Hardware Engineer's Guide

PCB DESIGN
PCB Design

PCB design transforms electrical schematics into manufacturable circuit boards. Modern
design requires understanding both electrical theory and manufacturing constraints.

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EAGLE AUTODESK INTEGRATION WITH FUSION 360

KICAD OPEN SOURCE FREE, OPEN-SOURCE

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PCB Design

Critical standards governing PCB design:

STANDARD TITLE
IPC-2221 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC-2222 DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

IPC-6012 QUALAND PERF SPEC FOR RIGID PRINTED BOARDS

IPC-A-610 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES

IPC-2226 DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI)

IPC-4101 SPEC FOR BASE MATERIALS FOR RIGID PRINTED BOARDS

IPC-6013 QUAL AND PERF SPEC FOR FLEXIBLE PRINTED BOARDS

IPC-2152 CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN

UL 796 SAFETY FOR PRINTED-WIRING BOARDS

IPC-7351 GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN

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PCB Design

FR-4
A fiberglass-reinforced epoxy laminate, widely used for its balance of cost, mechanical
strength, and thermal resistance (up to ~140°C). It is chemically resistant, easy to
manufacture, and suitable for most applications.

POLYIMIDE
Offers superior flexibility and high-temperature endurance (up to 260°C or more), making it
ideal for flexible circuits and harsh environments. Polyimide has a lower dielectric constant
and excellent chemical resistance but is more expensive.

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PCB Design

1. Schematic Creation Draw the circuit diagram in PCB design software.

2. Placement Place electronic components on the board layout.
3. Routing Connect components with copper traces
4. DRC Run automated checks
5. Gerbers Export files Generation (Gerber, drill, etc.)
6. Production Manufacturing PCB
7. Assembly Pick and Place (PCBA)

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PCB Design

Effective PCB design begins with thorough preparation and analysis.

▪ Net connectivity - Verify all connections are intentional

▪ Power requirements - Identify supply voltages and currents
▪ Signal types - Classify analog, digital, and power nets
▪ Critical paths - Locate timing-sensitive connections

Package considerations for layout:

PACKAGE PITCH LAYOUT DIFFICULTY THERMAL PERFORMANCE
SOIC 1.27MM LOW GOOD
QFP 0.8MM MEDIUM FAIR
BGA 0.5-1.0MM HIGH EXCELLENT
QFN 0.5MM MEDIUM EXCELLENT

▪ Board outline - Define mechanical constraints (DXF)

▪ Layer count - Determine based on routing density
▪ Component groups - Organize by function (power, analog, digital)
▪ Connector placement - Position for system integration

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PCB Design

Physical design parameters directly impact electrical performance.

PCB design uses both imperial and metric units:

PARAMETER IMPERIAL METRIC APPLICATION
DRILL SIZES MILS/INCHES MILLIMETERS VIA AND HOLE SIZING
TRACE WIDTH MILS MICRONS FINE PITCH ROUTING
COMPONENT PITCH MILS MILLIMETERS PACKAGE DIMENSIONS

UNIT DEFINITION RATIO TO OTHER UNITS

MIL 1/1000 INCH (0.001 INCH) 1 MIL = 0.0254 MM = 25.4 µM
MM 1/1000 METER 1 MM = 39.37 MILS
INCH STANDARD IMPERIAL UNIT 1 INCH = 25.4 MM = 1000 MILS
µM 1/1,000,000 METER (0.001 MM) 1 µM = 0.03937 MIL = 0.001 MM

Standard trace specifications:

▪ Outer layers - 0.1mm (4 mil) typical

▪ Inner layers - 0.075mm (3 mil) typical
▪ High current - Calculate based on IPC-2221

▪ Same net - No minimum spacing

▪ Different nets - 0.1mm (4 mil) minimum
▪ High voltage - Per IPC-2221 voltage tables

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PCB Design

Calculate trace width for current carrying capacity:

▪ 𝐴𝑟𝑒𝑎 = (𝐶𝑢𝑟𝑟𝑒𝑛𝑡 / (𝑘 × (𝑇𝑒𝑚𝑝 𝑅𝑖𝑠𝑒)^𝑏))^(1/𝑐)

▪ Where k, b, c are constants based on layer type

▪ Signal traces - 0.1-0.2mm width adequate

▪ Power traces - 0.5-2.0mm typical
▪ High current - Use copper pours or multiple vias

12V, 2A power supply requires 0.8mm trace width for 10°C temperature rise on outer layer.

