FC41D

Hardware Design

Wi-Fi&Bluetooth Module Series

Version: 1.0

Date: 2022-08-23

Status: Released
 Wi-Fi&Bluetooth Module Series

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 Wi-Fi&Bluetooth Module Series

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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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 Wi-Fi&Bluetooth Module Series

Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular
terminal should notify users and operating personnel of the following safety information by incorporating
these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’
failure to comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergent help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.

The cellular terminal or mobile contains a transceiver. When it is ON, it receives

and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.

In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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 Wi-Fi&Bluetooth Module Series

About the Document

Revision History

Version Date Author Description

- 2022-07-18 Soni RAO/Michael DU Creation of the document

1.0 2022-08-23 Soni RAO/Michael DU First official release

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 Wi-Fi&Bluetooth Module Series

Contents

Safety Information ....................................................................................................................................... 3

About the Document ................................................................................................................................... 4
Contents ....................................................................................................................................................... 5
Table Index ................................................................................................................................................... 7
Figure Index ................................................................................................................................................. 8

1 Introduction .......................................................................................................................................... 9
1.1. Special Mark ............................................................................................................................... 9

2 Product Concept ................................................................................................................................ 10

2.1. General Description .................................................................................................................. 10
2.2. Key Features ............................................................................................................................. 10
2.3. Functional Diagram ................................................................................................................... 12
2.4. EVB ........................................................................................................................................... 12

3 Application Interfaces ....................................................................................................................... 13

3.1. General Description .................................................................................................................. 13
3.2. Pin Assignment ......................................................................................................................... 14
3.3. Pin Description .......................................................................................................................... 15
3.4. Power Supply Design ................................................................................................................ 18
3.5. Reset ......................................................................................................................................... 19
3.6. Wireless Connectivity Interfaces ............................................................................................... 20
3.6.1. UART Interfaces ............................................................................................................. 20
3.6.2. SPI Interface* ................................................................................................................. 22
3.7. I2C Interface* ............................................................................................................................ 22
3.8. PWM Interface* ......................................................................................................................... 23
3.9. WAKEUP Interface.................................................................................................................... 23
3.10. Network Status Indication ......................................................................................................... 23
3.11. GPIO Interfaces* ....................................................................................................................... 24
3.12. ADC Interface* .......................................................................................................................... 25
3.13. RF Antenna Interface ................................................................................................................ 25
3.13.1. Operating Frequency ..................................................................................................... 25
3.13.2. RF Antenna Pin Description (Optional) .......................................................................... 26
3.13.2.1. Reference Design of RF Layout (Optional)......................................................... 26
3.13.3. On Board PCB Antenna ................................................................................................. 28
3.13.4. IPEX Connector (Optional) ............................................................................................ 30
3.13.5. Antenna Cable and Antenna Requirements .................................................................. 31

4 Reliability, Radio and Electrical Characteristics ............................................................................ 32

4.1. Absolute Maximum Ratings ...................................................................................................... 32
4.2. Power Supply Ratings ............................................................................................................... 32
4.3. Digital I/O Characteristics ......................................................................................................... 33
4.4. Power Consumption .................................................................................................................. 33

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 Wi-Fi&Bluetooth Module Series

4.4.1. Power Consumption in Low Power Modes .................................................................... 33

4.4.2. Power Consumption in Normal Operating Modes ......................................................... 34
4.5. RF Performances ...................................................................................................................... 35
4.5.1. Wi-Fi Performances ....................................................................................................... 35
4.5.2. BLE Performances ......................................................................................................... 36
4.6. ESD Protection.......................................................................................................................... 36
4.7. Operating and Storage Temperatures ...................................................................................... 37

5 Mechanical Information ..................................................................................................................... 38

5.1. Mechanical Dimensions ............................................................................................................ 38
5.2. Recommended Footprint .......................................................................................................... 40
5.3. Top and Bottom Views .............................................................................................................. 41

6 Storage, Manufacturing and Packaging .......................................................................................... 42

6.1. Storage Conditions.................................................................................................................... 42
6.2. Manufacturing and Soldering .................................................................................................... 43
6.3. Packaging Specifications .......................................................................................................... 45
6.3.1. Carrier Tape ................................................................................................................... 45
6.3.2. Plastic Reel .................................................................................................................... 46
6.3.3. Packaging Process ........................................................................................................ 47

7 Appendix References ........................................................................................................................ 48

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 Wi-Fi&Bluetooth Module Series

Table Index

Table 1: Special Mark................................................................................................................................... 9

