in the main toolbar and the following information is shown.
• Device Information. It is possible to add the names of the operators who have used or
configured the equipment or a specific custom note that can be viewed each time a connection
is established to this RTU. This information can be changed using button “Edit”, next to “Device
information”.
• Location. The GPS coordinates for the RTU location (place, latitude, longitude, and altitude)
should be entered here by the installer. Location is not set automatically. The image must be
included manually by clicking button on the map.
• Image associated to the RTU. It could be useful to include a location map corresponding to the
GPS coordinates. Use button on the graphic zone to do it.
• Notes. This zone allows the user to include notes that are shown to other users. Use button
too add new notes.
• Factory information: This zone shows the manufacturer, model and the version of the
software loaded on the HU module. Using button next to the text “Factory Information”, it is
also possible to include an image of the particular RTU or CPU for identification purposes.
This screen contains other menus:
• Diagnostic
• Maintenance
• Settings
This manual only includes relevant information for AB_DIDO. For more information about webApp,
please, consult the webApp user manual.
This menu is used to monitor and control the information regarding to system status and coreDb
points.
Select “Monitoring & control System information” and the following information the system is
displayed or not depending on whether the corresponding monitoring point was included or not in
coreDb. In the following image, for each data, the supervision point that must be included in
coreDb is indicated in a blue square.
Please take into account that the correspondent supervision points must be installed, otherwise,
you will see a warning like the one in the example above (PLC information not available).
In this section, all the mapped points in Easergy Builder can be seen. There are 4 pages for
viewing status and measurement data or for sending commands.
• Command page: For sending change of state commands based on the digital data.
For all types of points, each page has the same format. If the user locks the signal and click in
in the “value” column, the value of the correspondent signal can be changed.
Figure 40 – Edit value
If the user locks the signal and click in in the “quality” column, the value of the correspondent
signal can be changed.
Each code of quality bit has a different meaning. See next tables to know the description of each
one.
Table 3 - Local quality bits
0x00000000 OK
0x00000040 The point has not yet been written into the database (No refresh)
0x00000100 The value of the item has exceeded Highest Limit Alarm.
0x00000200 The value of the item has exceeded High Limit Alarm.
0x00000400 The value of the point has fallen down of Low Limit Alarm.
0x00000800 The value of the point has fallen down of Lowest Limit Alarm.
0x00000000 OK
0x00400000 The point has not yet been written into the database.
NOTICE
If more than one error is detected for a signal, the hexadecimal value monitored for quality bits
will result from the sum of all. For example:
0x00000001 indicates that an overflow has occurred and 0x00000002 indicates that there has
been a carry on a counter or a roll-over. The value 0x00000003 would appear monitored.
Once the username and the password are introduced in the login window, the main workspace is
displayed:
• Information about the user who opened the session (Login: admin).
• The main menu is located on the left side of the screen. Each button gives access to all the
information of the RTU:
o Information: General information about the CPU configuration.
o Monitoring: Gives access to the coreDb tables and the values for each register
and field.
o Bins: Gives access to the devices that have been configured in the RTU.
o Network configuration: Gives information about the physical devices and
rooters.
Information
Clicking Information on the main menu, you can see general information about the system.
The following real-time information can be monitored on this menu:
• System’s Configuration
• Hardware Status
• Synchronization Status
• Software Versions
Figure 44 - Information section
Monitoring
The top area of the screen includes the following information for any signal type (go to “Monitoring
Status”, “Monitoring Command”, “Monitoring Analog” or “Monitoring Setpoint”):
For each kind of modules, the information will be included in different tables. In the case of the
AB_AI module, the information for the acquisition points can be found in the Status and Analog
screen.
In the status table, two signals are automatically created.
COMM_DIAG: CPU diagnosis communication variable. 0 the module cannot communicate
with the CPU. 1 the module is communicating properly with the CPU.
HW_DIAG: Auto diagnosis hardware variable. 0 the module is correct. 1 the module has some
hardware problem.
Figure 45 - Status monitoring screen
• Value: Current value of the signal. This value is retrieved from the signal’s source and it is
updated in Saitel Webtool according to the refresh period specified in the RT field.
• QF: Current quality flags of the value displayed for this signal
NOTICE
If the value of the quality bit associated to the signal is “Unrefreshed” (0x00000040) or “Invalid”
(0x00000080), the signal value will be “???”.
Clinking in “Set”, the value and the quality flag can be modified.
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Each code of quality bit has a different meaning. See next tables to know the description of each
one.