Determined by PCB manufacturer capabilities, typically 0.2–0.3 mm drill diameter.

Ensure via depth-to-diameter ratio supports reliable plating (commonly ≤ 8:1).

Select via size based on required current (multiple vias for high-current paths).

Avoid placing vias in high-speed signal paths unless necessary, minimize stubs.
CL E A R AN C E :

Maintain adequate spacing between vias and other features to prevent

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PCB Design

Proper component integration ensures reliable manufacturing and assembly.

Pad geometry affects soldering reliability:

▪ SOIC packages - 0.05mm extension beyond lead

▪ QFP packages - 0.1mm extension for fine pitch
▪ BGA packages - Pad diameter 80% of ball diameter

▪ Round - Standard for through-hole

▪ Oval - Wave soldering applications
▪ Rectangle - Surface mount devices
▪ Thermal - Heat dissipation requirements

▪ Standard Via: Drilled through all layers

▪ Micro Via: Very small, laser-drilled
▪ Blind Via: Connects outer layer to one or more inner layers.
▪ Buried Via: Located entirely within inner layers

▪ Signal vias - Minimize length for high-speed signals

▪ Power vias - Multiple vias for current distribution
▪ Thermal vias - Under heat-generating components

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PCB Design

▪ Ground planes - Low impedance return paths

▪ Power distribution - Reduced resistance
▪ EMI shielding - Noise reduction
▪ Thermal management - Heat spreading

▪ Solid fills - Maximum copper coverage

▪ Hatched fills - Reduced copper stress
▪ Thermal relief - Soldering accessibility

COPPER TRACES CONDUCTIVE PATHS

SUBSTRATE THE CORE MATERIAL (LIKE FR-4)
SOLDER MASK PROTECTIVE COATING TO PREVENT SHORTS
SILKSCREEN PRINTED MARKINGS FOR LABELS, REFDES.
COMPONENTS PHYSICAL ELECTRONIC PARTS
TEST POINTS DESIGNATED TESTING SPOTS
MOUNTING HOLES MECHANICALLY SECURING THE PCB

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PCB Design

Design rules ensure manufacturability and electrical performance.

Critical clearances for reliable operation:

▪ Trace to trace - 0.1mm minimum

▪ Via to trace - 0.05mm minimum
▪ Pad to pad - 0.1mm minimum
▪ High voltage - Per safety standards

▪ Board edge - 0.5mm keep-out zone

▪ Mounting holes - 1.0mm clearance
▪ Connectors - Mating clearance required

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PCB Design

Design Rule Check categories:

▪ Connectivity verification
▪ Net class constraints
▪ Power integrity checks

▪ Minimum trace width

▪ Via size verification
▪ Clearance validation

▪ Drill size limitations

▪ Aspect ratio constraints
▪ Solder mask requirements

Define rules for how traces are routed on the PCB, including minimum and maximum trace
widths, controlled impedance requirements, differential pair routing, and maximum trace
lengths. These constraints ensure signal integrity, manufacturability, and compliance with
electrical performance requirements.

Set limitations based on your PCB fabricator’s capabilities, such as minimum drill sizes,
annular ring sizes, copper-to-edge clearances, and stack-up requirements. These rules
ensure the design can be reliably and cost-effectively manufactured, avoiding costly
redesigns and production delays.

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PCB Design

Strategic layout approach determines design success and efficiency.