Table 2: Key Features ................................................................................................................................ 10
Table 3: I/O Parameter Description ........................................................................................................... 15
Table 4: Pin Description ............................................................................................................................. 15
Table 5: Pin Definition of Power Supply and GND Pins ............................................................................ 18
Table 6: Pin Definition of Reset Pin ........................................................................................................... 19
Table 7: Pin Definition of UART Interfaces ................................................................................................ 20
Table 8: Pin Definition of SPI Interface ...................................................................................................... 22
Table 9: Pin Definition of I2C Interface ...................................................................................................... 22
Table 10: Pin Definition of PWM Interface ................................................................................................. 23
Table 11: Pin Definition of WAKEUP Interface .......................................................................................... 23
Table 12: Pin Definition of NET_STATUS ................................................................................................. 23
Table 13: Pin Definition of GPIO Interfaces ............................................................................................... 24
Table 14: Pin Definition of ADC Interface .................................................................................................. 25
Table 15: ADC Features ............................................................................................................................ 25
Table 16: FC41D Operating Frequency ..................................................................................................... 25
Table 17: Antenna Pin Definition................................................................................................................ 26
Table 18: On Board PCB Antenna Characteristics .................................................................................... 28
Table 19: Antenna Cable Requirement...................................................................................................... 31
Table 20: Antenna Requirement ................................................................................................................ 31
Table 21: Absolute Maximum Ratings ....................................................................................................... 32
Table 22: Module Power Supply Ratings ................................................................................................... 32
Table 23: Digital I/O Requirements ............................................................................................................ 33
Table 24: Power Consumption in Low Power Modes ................................................................................ 33
Table 25: Power Consumption in Normal Operating Modes ..................................................................... 34
Table 26: 2.4 GHz Wi-Fi Conducted Output Power ................................................................................... 35
Table 27: 2.4 GHz Wi-Fi Conducted Receive Sensitivity .......................................................................... 35
Table 28: 2.4 GHz Wi-Fi OTA TRP Test .................................................................................................... 35
Table 29: 2.4 GHz Wi-Fi OTA TIS Test ..................................................................................................... 36
Table 30: BLE Conducted Mode Output Power / Receive Sensitivity ....................................................... 36
Table 31: ESD Characteristics (Temperature: 25 ºC, Humidity: 45 %) ..................................................... 37
Table 32: Operating and Storage Temperatures (Unit: ºC) ....................................................................... 37
Table 33: Recommended Thermal Profile Parameters ............................................................................. 44
Table 34: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 45
Table 35: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 46
Table 36: Reference Documents ............................................................................................................... 48
Table 37: Terms and Abbreviations ........................................................................................................... 48

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Figure Index

Figure 1: Functional Diagram ..................................................................................................................... 12

Figure 2: Pin Assignment (Top View) ........................................................................................................ 14
Figure 3: VBAT Reference Circuit.............................................................................................................. 18
Figure 4: Power-up Timing ......................................................................................................................... 19
Figure 5: Reference Circuit of CEN by Using Driving Circuit..................................................................... 19
Figure 6: Reference Circuit of CEN by Using Button ................................................................................. 20
Figure 7: Timing of Resetting the Module .................................................................................................. 20
Figure 8: Main UART Connection Diagram ............................................................................................... 21
Figure 9: Debug UART Reference Circuit.................................................................................................. 21
Figure 10: Reference Circuit of the Network Status Indicator ................................................................... 24
Figure 11: RF Antenna Reference Design ................................................................................................. 26
Figure 12: Microstrip Design on a 2-layer PCB ......................................................................................... 27
Figure 13: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 27
Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 27
Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 28
Figure 16: Keepout Area on Motherboard ................................................................................................. 29
Figure 17: IPEX Connector Size ................................................................................................................ 30
Figure 18: Module Top and Side Dimensions ............................................................................................ 38
Figure 19: Module Dimension (Bottom View) ............................................................................................ 39
Figure 20: Recommended Footprint (Top View)........................................................................................ 40
Figure 21: Top and Bottom Views of the Module....................................................................................... 41
Figure 22: Recommended Reflow Soldering Thermal Profile ................................................................... 43
Figure 23: Carrier Tape Dimension Drawing ............................................................................................. 45
Figure 24: Plastic Reel Dimension Drawing............................................................................................... 46
Figure 25: Packaging Process ................................................................................................................... 47

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 Wi-Fi&Bluetooth Module Series

1 Introduction
This document defines the FC41D and describes its air interface and hardware interfaces which are
connected with your application.

With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. The document, coupled with
application notes and user guides, makes it easy to design and set up mobile applications with the
module.

1.1. Special Mark

Table 1: Special Mark

Mark Definition

When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
* argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.

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 Wi-Fi&Bluetooth Module Series

2 Product Concept

2.1. General Description

FC41D is a low-power, cost-effective Bluetooth 5.2 and IEEE 802.11b/g/n module, which integrates the
hardware and software resources required for Wi-Fi and Bluetooth applications. It can support AP and
STA of Wi-Fi connection, and low-power Bluetooth connection. It is very suitable for low-speed
applications and data acquisition applications such as home intelligent terminal, industrial application and
so on.