0x00000000 OK
0x00000040 The point has not yet been written into the database (No refresh)
0x00000100 The value of the item has exceeded Highest Limit Alarm.
0x00000200 The value of the item has exceeded High Limit Alarm.
0x00000400 The value of the point has fallen down of Low Limit Alarm.
0x00000800 The value of the point has fallen down of Lowest Limit Alarm.
0x00000000 OK
0x00400000 The point has not yet been written into the database.
NOTICE
If more than one error is detected for a signal, the hexadecimal value monitored for quality bits
will result from the sum of all. For example:
0x00000001 indicates that an overflow has occurred and 0x00000002 indicates that there has
been a carry on a counter or a roll-over. The value 0x00000003 would appear monitored.
Once the ITB is configured, the HU module (HU_A or HU_B) already knows the type of acquisition
blocks that are been installed and their corresponding addresses.
To update the software of the AB_DIDO module, you need:
• AB_DIDO module must be correctly addressed and working fine in the ITB (LED Run must be
blinking).
• AB_DIDO.bin file with the new version. This file must be available in the flash folder of the HU.
If not, you can contact Schneider Electric in order to ask for it. Use an SFTP client and transfer
this binary file into the HU flash folder.
The console tool can be executed using any commercial tool for serial or SSH connection. In this
manual, PuTTy software is used.
Open a serial connection as follow:
SSH connection via Ethernet can be used too. More information about the console use in the HU
user manual. In the following picture, HUe is used as CPU:
Figure 49 – SSH Connection.
NOTICE
If the baseline includes the cybersecurity brick, you need to login in the console with Installer.
No other user has permissions to execute this operation. Please, consult the HU user manual
for more information.
If the file AB_DIDO.bin is available in the flash folder, use one of the following commands to
upgrade the software of AB_DIDO modules:
Table 7 - Upgrading AB_DIDO’s software.
NOTICE
Console commands are case-sensitive, and quotation marks must be included.
After running the command, the console will show some messages indicating the process status.
Finally, if no problem is found, we will have updated the firmware of the modules.
Hardware Specifications
Consumption Typical 0.9 W
Software
Digital inputs Type Simple / Double / Slow counter
Processing Status indication (simple and double)
Memorized indication
32-bit pulse counters, 45 Hz (single or double edge)
Digital Filtering / Settling time / Change memory / Antichattering / Inversion
WARNING
According to the standard 60950-1, all electrical safety tests have been done in an
environmental temperature range of -40 ºC to 60 ºC. For higher temperature (> 60 ºC), the
module must be handled with care, since the metal surface could reach a dangerous
temperature for the user.
CE Mark
Standards, Directives and LVD – Low Voltage Directive Directive 2006/95/CE
harmonized norms. Directive 2004/108/CE
EMC – Electromagnetic Compatibility
Directive 2011/65/EU, according to royal
RoHS 2 – Restriction of Hazardous Substances legislative decree (RD) 219/2013
WEEE – Waste Electrical and Electronic Directive 2012/19/UE according to RD 110/2015
Equipment
EMC tests according to Immunity for equipment used in power station and substation environment
IEC 61000-6-5:2001
Emission standard for industrial environments
IEC 61000-6-4:2007
Emission EMC tests Radiated emissions
From 30 to 1000 MHz (Class A)
EN 55022:2006 + A1:2007
Conducted emissions
From 0.15 to 30 MHz (Class A)
EN 55022:2006 + A1:2007
Immunity EMC tests Electrostatic discharges (ESD)
By contact ±6 kV (Level 3)
EN 61000-4-2:2009
Radiated, RF, EMC field
Between 80 and 2700 MHz (Level 3)
EN 61000-4-3:2006 + A2:2010
Electrical fast transient/burst Power supply: ±2 kV, communication: ±1 kV
(Level 3)
EN61000-4-4:2012
Surge Power supply: ±2 kV symmetric and asymmetric
(Level 3)
EN 61000-4-5:2006
Conducted disturbances, RF fields
(Level 3)
EN 61000-4-6:1996 + A1:2001
Magnetic field
30 A/m at 50 Hz (Level 4)
EN 61000-4-8:2010.