Systematic placement methodology:

▪ Connectors at board edges

▪ Crystal oscillators near processors
▪ Power regulators for thermal management
▪ High-current components with thermal relief

▪ Analog circuits isolated from digital switching

▪ Power supply components grouped
▪ Decoupling capacitors near power pins
▪ Test points accessible

▪ Minimize trace lengths for high-speed signals

▪ Balance component density
▪ Consider mechanical constraints
▪ Plan for thermal management

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PCB Design

Strategic routing approach:

1. Power and ground - Establish solid references

2. Clock signals - Minimize skew and noise
3. Critical analog - Avoid digital noise coupling
4. High-speed digital - Control impedance and timing
5. General I/O - Fill remaining connections

▪ 45-degree angles - Minimize signal reflection

▪ Constant width - Maintain impedance control
▪ Via minimization - Reduce signal disruption
▪ Layer transitions - Plan for signal integrity
Routing by case:
THEORY ROUTING TECHNIQUE REASON
HIGH SPEED MINIMIZE SHARP CORNERS REDUCES REFLECTIONS & EMI
USE GRADUAL CURVES
CONTROL LENGTH
POWER USE WIDE TRACES ENSURES LOW RESISTANCE
MULTIPLE VIAS
SOLID COPPER PLANES
DIFFERENTIAL ROUTE PARALLEL MAINTAINS SIGNAL INTEGRITY
EQUAL-LENGTH
COUPLED TRACE PAIRS
ANALOG ISOLATE FROM DIGITAL MINIMIZES NOISE
USE GUARD TRACES
AVOID LOOPS
RF SHORT DIRECT PATHS PREVENTS REFLECTION & LOSS
CONTROLLED IMPEDANCE
AVOID STUBS (ANTENNA)

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PCB Design

Effective layer utilization:

▪ Component side for horizontal routing

▪ Solder side for vertical routing
▪ Ground plane sections where possible

▪ Layer 1: Component placement and routing

▪ Layer 2: Ground plane
▪ Layer 3: Power plane
▪ Layer 4: Routing and components

▪ Dedicated signal layers

▪ Multiple power planes
▪ Controlled impedance requirements
▪ High-speed signal isolation

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PCB Design

Most common thickness 1.57mm for 2-layer and some mid-layer counts.
Multilayer builds often range from 2.36–4.75 mm but can be customized

More layers increase overall thickness and complexity.

Internal dielectric thickness (core/prepreg) must meet minimums for reliability and
manufacturability. IPC-6012 requires ~2.5mil for class 3 (recommended 3-4mil)

Odd-numbered layer counts (e.g., 9, 11) are possible but less common due to
manufacturing and lamination constraints.
Even-numbered layers are standard for symmetry, cost, and reliability.

Components can be placed on both sides (top and bottom).

Some high-density designs use micro-vias and buried/blind vias for inter-layer routing.

▪ Increased risk of registration errors between layers.

▪ Thermal management and warping become more critical.
▪ Signal integrity challenges (crosstalk, impedance control).
▪ Higher manufacturing cost and longer lead times.
▪ Complex stack-up management and increased risk of delamination.

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PCB Design

Essential manufacturing layers:

▪ Signal & power distribution

▪ Controlled impedance
▪ Current carrying capacity

▪ Many colors available

▪ 0.1mm minimum feature size
▪ Reg. tolerance ±0.075mm

▪ RefDes and values

▪ Polarity markings and pin 1
▪ Assembly instructions
▪ Company logos (revision)

▪ Through-hole specifications
▪ Via definitions
▪ Slot and cutout requirements

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PCB Design

Design for assembly guidelines:

▪ Consistent polarized component alignment

▪ IC pin 1 indicators clearly marked
▪ Similar components in same orientation

▪ Each component with its own RefDes (when possible)

▪ Minimum 50mil to be seen
▪ Avoid silk beneath components placement

▪ Minimum 3 fiducials for automated assembly

▪ 1mm diameter copper circles
▪ Clear of solder mask
▪ Positioned for maximum accuracy

▪ 1.27mm minimum spacing

▪ 0.5mm minimum diameter
▪ Accessible from single side preferred

▪ Try to avoid over 70% occupancy

▪ High density design (mobile) increase the risks such as thermal and integrity
▪ Assembly access becomes challenging in HDI design