FC41D has a built-in Wi-Fi and Bluetooth ultra-high integration microcontroller, which provides the
necessary ability to calculate and stable Wi-Fi and Bluetooth connectivity for IoT data terminals. It
includes:

⚫ 120 MHz ARM kernel

⚫ 256 KB RAM
⚫ 2 MB Flash
⚫ Complies with IEEE 802.11b/g/n and Bluetooth 5.2 standards

2.2. Key Features

The following table describes the key features of FC41D.

Table 2: Key Features

Features Details

VBAT Power Supply:

Power Supply ⚫ Supply voltage range: 3.0–3.6 V
⚫ Typical supply voltage: 3.3 V
⚫ Wi-Fi: 2.412–2.484 GHz
Operating Frequency
⚫ Bluetooth: 2.402–2.480 GHz
Wi-Fi Transmission Data ⚫ 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
Rates ⚫ 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps,

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 Wi-Fi&Bluetooth Module Series

48 Mbps, 54 Mbps
⚫ 802.11n: HT20 (MCS0–MCS7)
2.4 GHz:
⚫ 802.11b/11 Mbps: 16 dBm
Wi-Fi Transmitting Power
⚫ 802.11g/54 Mbps: 14 dBm
⚫ 802.11n/HT20 MCS7: 13 dBm

Wi-Fi Protocol Features IEEE 802.11b/g/n

Wi-Fi Modulation CCK, BPSK, QPSK,16QAM, 64QAM

⚫ AP
Wi-Fi Operation Mode
⚫ STA

Bluetooth Protocol Feature GATT

Bluetooth Operation Mode BLE

Bluetooth Modulation GFSK

⚫ Main UART: Used for AT command communication, data

Wireless Application transmission and firmware upgrade
Interfaces ⚫ Debug UART: Used for the output of partial logs
⚫ SPI*: Supports one SPI interface and master and slave modes
⚫ PCB antenna
⚫ IPEX antenna (Optional)
Antenna Interface
⚫ Wi-Fi/Bluetooth antenna interface (ANT_WIFI/BT), 50 Ω impedance
(Optional)
⚫ Package: LCC
Physical Characteristics ⚫ Weight: 1.51 g
⚫ Size: (20.0 ±0.2) mm × (18.0 ±0.2) mm × (2.6 ±0.2) mm
⚫ Operating temperature range 1: -40 °C to +85 °C
Temperature Range
⚫ Storage temperature range: -45 °C to +95 °C

RoHS All hardware components are fully compliant with EU RoHS directive

1 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.

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 Wi-Fi&Bluetooth Module Series

2.3. Functional Diagram

The following figure shows a block diagram of FC41D.

VBAT

ANT_WIFI/BT
CEN

UARTs

SPI
Main Chip RF TX/RX
I2C Matching
IPEX
WAKEUP_IN

NET_STATUS
PCB
GPIOs Antenna
26 MHz
ADC XO

PWM

Figure 1: Functional Diagram

NOTE

FC41D supports PCB antenna by default; IPEX antenna and ANT_WIFI/BT are optional.

2.4. EVB

Quectel supplies an evaluation board (FC41D TE-B) with accessories to control or test the module. For
more details, see document [1].

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 Wi-Fi&Bluetooth Module Series

3 Application Interfaces

3.1. General Description

The FC41D has 27 LCC pins. The following interfaces are described in detail in subsequent chapters:

⚫ Power supply
⚫ Module reset
⚫ Wireless connectivity interfaces
- UART interfaces
- SPI interface*
⚫ I2C interface*
⚫ PWM interface*
⚫ WAKEUP interface
⚫ Network status indication
⚫ GPIO interfaces*
⚫ ADC interface*
⚫ RF antenna interface

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3.2. Pin Assignment

GND 1
ANT_WIFI/BT 2 27 GND
GND 3
26 DBG_TXD
I2C_SCL 4 25 DBG_RXD
I2C_SDA 5 24 GPIO4
RESERVED 6 23 GPIO3
WAKEUP_IN 7 FC41D 22 GPIO2
WAKEUP_OUT 8 21 ADC
Top View
CEN 9 20 MAIN_TXD
GPIO1 10 19 MAIN_RXD
PWM 11 18 SPI_CS
NET_STATUS 12 17 SPI_CLK
SPI_MISO 13 16 GND
SPI_MOSI 14 15 VBAT

POWER GND SPI UART ANT I2C GPIO Others RESERVED

Figure 2: Pin Assignment (Top View)

NOTE

Keep all RESERVED and unused pins open.

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3.3. Pin Description

The following tables show the pin description of module.

Table 3: I/O Parameter Description

Type Description

AI Analog Input

AIO Analog Input/Output

DI Digital Input

DIO Digital Input/Output

DO Digital Output

OD Open Drain

PI Power Input

Table 4: Pin Description

Power Supply

Pin Name Pin No. I/O Description DC Characteristics Comment

Vmax = 3.6 V It must be provided

Power supply for
VBAT 15 PI Vmin = 3.0 V with sufficient
the module
Vnom = 3.3 V current up to 0.3 A.

