Quectel FC41D Hardware Design V1.0
Quectel FC41D Hardware Design V1.0
Hardware Design
Version: 1.0
Date: 2022-08-23
Status: Released
Wi-Fi&Bluetooth Module Series
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Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or
express, and exclude all liability for any loss or damage suffered in connection with the use of
features and functions under development, to the maximum extent permitted by law, regardless of
whether such loss or damage may have been foreseeable.
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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.
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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular
terminal should notify users and operating personnel of the following safety information by incorporating
these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’
failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergent help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
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Revision History
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Contents
1 Introduction .......................................................................................................................................... 9
1.1. Special Mark ............................................................................................................................... 9
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Table Index
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Figure Index
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1 Introduction
This document defines the FC41D and describes its air interface and hardware interfaces which are
connected with your application.
With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. The document, coupled with
application notes and user guides, makes it easy to design and set up mobile applications with the
module.
Mark Definition
When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
* argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.
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2 Product Concept
FC41D is a low-power, cost-effective Bluetooth 5.2 and IEEE 802.11b/g/n module, which integrates the
hardware and software resources required for Wi-Fi and Bluetooth applications. It can support AP and
STA of Wi-Fi connection, and low-power Bluetooth connection. It is very suitable for low-speed
applications and data acquisition applications such as home intelligent terminal, industrial application and
so on.
FC41D has a built-in Wi-Fi and Bluetooth ultra-high integration microcontroller, which provides the
necessary ability to calculate and stable Wi-Fi and Bluetooth connectivity for IoT data terminals. It
includes:
Features Details
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48 Mbps, 54 Mbps
⚫ 802.11n: HT20 (MCS0–MCS7)
2.4 GHz:
⚫ 802.11b/11 Mbps: 16 dBm
Wi-Fi Transmitting Power
⚫ 802.11g/54 Mbps: 14 dBm
⚫ 802.11n/HT20 MCS7: 13 dBm
⚫ AP
Wi-Fi Operation Mode
⚫ STA
RoHS All hardware components are fully compliant with EU RoHS directive
1 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.
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VBAT
ANT_WIFI/BT
CEN
UARTs
SPI
Main Chip RF TX/RX
I2C Matching
IPEX
WAKEUP_IN
NET_STATUS
PCB
GPIOs Antenna
26 MHz
ADC XO
PWM
NOTE
FC41D supports PCB antenna by default; IPEX antenna and ANT_WIFI/BT are optional.
2.4. EVB
Quectel supplies an evaluation board (FC41D TE-B) with accessories to control or test the module. For
more details, see document [1].
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3 Application Interfaces
The FC41D has 27 LCC pins. The following interfaces are described in detail in subsequent chapters:
⚫ Power supply
⚫ Module reset
⚫ Wireless connectivity interfaces
- UART interfaces
- SPI interface*
⚫ I2C interface*
⚫ PWM interface*
⚫ WAKEUP interface
⚫ Network status indication
⚫ GPIO interfaces*
⚫ ADC interface*
⚫ RF antenna interface
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GND 1
ANT_WIFI/BT 2 27 GND
GND 3
26 DBG_TXD
I2C_SCL 4 25 DBG_RXD
I2C_SDA 5 24 GPIO4
RESERVED 6 23 GPIO3
WAKEUP_IN 7 FC41D 22 GPIO2
WAKEUP_OUT 8 21 ADC
Top View
CEN 9 20 MAIN_TXD
GPIO1 10 19 MAIN_RXD
PWM 11 18 SPI_CS
NET_STATUS 12 17 SPI_CLK
SPI_MISO 13 16 GND
SPI_MOSI 14 15 VBAT
NOTE
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Type Description
AI Analog Input
DI Digital Input
DO Digital Output
OD Open Drain
PI Power Input
Power Supply
GND 1, 3, 16, 27
Reset
Internally pulled up
Vmax = 3.6 V
to 3.3 V.
CEN 9 DI Resets the module Vmin = 3.0 V
Hardware reset;
Vnom = 3.3 V
active low.
Main UART
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Main UART
MAIN_TXD 20 DO
transmits
3.3 V
Main UART
MAIN_RXD 19 DI
receives
Debug UART
Debug UART
DBG_TXD 26 DO
transmits
3.3 V
Debug UART
DBG_RXD 25 DI
receives
SPI Interface*
I2C Interface*
WAKEUP Interface
Wakes up the
module from deep Rising edge
WAKEUP_IN 7 DI
sleep or standby wakeup.
