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MODULE 4 VLSI

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0% found this document useful (0 votes)
19 views

MODULE 4 VLSI

Uploaded by

lusifer Potter
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Sense amplifier in SRAM

In SRAM, the sense amplifier plays a crucial role in the read operation. Here’s a breakdown of its purpose,
working, and importance:

Purpose of the Sense Amplifier

SRAM cells use a 6-transistor configuration that holds data statically, meaning it retains information as long
as power is applied. However, when the data needs to be read, the sense amplifier comes into play. Its
primary purpose is to detect and amplify the very small voltage difference that appears on the bitlines
during the read operation, making it easier to interpret the stored data as either a logic "1" or "0."

Types of Sense Amplifiers

Several types of sense amplifiers are used depending on the SRAM design and performance needs:

• Current-mode sense amplifiers: Detect differences in current flow between bitlines.


• Voltage-mode sense amplifiers: Respond directly to voltage differences.
• Dynamic sense amplifiers: Consume less power by using clocked operation, enabling them only
during the read phase
RAM (Random Access Memory) ROM (Read Only Memory)
Supports Read & Write operations Supports only Read operations
High Speed Memory Slower than RAM
Used to store temporary information Used to store permanent information
Large size with higher capacity Small size with less capacity
Data can be modified Data cannot be modified
It is a volatile memory It is a non-volatile memory
Higher price Lower price
CPU can access the data stored on it CPU can't access the data directly
Types of RAM: Static & Dynamic RAM Types of ROM: PROM, EPROM, EEPROM
Dynamic Random Access Memory (DRAM) is a type of volatile memory that stores each bit of data in a
separate capacitor within an integrated circuit. DRAM is widely used for main memory in computers and
other devices due to its cost-effectiveness and relatively high storage density.

Leakage Currents:

• The capacitors in DRAM cells are very small, which means they cannot hold a charge indefinitely.
• Over time, charge leaks from the capacitor due to leakage currents caused by imperfections in the
insulation material, as well as various parasitic effects.

Refresh Operation:

• To combat data loss from leakage, DRAM cells require periodic refresh operations.
• During a refresh, the memory controller reads the data stored in each cell and rewrites it to restore
the charge levels in the capacitors.
• Refresh operations are performed every few milliseconds (typically around 64 ms for most modern
DRAM).

Physical Design of DRAM Cells:

• DRAM cells are designed to be as compact as possible to maximize memory density. Each DRAM
cell typically consists of one transistor and one capacitor (a "1T-1C" design).
• To further reduce the cell size, DRAM manufacturers use advanced fabrication techniques, such as
deep trench capacitors and stacked capacitors, to increase capacitance without increasing cell size.

ROM ARRAY

In Read-Only Memory (ROM), data is permanently stored and cannot be easily modified. ROM is often
used for firmware or other low-level programs that need to be reliably available on a device, even after
power is turned off. ROMs use an array of memory cells to store data in a non-volatile way.

Key Concepts in ROM Arrays

1. ROM Array Structure:


o A ROM typically consists of a two-
dimensional array of memory cells,
arranged in rows and columns.
o Each cell represents a bit of data and can
be programmed to either store a "0" or a
"1," depending on the ROM type and
design.
o The memory array is designed such that
data is fixed once programmed and does
not change, allowing for fast, consistent
data retrieval.
2. Types of ROM:
o There are several types of ROM, each with different methods of programming the array:
▪ Mask ROM: The data is hard-coded during the manufacturing process, making it the
most permanent type. This uses a predefined array structure set by the
manufacturer.
▪ PROM (Programmable ROM): Data is written once using a special device, and the
process physically alters the array to create a permanent pattern.
▪ EPROM (Erasable Programmable ROM): This can be erased using UV light and
reprogrammed. It uses an array of floating-gate transistors that can be electrically
charged or discharged.

Fixed Data Storage:

• Unlike RAM, which can be read and written dynamically, ROM is designed for permanent data
storage.
• The data in a ROM array is typically programmed once and remains fixed, providing stable and
reliable access to critical information

NAND and NOR based ROM array

In Read-Only Memory (ROM), data is permanently stored and cannot be easily modified. ROM is often
used for firmware or other low-level programs that need to be reliably available on a device, even after
power is turned off. ROMs use an array of memory cells to store data in a non-volatile way. Both NAND
and NOR-based ROM arrays have their unique characteristics, which make them suitable for different
applications.

1. NAND-Based ROM Array

• Structure: NAND-based ROM arrays are constructed using NAND gates to store data. The structure
of a NAND-based ROM array connects multiple transistors in a series to form a NAND gate.
• Programming: During programming, the presence or absence of a transistor at specific locations in
the array determines the stored data. If a transistor is present, the output will be one value (e.g.,
"0"), and if it’s absent or disconnected, it will represent the opposite value (e.g., "1").
• Read Operation: To read data, a row (or word line) is activated, and the data flows through the
series-connected transistors. The entire row must be correctly biased for the output to produce the
desired logic level based on the stored bit pattern.

Advantages: Disadvantages:

• High density • Slower access


• Cost-effective • Sequential access only

NOR-Based ROM Array

• Structure: NOR-based ROM arrays use NOR gates for data storage. In a NOR ROM array, each cell is
directly connected to both the word line and bit line, which allows for faster access times.
• Programming: The programming is similar to NAND-based ROM, but here each cell represents a
connection or disconnection to form the NOR logic. A cell may store a "0" if a transistor connects
the word line and bit line and a "1" if disconnected (or vice versa, depending on design).
• Read Operation: In NOR ROM, data can be accessed by directly activating a word line, allowing for
parallel data access. This provides a faster response compared to NAND arrays, where data is
accessed serially.

• Advantages: Fast access ,Random access • Disadvantages: Lower density Higher cost

F-N tunneling.

Fowler-Nordheim (F-N) tunneling is a quantum mechanical phenomenon where electrons pass through a
thin insulating barrier due to a high electric field. This process occurs in certain types of semiconductor
devices, particularly in non-volatile memory technologies such as EEPROM (Electrically Erasable
Programmable Read-Only Memory) and flash memory.

Key Characteristics of F-N Tunneling:

1. Mechanism:
o In F-N tunneling, when a strong electric field is applied across a thin insulating layer (usually
an oxide layer in semiconductor devices), electrons gain enough energy to tunnel through
the energy barrier rather than going over it.
o The electric field distorts the energy barrier, making it thin enough for electrons to pass
through via quantum tunneling.
2. Conditions:
o Requires a high electric field, typically in the range of 10^6 to 10^7 V/cm.
o Usually occurs in very thin oxide layers (a few nanometers thick).
3. Applications:
o EEPROM and Flash Memory: F-N tunneling is used to write or erase data by moving
electrons to and from a floating gate, allowing data to be retained even without power.
o MOSFETs and other Semiconductor Devices: It can be a desirable or undesirable effect,
depending on the design, as it can cause gate leakage in some high-performance devices.
Manchester carry chain adder

The Manchester carry chain adder shown in the diagram illustrates a type of adder that efficiently
propagates carry signals through the chain of bits. It uses a combination of logic gates and pass-transistor
logic to improve the speed of carry propagation, especially in comparison to traditional ripple-carry adders.

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