GND 1, 3, 16, 27

Reset

Pin Name Pin No. I/O Description DC Characteristics Comment

Internally pulled up
Vmax = 3.6 V
to 3.3 V.
CEN 9 DI Resets the module Vmin = 3.0 V
Hardware reset;
Vnom = 3.3 V
active low.

Main UART

Pin Name Pin No. I/O Description DC Characteristics Comment

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 Wi-Fi&Bluetooth Module Series

Main UART
MAIN_TXD 20 DO
transmits
3.3 V
Main UART
MAIN_RXD 19 DI
receives

Debug UART

Debug UART
DBG_TXD 26 DO
transmits
3.3 V
Debug UART
DBG_RXD 25 DI
receives

SPI Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment

SPI master input

SPI_MISO 13 DIO
salve output
SPI master output
SPI_MOSI 14 DIO
slave input
In master mode, it’s
an output signal; in
SPI_CLK 17 DIO SPI clock 3.3 V
slave mode, it’s an
input signal.
In master mode, it’s
an input signal; in
SPI_CS 18 DIO SPI chip select
slave mode, it’s an
output signal.

I2C Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment

I2C_SCL 4 OD I2C serial clock

Requires external
3.3 V
pull-up to 3.3 V.
I2C_SDA 5 OD I2C serial data

WAKEUP Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

Wakes up the
module from deep Rising edge
WAKEUP_IN 7 DI
sleep or standby wakeup.
3.3 V
mode

WAKEUP_OUT 8 DO Wakes up the host Active high.

Indication Interface

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 Wi-Fi&Bluetooth Module Series

Pin Name Pin No. I/O Description DC Characteristics Comment

Outputs high level

Indicates the
when Wi-Fi is
NET_STATUS 12 DO module's network 3.3 V
connected in STA
activity status
mode.

PWM Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment

Pulse width
PWM 11 DO modulation output 3.3 V
channel

GPIO Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment

General-purpose
GPIO1 10 DIO
input/output
General-purpose
GPIO2 22 DIO
input/output
3.3 V Wake-up interrupt.
General-purpose
GPIO3 23 DIO
input/output
General-purpose
GPIO4 24 DIO
input/output

ADC Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment

General-purpose
Voltage range:
ADC 21 AI ADC
0–2.4 V
interface

RF Antenna Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

Wi-Fi/Bluetooth
ANT_WIFI/BT 2 AIO 50 Ω impedance.
antenna interface

RESERVED

Pin Name Pin No. I/O Description DC Characteristics Comment

RESERVED 6 RESERVED Keep it open.

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3.4. Power Supply Design

The following table shows the definition of power supply pin and ground pins of FC41D.

Table 5: Pin Definition of Power Supply and GND Pins

Pin Name Pin No. Description Min. Typ. Max. Unit

VBAT 15 Power supply 3.0 3.3 3.6 V

GND 1, 3, 16, 27 Ground

FC41D is powered by VBAT, and it is recommended to use a power supply chip that can provide at least
0.3 A output current. To ensure better power supply performance, it is recommended to parallel 22 μF
decoupling capacitor, and 1 μF and 100 nF filter capacitor near the module’s VBAT pin. Meanwhile, it is
recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module.
In principle, the longer the VBAT line is, the wider it should be.

VBAT reference circuit is shown as below:

VBAT

R1 0R
VBAT

Module
D1
C1 C2 C3 C4
22 μF 1 μF 100 nF NM

Figure 3: VBAT Reference Circuit

After the module VBAT is powered on, keep the CEN pin at high level to realize the automatic startup of
the module.

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 Wi-Fi&Bluetooth Module Series

˂ 10 ms

> 5 ms

VBAT

CEN

STATUS Booting Active

Figure 4: Power-up Timing

Cut off the power supply of VBAT, the module will automatically execute power-off procedure.

3.5. Reset

Drive CEN low for at least 100 ms and then release it to reset the module.

Table 6: Pin Definition of Reset Pin

Pin Name Pin No. Description Comment

CEN 9 Reset the module Pulled up to 3.3 V internally.

The reference designs for resetting the module are shown below. An open drain/collector driving circuit
or a button can be used to control the CEN pin.

CEN

Control 4.7 kΩ
Q1
R1

47 kΩ

R2

Figure 5: Reference Circuit of CEN by Using Driving Circuit

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 Wi-Fi&Bluetooth Module Series

S1
CEN

TVS

Close to S1

Figure 6: Reference Circuit of CEN by Using Button

The reset scenario is illustrated in the following figure.