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PCB Design

Built-in test capabilities:

▪ Test point accessibility

▪ Fixture probe clearances
▪ Component value verification

▪ JTAG connectivity for digital circuits

▪ Test access port implementation
▪ Scan chain continuity

▪ Power supply verification

▪ Signal integrity checks
▪ Performance validation

▪ Component placement accuracy

▪ Solder joint quality inspection
▪ Polarity and orientation verification

▪ Extended operation under stress conditions

▪ Early failure detection
▪ Reliability assessment under load

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PCB Design

Critical parameters for high-frequency design:

▪ Controlled impedance (50Ω single-ended, 100Ω differential)

▪ Trace length matching for clock distributions
▪ Via stub elimination for frequencies >1GHz
▪ Ground plane continuity for return paths

▪ Differential pair routing for high-speed data

▪ Guard traces for sensitive analog signals
▪ Termination networks for signal quality
▪ Power supply decoupling strategies

DDR4 memory interface requires matched trace lengths within 0.1mm and controlled 100Ω
differential impedance for data signals.

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PCB Design

Robust power delivery systems:

▪ Minimum 0.5oz copper weight for power planes

▪ Multiple via connections for current distribution
▪ Decoupling capacitor placement optimization
▪ Thermal management integration

▪ High-frequency ceramics (0.1µF) at each IC

▪ Medium-frequency tantalums (10µF) per circuit section
▪ Low-frequency electrolytics (100µF+) at power input
▪ ESR and ESL considerations for effectiveness

▪ Maximum 35A/mm² for external copper layers

▪ Maximum 17.5A/mm² for internal copper layers
▪ Thermal rise calculations per IPC-2221
▪ Hot spot identification and mitigation

▪ Voltage regulator selection for stability and efficiency

▪ Distributed regulation for localized supply needs
▪ Feedback loop compensation for transient response
▪ Load regulation and line regulation specifications

▪ Solid ground planes for low impedance returns

▪ Minimized ground loops for noise reduction
▪ Ground stitching vias for multi-layer continuity
▪ Segregation of analog and digital ground domains

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PCB Design

Signal integrity ensures reliable data transmission in high-speed digital circuits.

▪ Characteristic impedance - Z₀ = √(L/C)

▪ Propagation delay - Critical for timing analysis
▪ Rise time effects - Signals behave as transmission lines when trace length > λ/10

▪ Single-ended 50Ω ±10% General digital

▪ Differential 100Ω ±10% High-speed data
▪ Coaxial 75Ω ±5% Video signals
▪ LVDS 100Ω ±5% Display interfaces

▪ Capacitive coupling - Dominant in high-impedance circuits

▪ Inductive coupling - Significant in high-current switching
▪ Common impedance - Shared return paths

▪ Increased spacing (3W rule minimum)

▪ Orthogonal routing between layers
▪ Differential signaling for critical nets

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PCB Design

▪ Unbroken reference planes for high-speed signals

▪ Via stitching across plane splits
▪ Minimum 0.1mm via spacing for effective stitching

▪ Reference plane changes require return vias

▪ Via placement within 200 mils of signal via
▪ Shortest possible via stubs

▪ Multiple capacitor values for broadband filtering

▪ Placement within 5mm of power pins
▪ Low ESL capacitors for high-frequency performance

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PCB Design

Effective thermal design prevents component failure and ensures reliable operation.

▪ Rth = ΔT / P (°C/W)
▪ Junction-to-ambient path analysis
▪ Multiple heat transfer paths in parallel

▪ Conduction High PCB copper Thermal vias, pours

▪ Convection Medium Air-Cooling Component spacing
▪ Radiation Low High temperature Surface emissivity

▪ Thermal resistance per via - Rth = 70°C/W typical

▪ Via spacing - 1.2mm maximum for effective heat spreading
▪ Fill options - Solid copper, thermal epoxy, or air-filled

▪ Drill diameter - 0.2-0.3mm standard

▪ Plating thickness - 25μm minimum
▪ Aspect ratio - <6:1 for reliable plating

Power dissipation 5W (20°C rise) - Needs minimum 14 thermal vias of 0.2mm under IC.