Electrical Safety General requirements Meets all the requirements indicated in the
normative
IEC 60950-1
Insulation and dielectric rigidity
Isolation >100 MΩ, 2 kVAC
IEC 60255-5
Environmental tests Cold
-40ºC during 16h (Cold start)
EN 60068-2-1:2007
Dry heat
+70ºC during 16h
EN 60068-2-2:2007
Acceleration: 250 m/s2;
Bump test (1 vertical axis)
Duration of pulse: 6 ms;
EN 60068-2-29 Number of shocks: 100 shocks/axis/polarity
Random vibration test (3 axes) Range: From 10 Hz to 500 Hz
Test duration: 30 minutes
UNE-EN 60068-2-64
Ordering Options
Index of Figures
Figure 1 – Barrier of protection for elements with dangerous voltages. .......................................................................9
Figure 2 – Yellow and Green cable for earthing. ........................................................................................................10
Figure 3 – Terminal for functional earth (EMC). .........................................................................................................11
Figure 4 – Example of earthing for EMC. ...................................................................................................................11
Figure 5 – Technical label...........................................................................................................................................13
Figure 6 – Saitel DR. ..................................................................................................................................................16
Figure 7 – AB_DIDO - Functional block diagram. ......................................................................................................17
Figure 8 – AB_DIDO Module. .....................................................................................................................................18
Figure 9 – AB_DIDO - Hardware schematic view. .....................................................................................................18
Figure 10 – Mount bracket on DIN rail. .......................................................................................................................23
Figure 11 – Saitel DR module on a DIN rail. ..............................................................................................................23
Figure 12 – Remove module. .....................................................................................................................................23
Figure 13 – AB_DIDO - Polarization input wiring. ......................................................................................................24
Figure 14 – B2 and B3 terminal blocks wiring ............................................................................................................25
Figure 15 – B4 and B5 terminal blocks wiring. ...........................................................................................................25
Figure 16 –Led Indicators. ..........................................................................................................................................26
Figure 17 –Add RTU. ..................................................................................................................................................30
Figure 18 –Modify acquisition. ....................................................................................................................................30
Figure 19 – Acquisition modules in a default configuration. .......................................................................................30
Figure 20 – Confirmation for automatic addressing....................................................................................................31
Figure 21 – Adding one (or several) AB. ....................................................................................................................31
Figure 22 – Adding configuration. ...............................................................................................................................31
Figure 23– Easergy Builder configuration. .................................................................................................................32
Figure 24 – Easergy Builder address. ........................................................................................................................32
Figure 25 – Field signals and points in coreDb. .........................................................................................................33
Figure 26 – AB_DIDO digital input signals. ................................................................................................................33
Figure 27 – AB_DIDO digital output signals. ..............................................................................................................34
Figure 28 – Digital input signals in coreDb. ................................................................................................................35
Figure 29 – Launch Point Wizard. ..............................................................................................................................36
Figure 30 - Digital inputs local acquisition. .................................................................................................................36
Figure 31 – Digital output signals in coreDb. ..............................................................................................................37
Figure 32 – Launch Point Wizard ...............................................................................................................................37
Figure 33 - Digital outputs local acquisition. ...............................................................................................................37
Figure 34 - Disclaimer information ..............................................................................................................................38
Figure 35 – Access screen .........................................................................................................................................38
Figure 36 - Home view ................................................................................................................................................39
Figure 37 - Monitoring and Control view - System information ..................................................................................40
Figure 38 - Monitoring and Control - Status ...............................................................................................................41
Index of Tables
Table 1 - Symbols .........................................................................................................................................................7
Table 2 - Led indicators meaning ...............................................................................................................................26
Table 3 - Local quality bits ..........................................................................................................................................42
Table 4 - Quality bits from the Device ........................................................................................................................43
Table 5 - Local quality bits ..........................................................................................................................................46
Table 6 - Quality bits from the Device ........................................................................................................................47
Table 7 - Upgrading AB_DIDO’s software. .................................................................................................................48
Glossary
A
Amperio: Amperio. Unidad de intensidad de la corriente eléctrica.
AAP: Automatic Addressing Procedure. Procedimiento para direccionamiento automático de los
módulos del ITB.
AB: Acquisition Block. Bloque de adquisición de Saitel DR.
AB_AC: Bloque de adquisición para entradas directas de tensión y/o corriente (modelo europeo).
AB_AI: Módulo de E/S con entradas analógicas.
AB_AO: Módulo de E/S con salidas analógicas.
AB_DI: Módulo de E/S con entradas digitales.
AB_DIDO: Módulo de E/S con entradas y salidas digitales.
AB_DO: Módulo de E/S con salidas digitales.
AB_MIO: Módulo de E/S con múltiples entradas y salidas.
AB_SER: Módulo para expansión de comunicaciones serie.