VBA T
T 100 ms

CEN VIH 2.4 V

VIL 0.5 V

Figure 7: Timing of Resetting the Module

3.6. Wireless Connectivity Interfaces

3.6.1. UART Interfaces

The module provides two UART interfaces: the main UART and the debug UART. The module is used as
DCE (Data Communication Equipment), and is connected in the traditional DCE-DTE (Data Terminal
Equipment) mode.

Table 7: Pin Definition of UART Interfaces

Pin Name Pin No. I/O Description

MAIN_TXD 20 DO Main UART transmits data

MAIN_RXD 19 DI Main UART receives data

DBG_TXD 26 DO Debug UART transmits data

DBG_RXD 25 DI Debug UART receives data

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The main UART can be used for AT command communication and data transmission. The default baud
rate is 115200 bps, and the maximum baud rate can reach 2 Mbps.

The main UART is also available for firmware upgrade and supports a default baud rate of 921600 bps.

The following is the schematic diagram of the main UART interface connection between DCE and DTE.

Module (DCE) DTE

MAIN_TXD UART_RXD

MAIN_RXD UART_TXD

GND GND

Figure 8: Main UART Connection Diagram

The debug UART interface supports 115200 bps baud rate by default, and is used for the output of partial
logs.

The following is a reference design of debug UART.

Module

DBG_TXD

DBG_RXD Test point

ESD

Figure 9: Debug UART Reference Circuit

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3.6.2. SPI Interface*

FC41D provides a SPI interface that supports both master and slave modes. The maximum clock
frequency of the interface can reach 50 MHz in slave mode, and 8 MHz in the master mode.

The pin description of SPI interface is shown as below:

Table 8: Pin Definition of SPI Interface

Pin Name Pin No. I/O Description Comment

SPI_MISO 13 DIO SPI master input slave output

SPI_MOSI 14 DIO SPI master output slave input

In master mode, it’s an output signal;

SPI_CLK 17 DIO SPI clock
in slave mode, it’s an input signal.
In master mode, it’s an input signal;
SPI_CS 18 DIO SPI chip select
in slave mode, it’s an output signal.

3.7. I2C Interface*

FC41D provides an I2C interface that supports master mode only with maximum clock frequency of 400
kHz and 7-bit addressing. It can be used to connect peripherals such as EEPROM.

Table 9: Pin Definition of I2C Interface

Pin Name Pin No. I/O Description Comment

I2C_SCL 4 OD I2C serial clock

Require external
pull-up to 3.3 V.
I2C_SDA 5 OD I2C serial data

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3.8. PWM Interface*

FC41D provides 1 PWM channel by default. The following table shows the pin description of PWM
interface.

Table 10: Pin Definition of PWM Interface

Pin Name Pin No. I/O Description

PWM 11 DO Pulse width modulation output channel

3.9. WAKEUP Interface

WAKEUP_IN pin can wake up the module from deep sleep mode or standby mode, while
WAKEUP_OUT pin can be used to wake up the host.

Table 11: Pin Definition of WAKEUP Interface

Pin Name Pin No. I/O Description Comment

Wake up the module from deep

WAKEUP_IN 7 DI Rising edge wakeup.
sleep or standby mode

WAKEUP_OUT 8 DO Wake up the host Active high.

3.10. Network Status Indication

The network indication pin NET_STATUS can drive the network status indicators.

The following table describes the pin definition and logic level changes of NET_STATUS.

Table 12: Pin Definition of NET_STATUS

Pin Name Pin No. I/O Description Comment

Indicate the module's Outputs high level when Wi-Fi

NET_STATUS 12 DO
network activity status. is connected in STA mode.

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A reference circuit is shown in the following figure.

VBAT

Module

2.2K

4.7K
NET_STATUS
47K

Figure 10: Reference Circuit of the Network Status Indicator

3.11. GPIO Interfaces*

FC41D provides 4 GPIO interfaces by default. The following table shows the pin description of GPIO.

Table 13: Pin Definition of GPIO Interfaces

Pin Name Pin No. I/O Description Comment

GPIO1 10

GPIO2 22
General-purpose
DIO Wake-up interrupt.
input/output
GPIO3 23

GPIO4 24

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3.12. ADC Interface*

The module provides one ADC interface by default, and the voltage range is 0–2.4 V. To improve the
accuracy of ADC, surround the trace of ADC with ground.

Table 14: Pin Definition of ADC Interface

Pin Name Pin No. I/O Description

ADC 21 AI General-purpose ADC interface

Table 15: ADC Features

Parameter Min. Typ. Max. Unit

ADC Voltage Range 0 - 2.4 V

ADC Resolution Rate - TBD - bit

ADC Sample Rate - TBD - MHz

3.13. RF Antenna Interface

FC41D provides PCB antenna, IPEX connector and ANT_WIFI/BT (stamp hole). The IPEX connector is
not mounted on the module when using PCB antenna or ANT_WIFI/BT. FC41D supports PCB antenna
by default; IPEX antenna and ANT_WIFI/BT are optional.