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PCB Design

▪ Solid copper pours under high-power components

▪ Thermal spoke connections to maintain solderability
▪ Multi-layer thermal vias for vertical heat transfer

▪ Low-power digital 0.5oz (17μm) Basic heat spreading

▪ Power management 1.0oz (35μm) Standard thermal design
▪ High-power analog 2.0oz (70μm) Enhanced heat dissipation
▪ Power electronics 3.0oz+ (105μm+) Maximum thermal capacity

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PCB Design

Contemporary digital interfaces require specific design considerations.

▪ Differential impedance - 90Ω ±15%

▪ Trace length matching - ±0.1mm
▪ Maximum trace length - 1500mm
▪ Common mode choke placement

▪ SuperSpeed differential pairs - 90Ω ±7Ω

▪ Tighter length matching - ±50μm
▪ Via minimization in signal path
▪ Enhanced shielding requirements

▪ USB 2.0 : 480 Mbps ±0.1mm EMI filtering

▪ USB 3.0 : 5 Gbps ±50μm Separate SS pairs
▪ USB 3.1 : 10 Gbps ±25μm Advanced SI analysis
▪ USB4.0 : 40 Gbps ±12μm Strict via control

▪ Differential impedance - 85Ω ±7Ω

▪ Intra-pair skew - <5ps (0.8mm)
▪ Inter-pair skew - <100ps (15mm)
▪ Reference clock requirements

▪ Via stub elimination above 8GHz

▪ Continuous reference planes
▪ AC coupling capacitor placement
▪ Spread spectrum clock compatibility

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PCB Design

▪ Differential impedance - 100Ω ±10%

▪ All four pairs length matched within 50mm
▪ Minimum bend radius - 2× trace width
• Magnetic isolation requirements

• Tighter impedance control - 100Ω ±5%

• Enhanced crosstalk management
• Backplane loss budgeting
• Advanced equalization support

▪ Single-ended impedance: 40–60Ω ±10%

▪ Differential clock pairs: 100Ω ±7Ω
▪ Data groups: ±5 mils (0.127mm)
▪ Address/ctrl to clock: ±25 mils (0.635mm)

▪ Strict reference planes: Continuous GND under data groups

▪ Via count limitation: ≤2 vias per net
▪ On-die termination (ODT) tuning
▪ <30mV noise on VDDQ
▪ Dedicated power islands for VPP/VDDQ

PROTOCOL SPEED[MBPS] KEY CONSTRAINT CRITICAL FOCUS

DDR3 800–2133 LENGTH SKEW < 50 MILS T-BRANCH TOPOLOGY

DDR4 1600–3200 DATA STROBE ±10PS CA/CS FLY-BY

DDR5 3200–6400 DQ/DQS ±0.5PS FEEDBACK EQUAL

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PCB Design

▪ Polyimide base - Standard flexibility

▪ LCP (Liquid Crystal Polymer) - High-frequency applications

Thickness considerations:
LAYER COUNT THICKNESS BEND RADIUS
1-LAYER 0.05-0.1MM 5× THICKNESS
2-LAYER 0.1-0.2MM 10× THICKNESS
4-LAYER 0.2-0.4MM 15× THICKNESS
6+ LAYER 0.4MM +20× THICKNESS

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PCB Design

▪ Minimum bend radius - 6× total thickness

▪ Stress relief design - Teardrop transitions
▪ Conductor routing - Perpendicular to bend axis

▪ One-time installation bending

▪ Minimum radius - 3× total thickness
▪ Stiffener placement for support

▪ Layer transitions in rigid sections only

▪ Via placement restrictions in flex zones
▪ Controlled impedance through transitions

▪ Minimum rigid section - 6mm width

▪ Flex section entry angle - <45°
▪ Stiffener overlap requirements - 1mm minimum

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PCB Design

Different component types require specialized layout considerations.

