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Skill Development Program

The document outlines a Skill Development Program focused on Altium Designer at the SUPARCO Institute of Technical Training, covering key learning objectives such as schematic and PCB library management, multilayer PCB design, and various PCB design tools. It details the components of PCBs, design flow, physical design issues, and different PCB technologies including Thru-Hole and Surface Mount Technology. Additionally, it lists available CAD tools and types of PCBs, emphasizing the importance of simulation and component placement in effective PCB design.

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13 views41 pages

Skill Development Program

The document outlines a Skill Development Program focused on Altium Designer at the SUPARCO Institute of Technical Training, covering key learning objectives such as schematic and PCB library management, multilayer PCB design, and various PCB design tools. It details the components of PCBs, design flow, physical design issues, and different PCB technologies including Thru-Hole and Surface Mount Technology. Additionally, it lists available CAD tools and types of PCBs, emphasizing the importance of simulation and component placement in effective PCB design.

Uploaded by

simonhaidenpd
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd
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Skill Development Program

ALTIUM DESINGER
SUPARCO Institute Of Technical Training
Learning Objectives
 Altium Designer summer 09 Environment
 Library Management ( Schematic Library and PCB
Library and Integration of Customized Library)
 Schematic Designing (Flat Sheet Design and
Hierarchal Design)
 Layout tools of Altium (PCB Designing )
 Multilayer PCB Design
Course Outline
 PCB Designing Tools
 Types of PCB
 Component Packages
 Altium Designer Summer 2009
 Environment
 Library
 Creating Schematic Library
 Schematic Designing
 Layout Designing
PCB Design & Fabrication Concepts

(Using Altium Designer Summer 09)


What is PCB
 Printed Circuit Board
 Electronic Board that connects circuit components
 PCB populated with electronic components is a Printed
Circuit Assembly (PCA)
 PCBs are rugged, inexpensive, and can be highly reliable
 Mass Manufacturing
 Professional
 Simplified Circuitry
Final PCB Assembled
PCB Design Flow Chart
Parts of PCBs
 Components
 Pads
 Traces
 Via
 Routing Layers
 Component/Placement Layers
 Silk-Screen
 Solder Layer
 Paste Layer
 Fudicials/Mounting Holes
Components

 Components are the actual devices used in a


circuit.
 This includes input/output connections.
 I/O Ports, including Power Supply connections, are
also important in the PCB Design.
Pads

 Refers to the location where components connect


to.
 You will solder components to the pads on the PCB.
 Pads will connect to traces.
 Pads have an inner diameter and outer diameter.
 Can be either drilled or mounted.
Traces
 Traces connect pads together.
 Traces are essentially the wiring of the PCB.
 Equivalent to wire for conducting signals
 Traces sometimes connect to vias.
 High current traces should be wide.
 Signal traces usually narrower than power or
ground traces
Vias
 Basically are Pads having lesser dia. than Pads.
 Plated Hole connecting traces from one layer of
board to other layers.
 Try to minimize via placement in PCBs.
 Some component leads can be used as Vias.
Top Layer
 Most of the components reside
on the top layer
 Fewer traces on the top layer
 Components are soldered to the
pads on the top layer of PCB
 Higher circuit densities
Bottom Layer
 Few components on this layer.
 Many traces on this layer.
 Most soldering done on this layer.
Jumpers

 Often, many signal wires need to exist in too small


of a space and must overlap.
 Running traces on different PCB layers is an option.
 Multilayer PCBs are often expensive.
 Solution: use Jumpers
Solder Mask
 Protects copper traces on outer layers from corrosion.
 Areas that shouldn't be soldered may be covered with
polymer resist solder mask coating.
 Designed to keep solder only in certain areas.
 Prevents solder from binding between conductors and
thereby creating short circuits.
Silkscreen
 Printing on the solder mask to designate component
locations.
 Read-able information about component part numbers
and placement.
 Helpful in assembling, testing and servicing the circuit
board.
Multilayer PCBs
 Contains more then two layer.
 Typically there will be a power plane, ground plane, top
layer, and bottom layer.
 Sometimes signal layers are added as needed.
 Sometimes RF planes made of expensive materials are
added.
Physical Design Issues

