Mainboard Diagram
MIH55T-MV2
1. INTEL® H55 Express Chipset
2. Support INTEL® LGA1156 Processors
3. Supports PCI-Express 2.0
4. Supports Dual Channel DDR3 1333/1066
5. Onboard Gigabit Ethernet LAN
6. Integrated HD Audio CODEC with 6.0 CH
7. Onboard VGA / DVI / HDMI port
8. Ready for Windows® 7
9. M-ATX Form Factor(174mm X 225 mm)
Features and Benefits
Intel® H55 Express Chipset
The Intel® H55 Express Chipset continues to push innovation with a new architecture designed to deliver quality,
performance, and industry-leading I/O technologies on platforms powered by the Intel® Core™ i7-800, Intel®
Core™ i5, and Intel® Core™ i3 processors.
The Intel H55 Express Chipset delivers new technologies and innovative capabilities for digital home, small office,
and home office consumers.
PCI Express 2.0 Buses
The PCI Express 2.0 x16 graphics delivers up to 8 GB/s per direction, 2 times more bandwidth than PCI Express
x16 and up to 16 GB/s concurrent bandwidth. PCI Express x1 I/O offers 1GB/s concurrently, over 7 times more
bandwidth than AGP8X, tackling the most demanding multimedia tasks nowadays
OC-CON high-polymer solid electrolysis aluminum capacitors embedded
The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade, OC_CON
capacitors possess superior physical characteristics that can be while reducing the working temperature between
20 degrees Centigrade each time, intact extension 10 times of effective product operation lives, at not rising
degrees Centigrade of working temperatures each time a relative one
Serial ATA2 3Gb/s
This platform supports reliable storage solution for enhanced data protection and data accessing performance.
Serial ATA 3Gb/s is firstly introduced in this platform to provide blazingly 3Gb/s bus bandwidth thus higher disk
performance. The SATA RAID allows multi-disk designs to be set up as RAID 0, 1,10 based on users’ priority of
protection/performance, and which even makes more accessible by introducing the innovative windows-based
facility
Mainboard Specifications
CPU Support INTEL® LGA1156 Processors
Chipset INTEL® H55 Express Chipset
Memory Dual Channel DDR3 memory technology
2 * 240-pin DDR3 DIMM slots
Supports DDR3 1333/1066 non-ECC ,un-buffered memory
Max.8GB
Expansion 1 * PCI Express x16 slot by 16-lane
Slots
1* PCI Express x1 slots
1 * 32-bit PCI slot
Storage Embedded INTEL H55 Chipset:
4 * Serial ATA2 3Gb/s connectors
Audio 6-Channel HD Audio CODEC
Ethernet LAN Realtek PCI-E Gigabit Ethernet LAN
USB Embedded 8 * USB 2.0
Special Advanced Power Design that supports the latest LGA 1156 Processors
Features
Rear Panel I / 4 * USB 2.0 ports
O
1 * PS/2 keyboard/MS port
1 * RJ-45 ports
1 * Audio I/O ports
1 * VGA Port & 1 * DVI Port & 1 * HDMI(HDMI, VGA and DVI-D ports can only be
enabled when installing Intel CPU with embeded graphics chip.)
Internal I / O 2 * USB 2.0 headers for 4 USB 2.0 ports
CPU / Chassis Fan connectors
1 * 8-pin ATX 12V Power connector
1 * 24-pin ATX Power connector
1 * COM port
1 * AUDIO header
BIOS AMI 32MB SMT Flash ROM
Form Factor M-ATX Form Factor(174mm X 225 mm)
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