▪ Micro vias for high-density BGAs

▪ Via filling requirements for assembly
▪ Pad size reduction considerations

BGA PITCH VIA SIZE ESCAPE REQ. LAYERS

1.0MM 0.1MM DIRECT ESCAPE 2 LAYERS
0.8MM 0.1MM VIA-IN-PAD 4 LAYERS
0.5MM 0.08MM MICRO VIA ONLY 6+ LAYERS
0.4MM 0.08MM HDI TECHNOLOGY 8+ LAYERS

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PCB Design

▪ Ground guard ring around crystal

▪ Minimum trace length to IC pins
▪ Load capacitor placement - <5mm from crystal
▪ Keep-out zones for switching signals

▪ Low frequency (<10MHz) - Standard layout rules

▪ Medium frequency (10-100MHz) - Guard rings essential
▪ High frequency (>100MHz) - Dedicated ground plane

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PCB Design

1. Input and output capacitors closest to switching IC

2. Inductor placement for minimal loop area
3. Feedback network routing away from switching nodes
4. Thermal management for switching components

▪ Minimize switching loop area

▪ Separate analog and power grounds
▪ Star ground connection point
▪ Input/output filtering isolation

Buck converter requires <25mm² switching loop area for acceptable EMI performance at
1MHz switching frequency.

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PCB Design

▪ Controlled impedance through connector

▪ Via placement for signal transitions
▪ Ground plane continuity
▪ EMI shielding considerations

▪ Current density calculations

▪ Multiple pin paralleling
▪ Thermal management integration
▪ Contact resistance minimization

▪ Stress relief design

▪ Board edge reinforcement
▪ Connector keep-out zones
▪ Assembly accessibility requirements

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PCB Design

▪ [ ] DRC passes with zero violations

▪ [ ] Netlist verification against schematic
▪ [ ] Component placement review for assembly
▪ [ ] Thermal analysis for power dissipation
▪ [ ] Signal integrity simulation for critical nets
▪ [ ] Mechanical fit verification with enclosure
▪ [ ] Manufacturing file generation and review

▪ Gerber files
▪ Excellon drill files
▪ Pick and place files
▪ Bill of materials with manufacturer part numbers
▪ Assembly drawings with component orientations
▪ Fabrication notes with special requirements

▪ First-pass manufacturing yield >95%

▪ Assembly time optimization
▪ Test coverage maximization
▪ Field failure rate minimization

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PCB Design

Panelization combines multiple PCBs into a single manufacturing panel to optimize

production efficiency, reduce costs, and improve handling during assembly processes.

Panelization is the process of arranging multiple PCB copies on a single production panel for
efficient manufacturing and assembly. This technique maximizes material utilization while
maintaining manufacturability.

▪ Cost reduction - Shared setup costs across multiple units

▪ Manufacturing efficiency - Batch processing advantages
▪ Handling improvement - larger panels easier to process
▪ Yield optimization - better material utilization ratios

PANEL SIZE DIMENSIONS TYPICAL APPLICATION

SMALL 50MM × 80MM PROTOTYPE RUNS
MEDIUM 100MM × 80MM PRODUCTION BATCHES
STANDARD 100MM × 160MM HIGH-VOLUME MANUFACTURING
LARGE 160MM × 100MM INDUSTRIAL APPLICATIONS

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PCB Design

Strategic arrangement maximizes panel utilization:

Single Design Arrays:
▪ 1×2 arrangement - Simple doubling for small boards
▪ 2×2 configuration - Standard four-up panelization
▪ 3×3 layout - Nine-up for very small designs
▪ Custom arrays - Optimized for specific board dimensions

▪ Product family grouping - Related designs together

▪ Complementary sizing - Different boards filling panel space
▪ Test board inclusion - Quality control samples integrated

Critical clearances between boards:

▪ Minimum separation - 2.0mm between board edges
▪ Routing channels - 3.0mm for mechanical separation
▪ V-groove spacing - 0.5mm additional for scoring depth
▪ Tab connections - 1.5-3.0mm width depending on board thickness