3.13.1. Operating Frequency

The operating frequency of FC41D is shown in the table below:

Table 16: FC41D Operating Frequency

Mode Frequency Unit

2.4 GHz Wi-Fi 2.412–2.484 GHz

Bluetooth 2.402–2.480 GHz

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3.13.2. RF Antenna Pin Description (Optional)

RF Antenna pin description is as below:

Table 17: Antenna Pin Definition

Pin Name Pin No. I/O Description Comment

Wi-Fi/Bluetooth antenna
ANT_WIFI/BT 2 AIO 50 Ω impedance.
interface

The circuit of RF antenna interface is shown below. In order to achieve better RF performance, it is
necessary to reserve LC and π matching circuit. Matching components such as R1, L1, C1, C2, C3 and
D1 should be placed as close to the antenna as possible, L1, C1, C2, C3 and D1 are not mounted by
default. The parasitic capacitance of TVS should be less than 0.05 pF.

FC41D
R1
ANT_WIFI/BT
0R
L1
NM
C2 C3 D1
NM NM NM
C1
NM

Figure 11: RF Antenna Reference Design

3.13.2.1. Reference Design of RF Layout (Optional)

The characteristic impedance of all RF traces on your PCB should be controlled at 50 Ω. The impedance
of the RF traces is usually determined by the trace width (W), the material’s dielectric constant, the height
from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
The microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance.
The following are reference designs for microstrip or coplanar waveguide transmission lines with different
PCB structures.

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Figure 12: Microstrip Design on a 2-layer PCB

Figure 13: Coplanar Waveguide Design on a 2-layer PCB

Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

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Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

To ensure RF performance and reliability, the following principles should be complied with in RF layout
design:

⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.
⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be
fully connected to ground.
⚫ The distance between the RF pins and the RF connector should be as short as possible and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
⚫ There should be clearance under the signal pin of the antenna connector or solder joint.
⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias
around RF traces and the reference ground could help to improve RF performance. The distance
between the ground vias and RF traces should be no less than two times the width of RF signal
traces (2 × W).
⚫ Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.

For more details about RF layout, see document [2].

3.13.3. On Board PCB Antenna

Table 18: On Board PCB Antenna Characteristics

Characters Min. Typ. Max. Unit

Frequency 2400 - 2500 MHz

Impedance - 50 - Ω

VSWR - - 3 -

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Gain - -1.81 - dBi

Efficiency - 35 % - -

When using the PCB antenna on the module, the module should be placed at the side of the motherboard,
and the distance of keepout between PCB antenna to GND of motherboard should be at least 3 mm, and
the distance between PCB antenna to connectors, pin headers, ethernet port and any other metal
components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard
under the PCB antenna should be designed as keepout area.

Figure 16: Keepout Area on Motherboard

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3.13.4. IPEX Connector (Optional)

The mechanic size of the IPEX connector (MPN: 20579-001E, MHF® 4L Receptacle) provided by the
FC41D is as follows.

Figure 17: IPEX Connector Size

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3.13.5. Antenna Cable and Antenna Requirements

Table 19: Antenna Cable Requirement

Frequency Requirement

2.412–2.484 GHz Insertion loss <1 dB

Table 20: Antenna Requirement

Type Requirement

Frequency 2.412–2.484 GHz

VSWR <2

Gain (dBi) Typ. 1

Max. input power (W) 50

Input impedance (Ω) 50

Polarization type Vertical

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4 Reliability, Radio and Electrical

Characteristics

4.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.

Table 21: Absolute Maximum Ratings

Parameter Min. Max. Unit

VBAT -0.3 3.9 V

I/O input voltage -0.3 3.9 V

4.2. Power Supply Ratings

Table 22: Module Power Supply Ratings

Parameter Min. Typ. Max. Unit

VBAT 3.0 3.3 3.6 V

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4.3. Digital I/O Characteristics

Table 23: Digital I/O Requirements

Parameter Description Min. Max. Unit

VIH High Level Input Voltage 0.7 × VBAT VBAT + 0.2 V

VIL Low Level Input Voltage -0.3 0.3 × VBAT V

VOH High Level Output Voltage 0.9 × VBAT VBAT V

VOL Low Level Output Voltage 0 0.1 × VBAT V

IiL Input Leakage Current -5 5 µA

4.4. Power Consumption

4.4.1. Power Consumption in Low Power Modes

Table 24: Power Consumption in Low Power Modes

Parameter Description Typ. Unit

AT+QDEEPSLEEP can set the module

to deep sleep mode. In this case, the
Deep sleep mode 8.6 μA
serial interfaces stop working and
software settings are not saved.
AT+QLOWPOWER can set the module
to standby mode. In this case, the serial
Standby mode 30 μA
interfaces stop working but software
settings can be saved.
Neither Wi-Fi nor Bluetooth does any
Idle state 22.74 mA
operation.

