TSCDB01120G2H
Taiwan Semiconductor
1A, 1200V SiC Merged PIN Schottky Diode
FEATURES KEY PARAMETERS
● AEC-Q101 qualified PARAMETER VALUE UNIT
● Max junction temperature 175°C
IF 1 A
● Minimum creepage distance 2.6 mm guaranteed by design
● High-speed switching possible VRRM 1200 V
● High forward surge capability IFSM 16 A
● High-frequency operation
TJ MAX 175 °C
● Positive temperature coefficient on VF
● Moisture sensitivity level: level 1, per J-STD-020 Package DO-214AA (SMB)
● RoHS compliant Configuration Single die
● Halogen-free
APPLICATIONS
● General purpose
● Switch mode power supplies
● Power factor correction
MECHANICAL DATA
● Case: DO-214AA (SMB)
● Molding compound meets UL 94V-0 flammability rating
● Terminal: Matte tin plated leads, solderable per J-STD-002 DO-214AA (SMB)
● Meet JESD 201 class 2 whisker test
● Polarity: Indicated by cathode band
● Weight: 0.09g (approximately)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER SYMBOL VALUE UNIT
Repetitive peak reverse voltage VRRM 1200 V
Reverse voltage, total rms value VR(RMS) 840 V
Forward Current IF 1 A
TC=25°C, tp=10μs 256 A
Surge non-repetitive forward current,
TC=25°C, tp=10ms IFSM 16 A
sine halfwave
TC=150°C, tp=10ms 15 A
Junction temperature TJ -55 to +175 °C
Storage temperature TSTG -55 to +175 °C
1 Version: B2507
TSCDB01120G2H
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER SYMBOL TYP MAX UNIT
Junction-to-lead thermal resistance RӨJL 10.3 12.4 °C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER CONDITIONS SYMBOL TYP MAX UNIT
IF = 0.5A, TJ = 25°C 1.15 - V
IF = 1.0A, TJ = 25°C 1.36 1.50 V
IF = 0.5A, TJ = 150°C 1.29 - V
Forward voltage(1) VF
IF = 1.0A, TJ = 150°C 1.79 2.10 V
IF = 0.5A, TJ = 175°C 1.35 - V
IF = 1.0A, TJ = 175°C 1.94 - V
TJ = 25°C - 3 µA
Reverse current @ rated VR(2) IR
TJ = 175°C - 6 µA
f = 1MHz, VR = 1V 85 - pF
Junction capacitance f = 1MHz, VR = 400V CJ 3.5 - pF
f = 1MHz, VR = 800V 2.0 - pF
Capacitive Charge VR = 800V QC 4.3 - nC
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE PACKAGE PACKING
TSCDB01120G2H DO-214AA (SMB) 3,000 / Tape & Reel
2 Version: B2507
TSCDB01120G2H
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Typical Forward Characteristics Fig.2 Typical Reverse Characteristics
2 1
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
TJ=25°C
TJ=175°C
TJ=-55°C TJ=150°C
0.1
TJ=125°C
(A)
1
TJ=150°C
0.01 TJ=125°
TJ=175°C
Pulse width 300μs
1% duty cycle TJ=25°C
0 0.001
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 10 20 30 40 50 60 70 80 90 100
FORWARD VOLTAGE (V) PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig.3 Peak forward current versus case temperature Fig.4 Typical Junction Capacitance
10 120
f=1.0MHz
100 Vsig=50mVp-p
PEAK FORWARD CURRENT (A)
8 D = 0.1
CAPACITANCE (pF)
D = 0.2 D = 0.3 80
6
D = 0.5 60
4
40
2
D=1 20
D = 0.7
0 0
25 50 75 100 125 150 175 0.1 1 10 100 1000 10000
CASE TEMPERATURE (°C) REVERSE VOLTAGE (V)
Fig.5 Typical Capacitive Charge Fig.6 Typical Capacitance Stored Energy
6 2
5
CAPACITIVE CHARGE (nC)
CAPACITIVE ENERGY (μJ)
3 1
0 0
0 200 400 600 800 1000 1200 0 200 400 600 800 1000 1200
REVERSE VOLTAGE (V) REVERSE VOLTAGE (V)
3 Version: B2507
TSCDB01120G2H
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.7 Typical Transient Thermal Characteristics
100
TRANSIENT THERMAL IMPEDANCE (°C/W)
10
0.1
0.01
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
PULSE DURATION (s)
4 Version: B2507
TSCDB01120G2H
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
01120G2
GYWF
G = Green compound
YW = Date code
F = Factory code
5 Version: B2507
TSCDB01120G2H
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6 Version: B2507