AC: Alternate Current (Corriente alterna).
AI: Analog Input (Entrada analógica).
AO: Analog Output (Salida analógica).
AWG: American Wire Gauge. Calibre de cable estadounidense. Es una referencia de
clasificación de diámetros.
B
BDTR: Base de Datos en Tiempo Real.
Bps: Bits por segundo. En una transmisión de datos, es el número de impulsos elementales (1
o 0) transmitidos en cada segundo.
C
ºC: Grados Celsius o Centígrados.
CEM: Compatibilidad ElectroMagnética.
COM: Puerto de comunicaciones.
CPU: Central Processing Unit (Unidad Central de Proceso).
CTS: Clear to Send.
D
DC: Direct Current (Corriente continua).
DI: Digital Input (Entrada digital).
DIN: Deutsches Institut für Normung. Instituto alemán de normalización.
DO: Digital Output (Salida digital).
DRAM: Dynamic Random Access Memory (Memoria electrónica volátil de acceso aleatorio).
E
EPROM: Erasable Programmable Read Only Memory (Memoria ROM no volátil, programable y
borrable)
E/S: Entrada / Salida.
Ethernet: Tecnología para implementar redes que puede usar varios medios físicos, incluyendo
par trenzado y cable coaxial. El TCP/IP es el protocolo que se utiliza normalmente con este tipo de
redes.
F
Firmware: Programa embebido en una ROM o flash memory.
Flash Memory: Tipo de almacenamiento no volátil similar a la EPROM.
FTP: File Transfer Protocol. Protocolo TCP/IP utilizado para la transferencia de ficheros de un
sistema a otro.
G
G: Gramo.
GPS: Global Positioning System (Sistema para posicionamiento global a través de satélite).
H
HU: Módulo CPU de Saitel DR (Head Unit).
HU_A: CPU avanzada de Saitel DR.
HU_AF: CPU avanzada con adquisición de Saitel DR.
HU_B: CPU básica de Saitel DR.
HUe: CPU de alto rendimiento de Saitel DR.
Hz: Hercios. Frecuencia en ciclos por segundo.
I
IED: Dispositivo electrónico inteligente (Intelligent Electronic Device).
IRIG: Inter Range Instrumentation Group.
IRIG-B: Modo B del estándar IRIG.
ISO 9001: Norma internacional que especifica los requisitos que debe cumplir un sistema de
gestión de calidad.
ITB: Intelligent Terminal Block. Unidad funcional de Saitel DR compuesto por una cabeza, más un
conjunto de bloques de adquisición, junto con los elementos constructivos necesarios (módulo
terminador, módulo expansor, bus interno…).
K
KB: Kilobytes.
kHz: Kilohercios.
L
LAN: Local Area Network. Red de área local.
LED: Light Emitting Diode. Indicador luminoso.
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M
mA: Miliamperio.
MHz: Megahercio.
MB: Megabyte.
Mbaudio: Megabaudio.
Mbps: Megabits por segundo.
m: Metro.
mm: Milímetro.
ms: Milisegundo.
N
N/A: No aplica.
P
PC: Personal Computer. Ordenador personal.
PPS: Pulsos por Segundo.
PS: Power Supply. Fuente de alimentación.
PWR: Power.
R
RAM: Random Access Memory. Memoria volátil de acceso aleatorio.
RS-232: Estándar recomendado 232.
RS-485: Sistema de bus diferencial multipunto.
RTS: Request To Send. Tipo de mensaje enviado por un emisor en espera de una respuesta
(CTS).
RTU: Remote Terminal Unit. Remota.
Rx: Recepción
S
s: Segundo.
SCADA: Supervisory Control And Data Acquisition. Sistema automático para la supervisión,
control y adquisición de datos.
SNTP: Simple Network Time Protocol.
SRAM: Static Random Access Memory. Memoria estática de acceso aleatorio.
T
TCP/IP: Transmission Control Protocol/Internet Protocol. Protocolo para transmisión de datos.
TFTP: Trivial File Transfer Protocol. Protocolo para transferencia de ficheros que se asemeja a
una versión básica del FTP.
TU: Terminal Unit. Módulo terminador.
Tx: Transmisión.
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V
VAC: Voltios de corriente alterna.
VDC: Voltios de corriente continua.
W
W: Watio.
X
XU: Expansion Unit. Módulo de expansión.
Schneider Electric
C/ Charles Darwin s/n
Parque Científico y Tecnológico de la Cartuja
Seville, Spain
SE-M572-USR-01 03/2020