NOTE

For more information about AT command, please refer to document [4].

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4.4.2. Power Consumption in Normal Operating Modes

Table 25: Power Consumption in Normal Operating Modes

Parameter Description Typ. Unit

Wi-Fi Scan Scan in every 2 s 68.59 mA

STA mode is ON, but no STA device is connected 74.52 mA

SoftAP mode is ON, and 1 STA device is

77.11 mA
connected
Wi-Fi Connected
SoftAP mode is ON, and 2 STA devices is
77.29 mA
connected
SoftAP mode is ON, but no STA device is
77.09 mA
connected

SoftAP mode data transmission 155.29 mA

STA mode data transmission 147.81 mA

Data Transmission
SoftAP mode + BLE Server mode data
157.56 mA
transmission

STA mode + BLE Server mode data transmission 149.66 mA

Receive data as Server 28.41 mA

Transmit data as Server 28.39 mA

Bluetooth Connected
Receive data as Client 23.68 mA

Transmit data as Client 23.68 mA

802.11b Tx (2.4 GHz)

91 mA
1 Mbps
802.11b Tx (2.4 GHz)
92 mA
11 Mbps
802.11g Tx (2.4 GHz)
90 mA
6 Mbps
RF Non-signaling Mode
802.11g Tx (2.4 GHz)
88 mA
54 Mbps
802.11n Tx (2.4 GHz)
89 mA
HT20 MCS0
802.11n Tx (2.4 GHz)
88 mA
HT20 MCS7

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4.5. RF Performances

4.5.1. Wi-Fi Performances

Table 26: 2.4 GHz Wi-Fi Conducted Output Power

Operating Mode Rate Min. (dBm) Typ. (dBm)

802.11b 1 Mbps 14 16

802.11b 11 Mbps 14 16

802.11g 6 Mbps 13 15

802.11g 54 Mbps 12 14

802.11n, HT20 MCS0 12 14

802.11n, HT20 MCS7 11 13

Table 27: 2.4 GHz Wi-Fi Conducted Receive Sensitivity

Operating Mode Rate Typ. (dBm)

802.11b 1 Mbps -96

802.11b 11 Mbps -87

802.11g 6 Mbps -89

802.11g 54 Mbps -72

802.11n, HT20 MCS0 -89

802.11n, HT20 MCS7 -70

Table 28: 2.4 GHz Wi-Fi OTA TRP Test

Operating Mode Rate Typ. (dBm)

802.11b 1 Mbps 15

802.11b 11 Mbps 15

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802.11g 6 Mbps 14

802.11g 54 Mbps 13

802.11n, HT20 MCS0 13

802.11n, HT20 MCS7 12

Table 29: 2.4 GHz Wi-Fi OTA TIS Test

Operating Mode Rate Typ. (dBm)

802.11b 1 Mbps -94

802.11b 11 Mbps -85

802.11g 6 Mbps -88

802.11g 54 Mbps -71

802.11n, HT20 MCS0 -86

802.11n, HT20 MCS7 -66

4.5.2. BLE Performances

Table 30: BLE Conducted Mode Output Power / Receive Sensitivity

Operating Mode Output Power (Typ.) Receive Sensitivity (Typ.) Unit

BLE (1 MHz) 6 -95 dBm

4.6. ESD Protection

Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD
countermeasures and handling methods is imperative. For example, wear anti-static gloves during the
development, production, assembly and testing of the module; add ESD protection components to the
ESD sensitive interfaces and points in the product design.

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 Wi-Fi&Bluetooth Module Series

Table 31: ESD Characteristics (Temperature: 25 ºC, Humidity: 45 %)

Tested Interfaces Contact Discharge Air Discharge Unit

VBAT, GND ±4 ±8 kV

ANT_WIFI/BT ±4 ±8 kV

Other Interfaces ±0.5 ±1 kV

4.7. Operating and Storage Temperatures

Table 32: Operating and Storage Temperatures (Unit: ºC)

Parameter Min. Typ. Max.

Operating Temperature Range 2 -40 +25 +85

Storage Temperature Range -45 - +95

2 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.

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 Wi-Fi&Bluetooth Module Series

5 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

5.1. Mechanical Dimensions

Figure 18: Module Top and Side Dimensions

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 Wi-Fi&Bluetooth Module Series

Pin 1

Figure 19: Module Dimension (Bottom View)

NOTE

The package warpage level of the module conforms to the JEITA ED-7306 standard.

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 Wi-Fi&Bluetooth Module Series

5.2. Recommended Footprint

Figure 20: Recommended Footprint (Top View)

NOTE

Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.

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 Wi-Fi&Bluetooth Module Series

5.3. Top and Bottom Views

Figure 21: Top and Bottom Views of the Module

NOTE

Images above are for illustration purpose only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel.

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 Wi-Fi&Bluetooth Module Series

6 Storage, Manufacturing and

Packaging

6.1. Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.

2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.