3.3 V
mode
Indication Interface
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PWM Interface*
Pulse width
PWM 11 DO modulation output 3.3 V
channel
GPIO Interface*
General-purpose
GPIO1 10 DIO
input/output
General-purpose
GPIO2 22 DIO
input/output
3.3 V Wake-up interrupt.
General-purpose
GPIO3 23 DIO
input/output
General-purpose
GPIO4 24 DIO
input/output
ADC Interface*
General-purpose
Voltage range:
ADC 21 AI ADC
0–2.4 V
interface
RF Antenna Interface
Wi-Fi/Bluetooth
ANT_WIFI/BT 2 AIO 50 Ω impedance.
antenna interface
RESERVED
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The following table shows the definition of power supply pin and ground pins of FC41D.
FC41D is powered by VBAT, and it is recommended to use a power supply chip that can provide at least
0.3 A output current. To ensure better power supply performance, it is recommended to parallel 22 μF
decoupling capacitor, and 1 μF and 100 nF filter capacitor near the module’s VBAT pin. Meanwhile, it is
recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module.
In principle, the longer the VBAT line is, the wider it should be.
VBAT
R1 0R
VBAT
Module
D1
C1 C2 C3 C4
22 μF 1 μF 100 nF NM
After the module VBAT is powered on, keep the CEN pin at high level to realize the automatic startup of
the module.
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˂ 10 ms
> 5 ms
VBAT
CEN
Cut off the power supply of VBAT, the module will automatically execute power-off procedure.
3.5. Reset
Drive CEN low for at least 100 ms and then release it to reset the module.
The reference designs for resetting the module are shown below. An open drain/collector driving circuit
or a button can be used to control the CEN pin.
CEN
Control 4.7 kΩ
Q1
R1
47 kΩ
R2
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S1
CEN
TVS
Close to S1
VBA T
T 100 ms
The module provides two UART interfaces: the main UART and the debug UART. The module is used as
DCE (Data Communication Equipment), and is connected in the traditional DCE-DTE (Data Terminal
Equipment) mode.
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The main UART can be used for AT command communication and data transmission. The default baud
rate is 115200 bps, and the maximum baud rate can reach 2 Mbps.
The main UART is also available for firmware upgrade and supports a default baud rate of 921600 bps.
The following is the schematic diagram of the main UART interface connection between DCE and DTE.
MAIN_TXD UART_RXD
MAIN_RXD UART_TXD
GND GND
The debug UART interface supports 115200 bps baud rate by default, and is used for the output of partial
logs.
Module
DBG_TXD
ESD
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FC41D provides a SPI interface that supports both master and slave modes. The maximum clock
frequency of the interface can reach 50 MHz in slave mode, and 8 MHz in the master mode.
FC41D provides an I2C interface that supports master mode only with maximum clock frequency of 400
kHz and 7-bit addressing. It can be used to connect peripherals such as EEPROM.
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FC41D provides 1 PWM channel by default. The following table shows the pin description of PWM
interface.
WAKEUP_IN pin can wake up the module from deep sleep mode or standby mode, while
WAKEUP_OUT pin can be used to wake up the host.
The network indication pin NET_STATUS can drive the network status indicators.
The following table describes the pin definition and logic level changes of NET_STATUS.
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VBAT
Module
2.2K
4.7K
NET_STATUS
47K
FC41D provides 4 GPIO interfaces by default. The following table shows the pin description of GPIO.
GPIO1 10
GPIO2 22
General-purpose
DIO Wake-up interrupt.
input/output
GPIO3 23
GPIO4 24
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The module provides one ADC interface by default, and the voltage range is 0–2.4 V. To improve the
accuracy of ADC, surround the trace of ADC with ground.
FC41D provides PCB antenna, IPEX connector and ANT_WIFI/BT (stamp hole). The IPEX connector is
not mounted on the module when using PCB antenna or ANT_WIFI/BT. FC41D supports PCB antenna
by default; IPEX antenna and ANT_WIFI/BT are optional.