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PCB Design

Most cost-effective separation method:

Design Requirements:
▪ Straight line separation
▪ Optimal Board thickness - 0.8-3.2mm
▪ Minimum score depth - 1/3 of board thickness
▪ Edge distance - Minimum 0.5mm from components
Advantages and Limitations:
▪ Pros - Low cost, clean separation, high-speed process
▪ Cons - Straight lines only, board stress during separation

Flexible separation using small connecting tabs:

Tab Design Parameters:
▪ Tab width - 1.5-3.0mm typical
▪ Tab thickness - Full board thickness maintained
▪ Tab quantity - 3-6 tabs per board perimeter
▪ Tab placement - Avoid component areas and stress points
Tab Positioning Guidelines:
▪ Corner placement - Maximum structural support
▪ Edge centering - Balanced stress distribution
▪ Component avoidance - Minimum 2.0mm clearance
▪ Stress relief - Rounded tab connections preferred

Alternative tab method using small drill holes:

▪ Hole diameter - 0.5mm typical
▪ Hole spacing - 0.5-1.0mm on centers
▪ Perforation length - 2-4mm typical
▪ Break strength - Easily separated by hand

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PCB Design

Special considerations for flexible circuits:

▪ Stiffener coordination - Support during assembly
▪ Bend relief integration - Stress management in panels
▪ Separation planning - Avoid damage to flex sections
▪ Handling fixtures - Custom tooling requirements

High Density Interconnect considerations:

▪ Micro-via alignment - Registration across panel
▪ Sequential lamination - Process step coordination
▪ Yield optimization - Defect isolation strategies
▪ Test accessibility - Probing considerations for dense designs

Combining different board types:

▪ Thickness matching - Assembly line compatibility
▪ Material compatibility - Thermal expansion coordination
▪ Process optimization - Shared manufacturing steps
▪ Quality segregation - Different test requirements

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PCB Design

SATURN PCB TOOLKIT

https://saturnpcb.com/saturn-pcb-toolkit/
Comprehensive freeware resource for PCB-related calculations including current capacity
of traces, via current, differential pairs and much more.
JLCPCB IMPEDANCE CALCULATOR

https://jlcpcb.com/pcb-impedance-calculator
Computes track width values and recommended stack-ups from user-input values of board
layer, thickness, copper weight, target impedance, trace spacing, and impedance trace to
copper gap.
PCBWAY IMPEDANCE CALCULATOR

https://www.pcbway.com/pcb_prototype/impedance_calculator.html
Calculate the approximate impedance of your PCB / high frequency circuit board
PCBWAY TRACE WIDTH CALCULATOR

https://www.pcbway.com/pcb_prototype/trace-width-calculator.html
Based on formulas from IPC-2221, estimates the width of copper PCB boards and traces
required under given current while maintaining temperature rise limits.
SIERRA CIRCUITS PCB TOOLS SUITE

https://www.protoexpress.com/tools/
Comprehensive suite including impedance calculator using 2D numerical solution of
Maxwell's equations, via calculators, power distribution analyzers, and signal integrity tools.
ADVANCEDPCB TRACE WIDTH CALCULATOR

https://www.advancedpcb.com/en-us/tools/trace-width-calculator/
Find the ideal trace width for PCB designs, ensuring optimal performance and reliability in
circuit boards.

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PCB Design

Professional PCB design integrates electrical engineering principles with manufacturing

realities. Success requires systematic approach from schematic analysis through
manufacturing handoff.

▪ Thorough preparation and component selection

▪ Strategic layer planning and routing
▪ Manufacturing constraint consideration
▪ Comprehensive design verification
▪ Clear documentation and communication

▪ Design review feedback incorporation

▪ Manufacturing yield optimization
▪ Assembly process refinement
▪ Field performance monitoring

▪ Apply these techniques to actual projects

▪ Develop design rule libraries for common applications
▪ Build relationships with manufacturing partners
▪ Stay current with evolving technologies and standards

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