 Component Size
 Heat Dissipation
 Input and Output
 Mounting Points
Component Size
 Make sure components will actually fit.
 This especially applies for circuits that require high
component densities.
 Some components come in multiple sizes. SMT vs.
Through Hole
 Sometimes you can get tall and narrow caps or short and
wide capacitors.
Heat Dissipation-Heat Sinks
 Heat sink dissipates heat off the component
 Doesn’t eliminate the heat, just absorbs it from the circuit.
 Some components may get extremely heated.
 Make sure you get a large enough heat sink.
 Data sheets specify the size of the heat sink
 A short circuit may result when two devices share the same
heat sink
Mounting Points
 The PCB needs to be mechanically secured to something.
 Could be a chassis-consisting of metal frame on which the
circuit boards and other electronic components are
mounted.
 Could be another PCB/Socket on PCB.
 Could be attachments to a heat sink.
Pre-Work
 Thoroughly simulate your circuit-Make sure the circuit
worked in simulation trials.
 Thoroughly test the Prototype-Make sure the circuit
worked on bread board.
 Have all the data sheets handy for every components.
 Play around with the placement of components.
Simulations
 Important to simulate the circuits before designing hem.
 Allow margin for component tolerances
 Avoid using precise component ratings. e.g. a PWM
controller that requires exact 10 V DC to work thereby, it
will fail to work if there’s 10.01V.
 High performance circuits or SMT Devices require PCBs
and should be simulated extensively first.
PCB Technology
 Cordwood Structure
 Multi-Wire Boards
 Thru-Hole Technology
 Surface Mount Technology
PCB Technology :
Cordwood Structure
 Cordwood construction can save significant space and was
often used with wire-ended components in applications
where space was at a premium (such as Missile Guidance
and Telemetry Systems) and in High-Speed Computers,
where short traces were important. In "cordwood"
construction, axial-leaded components were mounted
between two parallel planes
PCB Technology :
Multi-Wire Boards
 Multi-Wire is a patented
technique of interconnection
which uses machine-routed
insulated wires embedded in a
non-conducting matrix (plastic
resin). It was used during the
1980s and 1990s. (Kollmorgen
Technologies Corp, U.S.
Patent filed, 1978) Multi-Wire is
still available in 2010 through
Hitachi.
PCB Technology :
Thru-Hole PCB
 Through Hole Technology is a method
for constructing electronic circuits in
which the pin-through hole (PTH)
components are inserted through
holes drilled into printed circuit
boards (PCBs). The ends, or leads,
are then affixed to pads on the
opposite side with molten metal
solder using wave soldering or reflow
soldering equipment. This process is
also called “Through Hole Assembly”.
PCB Technology :
Thru-Hole PCB
PCB Technology :
Surface Mount Technology
 Surface-Mount Technology emerged in the 1960s, gained
momentum in the early 1980s and became widely used by the
mid of 1990s. Components were mechanically redesigned to have
small metal tabs or end caps that could be soldered directly on to
the PCB surface, instead of wire leads to pass them through holes.
Size of Components became much smaller and it’s placement on
both sides of the board became more common allowing smaller
PCB assemblies with higher circuit densities.
Available CAD Tools
 CAD (Computer Aided Drawing) and EDA Electronic
Development Automation has taken over the control and
took the technology to top notch position.

Available Most Advanced Tools:


 Allegro
 Altium Designer
 PADs
 P-CAD
 Fritzing (Open Source)
 Eagle PCB (Open Source)
 ARIES (PROTEUS)
Types of PCBs
 Single Side Board
 Double Side Board
 Multilayer Board
 Flex PCB
 Rigid Flex PCB
Single Sided Board
 Components on one side and patterns on other side.
 Routing is very difficult.
Double Sided Board
 A PCB having routing and component Placement on Both
Sides is know as Double Sided PCB.
Contd..
 Electrical connections between the two layers Via i.e. hole
in the PCB, is plated with metal which touches the
conductor pattern on both sides.
Contd..
 Since routing is on both sides, double sided boards are
more suitable for complex circuits than single-sided ones.
 It is always better to minimize the number of “VIA”.
Multi-Layer Boards
 These boards have one or more conductor pattern inside
the board.
 Several Double-Sided Boards are glued together with
insulating layers in between.
Contd..
 For Inter-Layer Connections:
 Blind Via: Connects an Inner layer to Outer Layer. (where
traces are made)
 Buried Via: Connects 2 Inner Layers
Contd..
 The inner layers are classified as:
1.Signal Layer
2.Ground Plane(s)
3.Power Plane(s)
 Power planes may have special restriction such as:
1.Wider Track Width
2. Conduction Width
3. Plane Clearance
Multi-Layer Boards

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