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Wi-Fi/Bluetooth antenna
ANT_WIFI/BT 2 AIO 50 Ω impedance.
interface
The circuit of RF antenna interface is shown below. In order to achieve better RF performance, it is
necessary to reserve LC and π matching circuit. Matching components such as R1, L1, C1, C2, C3 and
D1 should be placed as close to the antenna as possible, L1, C1, C2, C3 and D1 are not mounted by
default. The parasitic capacitance of TVS should be less than 0.05 pF.
FC41D
R1
ANT_WIFI/BT
0R
L1
NM
C2 C3 D1
NM NM NM
C1
NM
The characteristic impedance of all RF traces on your PCB should be controlled at 50 Ω. The impedance
of the RF traces is usually determined by the trace width (W), the material’s dielectric constant, the height
from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
The microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance.
The following are reference designs for microstrip or coplanar waveguide transmission lines with different
PCB structures.
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Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
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Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, the following principles should be complied with in RF layout
design:
⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.
⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be
fully connected to ground.
⚫ The distance between the RF pins and the RF connector should be as short as possible and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
⚫ There should be clearance under the signal pin of the antenna connector or solder joint.
⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias
around RF traces and the reference ground could help to improve RF performance. The distance
between the ground vias and RF traces should be no less than two times the width of RF signal
traces (2 × W).
⚫ Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.
Impedance - 50 - Ω
VSWR - - 3 -
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Efficiency - 35 % - -
When using the PCB antenna on the module, the module should be placed at the side of the motherboard,
and the distance of keepout between PCB antenna to GND of motherboard should be at least 3 mm, and
the distance between PCB antenna to connectors, pin headers, ethernet port and any other metal
components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard
under the PCB antenna should be designed as keepout area.
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The mechanic size of the IPEX connector (MPN: 20579-001E, MHF® 4L Receptacle) provided by the
FC41D is as follows.
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Frequency Requirement
Type Requirement
VSWR <2
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Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.
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NOTE
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4.5. RF Performances
802.11b 1 Mbps 14 16
802.11b 11 Mbps 14 16
802.11g 6 Mbps 13 15
802.11g 54 Mbps 12 14
802.11b 1 Mbps 15
802.11b 11 Mbps 15
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802.11g 6 Mbps 14
802.11g 54 Mbps 13
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD
countermeasures and handling methods is imperative. For example, wear anti-static gloves during the
development, production, assembly and testing of the module; add ESD protection components to the
ESD sensitive interfaces and points in the product design.
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VBAT, GND ±4 ±8 kV
ANT_WIFI/BT ±4 ±8 kV
2 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.
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5 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
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Pin 1
NOTE
The package warpage level of the module conforms to the JEITA ED-7306 standard.
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NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
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NOTE
Images above are for illustration purpose only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel.
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The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.
3. Floor life: 168 hours 3 in a factory where the temperature is 23 ±5 °C and relative humidity is below
60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow
soldering or other high-temperature operations within 168 hours. Otherwise, the module should be
stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
3
This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start
the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to,
or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are
not ready for soldering.
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NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module
to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean
stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the
module is recommended to be 0.15–0.18 mm. For more details, see document [3].
The recommended reflow temperature should be 238–246 ºC, with 246 ºC as the absolute maximum
reflow temperature. To avoid damage to the module caused by repeated heating, it is suggested that the
module should be mounted only after reflow soldering for the other side of PCB has been completed.
The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters
are shown below.
Temp. (°C)
Reflow Zone
Max. slope: Cooling down slope:
1–3 °C/s C -1.5 to -3 °C/s
246
235
217
B D
200
Soak Zone
150 A
100
Max. slope: 1–3 °C/s
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Factor Recommendation
Soak Zone
Reflow Zone
Reflow Cycle
NOTE
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the QR code is still readable, although white rust may be found.
3. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
5. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [3].
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The module adopts carrier tape packaging and details are as follow:
W P T A0 B0 K0 K1 F E
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øD1 øD2 W
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7 Appendix References
Document Name
[1] Quectel_FC41D_TE-B_User_Guide
[2] Quectel_RF_LAYOUT_Application_Note
[3] Quectel_Module_SMT_Application_Note
[4] Quectel_FC41D_AT_Commands_Manual
Abbreviation Description
AP Access Point
GND Ground
HT High Throughput
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I/O Input/Output
RF Radio Frequency
RH Relative Humidity
STA Station
TBD To Be Determined
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