3. Floor life: 168 hours 3 in a factory where the temperature is 23 ±5 °C and relative humidity is below
60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow
soldering or other high-temperature operations within 168 hours. Otherwise, the module should be
stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:

⚫ The module is not stored in Recommended Storage Condition;

⚫ Violation of the third requirement mentioned above;
⚫ Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫ Before module repairing.

5. If needed, the pre-baking should follow the requirements below:

⚫ The module should be baked for 8 hours at 120 ±5 °C;

⚫ The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.

3
This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start
the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to,
or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are
not ready for soldering.

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 Wi-Fi&Bluetooth Module Series

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module
to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

6.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean
stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the
module is recommended to be 0.15–0.18 mm. For more details, see document [3].

The recommended reflow temperature should be 238–246 ºC, with 246 ºC as the absolute maximum
reflow temperature. To avoid damage to the module caused by repeated heating, it is suggested that the
module should be mounted only after reflow soldering for the other side of PCB has been completed.
The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters
are shown below.

Temp. (°C)
Reflow Zone
Max. slope: Cooling down slope:
1–3 °C/s C -1.5 to -3 °C/s
246
235
217
B D
200
Soak Zone

150 A

100
Max. slope: 1–3 °C/s

Figure 22: Recommended Reflow Soldering Thermal Profile

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 Wi-Fi&Bluetooth Module Series

Table 33: Recommended Thermal Profile Parameters

Factor Recommendation

Soak Zone

Max. slope 1–3 °C/s

Soak time (between A and B: 150 °C and 200 °C) 70–120 s

Reflow Zone

Max. slope 1–3 °C/s

Reflow time (D: over 217 °C) 40–70 s

Max. temperature 238 °C to 246 °C

Cooling down slope -1.5 to -3 °C/s

Reflow Cycle

Max. reflow cycle 1

NOTE

1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the QR code is still readable, although white rust may be found.
3. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
5. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [3].

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6.3. Packaging Specifications

The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape

Dimension details are as follow:

Figure 23: Carrier Tape Dimension Drawing

Table 34: Carrier Tape Dimension Table (Unit: mm)

W P T A0 B0 K0 K1 F E

44 32 0.4 18.5 20.5 3 6.8 20.2 1.75

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 Wi-Fi&Bluetooth Module Series

6.3.2. Plastic Reel

Figure 24: Plastic Reel Dimension Drawing

Table 35: Plastic Reel Dimension Table (Unit: mm)

øD1 øD2 W

330 100 44.5

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 Wi-Fi&Bluetooth Module Series

6.3.3. Packaging Process

Place the module into the carrier tape and

use the cover tape to cover it; then wind the
heat-sealed carrier tape to the plastic reel
and use the protective tape for protection. 1
plastic reel can load 250 modules.

Place the packaged plastic reel, 1 humidity

indicator card and 1 desiccant bag into a
vacuum bag, vacuumize it.

Place the vacuum-packed plastic reel into

the pizza box.

Put 4 packaged pizza boxes into 1 carton

box and seal it. 1 carton box can pack 1000
modules.

Figure 25: Packaging Process

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7 Appendix References

Table 36: Reference Documents

Document Name

[1] Quectel_FC41D_TE-B_User_Guide

[2] Quectel_RF_LAYOUT_Application_Note

[3] Quectel_Module_SMT_Application_Note

[4] Quectel_FC41D_AT_Commands_Manual

Table 37: Terms and Abbreviations

Abbreviation Description

AP Access Point

BLE Bluetooth Low Energy

BPSK Binary Phase Shift Keying

CCK Complementary Code Keying

CTS Clear To Send

DPSK Differential Phase Shift Keying

DQPSK Differential Quadrature Reference Phase Shift Keying

ESD Electrostatic Discharge

GATT Generic Attribute Profile

GFSK Gauss Frequency Shift Keying

GND Ground

HT High Throughput

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IEEE Institute of Electrical and Electronics Engineers

I/O Input/Output

Mbps Megabits per second

MPN Manufacturer Part Number

QAM Quadrature Amplitude Modulation

QPSK Quadrature Phase Shift Keying

RF Radio Frequency

RH Relative Humidity

RoHS Restriction of Hazardous Substances

STA Station

RTS Request to Send

RXD Receive Data (Pin)

SDIO Secure Digital Input and Output Card

TBD To Be Determined

TXD Transmit Data (Pin)

UART Universal Asynchronous Receiver/Transmitter

USB Universal Serial Bus

VHT Very High Throughput

VIHmax Maximum High-level Input Voltage

VIHmin Minimum High-level Input Voltage

VILmax Maximum Low-level Input Voltage

VILmin Minimum Low-level Input Voltage

VOLmax Maximum Low-level Output Voltage

VOHmin Minimum High-level Output Voltage

Vnom Normal Voltage Value

VSWR Voltage Standing Wave Ratio

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